公开(公告)号：US20230051475A1

公开(公告)日：2023-02-16

申请号：US17451742

申请日：2021-10-21

Applicant: Lumentum Operations LLC

Inventor： Mikhail DOLGANOV ,  Lijun ZHU ,  Sean BURNS ,  Yuanzhen ZHUANG

IPC: H01S5/042 ,  H01S5/026 ,  H01S5/183

Abstract: A driver circuit may include an optical emitter, a capacitive element, and an inductive element. The driver circuit may include a first switch that, in a closed state, is to cause charging of the inductive element, and when transitioning from the closed state to an open state is to cause discharging of the inductive element to charge the capacitive element. The driver circuit may include a second switch that in a closed state is to cause discharging of the capacitive element to provide an electrical pulse to the optical emitter. The driver circuit may include a signal generator configured to generate a first signal for controlling the open state and the closed state of the first switch, and a pulse shortening element configured to shorten a pulse width of the first signal to generate a second signal for controlling the open state and the closed state of the second switch.

公开(公告)号：US20220385033A1

公开(公告)日：2022-12-01

申请号：US17445786

申请日：2021-08-24

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Hao HUANG ,  Siu Kwan CHEUNG ,  Huanlin ZHU ,  Lijun ZHU

IPC: H01S5/024 ,  H01L23/373 ,  H01L23/498 ,  H01S5/02315

Abstract: A substrate may include a thermally conductive metal core having a top side and a bottom side, a first dielectric coating on the top side of the metal core, a second dielectric coating on the bottom side of the metal core, a first metal circuit layer formed above the first dielectric coating, and a second metal circuit layer formed under the second dielectric coating. In some implementations, the first dielectric coating and the second dielectric coating have thicknesses below sixty micrometers and respective thermal resistances under fifteen degrees Celsius per watt. In some implementations, one or more electrical currents flowing vertically across a dielectric coating have a low parasitic inductance based on the thickness of the dielectric coating, and the metal core may dissipate heat flowing across the dielectric coating and into the metal core.

公开(公告)号：US20220359450A1

公开(公告)日：2022-11-10

申请号：US17814004

申请日：2022-07-21

Applicant: Lumentum Operations LLC

Inventor： Zhengwei SHI ,  Lijun ZHU ,  Jihua DU

IPC: H01L23/00 ,  B29C35/08

Abstract: A die attachment material may include an ultra-violet (UV) curable resin and silver particles to attach a chip to a submount, where the silver particles are positioned within the UV curable resin. A method may include heating the die attachment material to obtain the UV curable resin on sintered silver particles, where at least a portion of the die attachment material is position between a chip and a submount. The method may further include irradiating, with UV light, the UV curable resin to obtain a polymer on the sintered silver particles. The polymer may form a layer on the sintered silver particles.

公开(公告)号：US20220059983A1

公开(公告)日：2022-02-24

申请号：US17301324

申请日：2021-03-31

Applicant: Lumentum Operations LLC

Inventor： Mikhail DOLGANOV ,  Hao HUANG ,  Lijun ZHU

IPC: H01S5/026 ,  H01S5/042 ,  H01S5/42

Abstract: A charged inductive laser driver may be configured to provide a pre-emphasized current to a first laser load and a second laser load, wherein the pre-emphasized current is configured to achieve a square pulse as a combined output of the first laser load and the second laser load.

公开(公告)号：US20210296855A1

公开(公告)日：2021-09-23

申请号：US16912338

申请日：2020-06-25

Applicant: Lumentum Operations LLC

Inventor： Hao HUANG ,  Mikhail DOLGANOV ,  Lijun ZHU

IPC: H01S5/042 ,  G01S7/484 ,  G01S17/10 ,  H01S3/11

Abstract: An electrical drive circuit may charge one or more inductive elements, where the electrical drive circuit includes the one or more inductive elements and a capacitive element in series between the one or more inductive elements and the optical load, and where the electrical drive circuit is connected to one or more sources. The electrical drive circuit may generate, after the charging and for a first time interval, a main electrical pulse. The electrical drive circuit may discharge, after the charging and for a second time interval, the one or more inductive elements to provide a compensation electrical pulse, where at least a portion of the second time interval overlaps with the first time interval. The electrical drive circuit may combine the main electrical pulse and the compensation electrical pulse into a combined electrical pulse. The electrical drive circuit may provide the combined electrical pulse to the optical load.

公开(公告)号：US20240195151A1

公开(公告)日：2024-06-13

申请号：US18194133

申请日：2023-03-31

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Joseph LEIGH ,  Suhit Ranjan DAS ,  Huanlin ZHU ,  Raman SRINIVASAN ,  Gianluca BACCHIN ,  Yuefa LI ,  Jacob U. LOPEZ RUVALCABA ,  Lijun ZHU ,  Qianhuan YU

IPC: H01S5/42 ,  H01S5/0234 ,  H01S5/0237

CPC classification number: H01S5/423 ,  H01S5/0234 ,  H01S5/0237

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs. The emitter assembly may include a plurality of conductive pillars electrically connected to the VCSEL chip. The emitter assembly may include a dummy pillar, electrically isolated from the VCSEL chip, mating with a slot. The VCSEL chip may include one of the dummy pillar or the slot.

公开(公告)号：US20240195145A1

公开(公告)日：2024-06-13

申请号：US18194123

申请日：2023-03-31

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Joseph LEIGH ,  Eric R. HEGBLOM ,  Suhit Ranjan DAS ,  Huanlin ZHU ,  Raman SRINIVASAN ,  Gianluca BACCHIN ,  Yuefa LI ,  Jacob U. LOPEZ RUVALCABA ,  Lijun ZHU ,  Qianhuan YU

IPC: H01S5/0239 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/02375 ,  H01S5/183 ,  H01S5/42

CPC classification number: H01S5/0239 ,  H01S5/0234 ,  H01S5/0237 ,  H01S5/02375 ,  H01S5/18305 ,  H01S5/423

Abstract: In some implementations, an emitter assembly includes a vertical cavity surface emitting laser (VCSEL) chip including a plurality of VCSELs respectively associated with a plurality of first electrical contacts. A first spacing of the plurality of first electrical contacts may define a first pitch. The emitter assembly may include a redistribution layer, disposed on the VCSEL chip, to increase the first pitch of the plurality of first electrical contacts. The emitter assembly may include a carrier having a plurality of second electrical contacts. A second spacing of the plurality of second electrical contacts may define a second pitch greater than the first pitch. The emitter assembly may include a plurality of conductive pillars that electrically connect the plurality of first electrical contacts and the plurality of second electrical contacts via the redistribution layer. The plurality of conductive pillars may be arranged according to the second spacing.

公开(公告)号：US20230133647A1

公开(公告)日：2023-05-04

申请号：US17648656

申请日：2022-01-21

Applicant: Lumentum Operations LLC

Inventor： Lei YANG ,  John Michael MILLER ,  Lijun ZHU

IPC: G01B11/25 ,  H01S5/00 ,  H01S5/42

Abstract: A structured light system includes a camera module and a dot projection module. The dot projection module includes a submount, an emitter array disposed on the submount, and a diffractive optical element (DOE) disposed over the emitter array. The emitter array includes a plurality of emitters arranged in a periodic emitter pattern and the emitter array is oriented at a non-zero angle relative to a rectilinear axis of the submount.

公开(公告)号：US20230047740A1

公开(公告)日：2023-02-16

申请号：US17449612

申请日：2021-09-30

Applicant: Lumentum Operations LLC

Inventor： Siu Kwan CHEUNG ,  Wei SHI ,  Hao HUANG ,  Lijun ZHU ,  Huanlin ZHU

IPC: H01S5/042 ,  H01L49/02

Abstract: In some implementations, a vertical cavity surface emitting laser (VCSEL) package may include a substrate. The VCSEL package may include a VCSEL disposed on a surface of the substrate. The VCSEL package may include a VCSEL driver disposed on the surface of the substrate. The VCSEL package may include an embedded capacitor electrically connected to the VCSEL and the VCSEL driver. The embedded capacitor may be formed from a subset of layers of the substrate. The capacitor may be associated with a first capacitance that is different from a second capacitance of at least one other capacitor associated with the substrate.

公开(公告)号：US20230027279A1

公开(公告)日：2023-01-26

申请号：US17449386

申请日：2021-09-29

Applicant: Lumentum Operations LLC

Inventor： Wei SHI ,  Kevin WANG ,  Hao HUANG ,  John Michael MILLER ,  Siu Kwan CHEUNG ,  Lijun ZHU

IPC: H01S5/183 ,  H01S5/42 ,  H01S5/024 ,  H01S5/026

Abstract: In some implementations, an optical assembly includes a substrate that includes a thermally conductive core, an IC driver chip that is disposed on a first surface of the substrate, and a VCSEL device that includes an electrically insulated surface that is disposed on the thermally conductive core of the substrate within a cavity formed in the second surface of the substrate. The VCSEL device includes a cathode contact disposed on a surface of the VCSEL device and an anode contact disposed on the surface of the VCSEL device. The VCSEL device includes a plurality of emitters and a microlens component that is disposed over the plurality of emitters on the surface of the VCSEL device.