公开(公告)号：US20230049446A1

公开(公告)日：2023-02-16

申请号：US17794395

申请日：2020-02-12

Applicant: LG ELECTRONICS INC.

Inventor： Soohyun KIM ,  Sungyun PARK ,  Indo CHUNG ,  Jeonghyo KWON

IPC: H01L25/075 ,  H01L33/62

Abstract: The present invention relates to a display apparatus, specifically to a display apparatus using semiconductor light-emitting elements of a few micrometers to tens of micrometers in size. The present invention provides a display apparatus comprising: a base part; a partition part having a plurality of grooves; a plurality of semiconductor light-emitting elements arranged on the base part and mounted in the plurality of grooves; first and second wiring electrodes arranged on one side and the other side of each of the semiconductor light-emitting elements, respectively; an assembly electrode arranged on the base part and arranged on the one side of each of the semiconductor light-emitting elements; and a dielectric layer arranged on the base part and arranged between the assembly electrode and the first wiring electrode, wherein each of the plurality of grooves includes at least one recess portion formed in the horizontal direction with respect to the base part.

公开(公告)号：US20230048122A1

公开(公告)日：2023-02-16

申请号：US17789049

申请日：2020-01-03

Applicant: LG ELECTRONICS INC.

Inventor： Jemin YU ,  Sungyun PARK ,  Hyunho LEE ,  Kiseong JEON ,  Soohyun KIM ,  Inbum YANG

IPC: H01L25/075 ,  H01L21/683 ,  H01L33/62

Abstract: Discussed is an apparatus and a method of manufacturing a display using a micro light emitting diode (LED). A method of manufacturing a display device using a light emitting element includes providing a substrate having an individual pixel position defined by a pair of assembly electrodes; moving the light emitting element including a magnetic body on to the substrate using a magnetic chuck having an electromagnet; assembling the light emitting element at the individual pixel position using the magnetic chuck; and recovering a remaining light emitting element which is not assembled at the individual pixel position using the magnetic chuck.

公开(公告)号：US20230045160A1

公开(公告)日：2023-02-09

申请号：US17778691

申请日：2019-11-26

Applicant: LG ELECTRONICS INC.

Inventor： Soohyun KIM ,  Dohan KIM ,  Wonseok CHOI ,  Youngdo KIM

IPC: H01L33/00 ,  H01L25/075 ,  G01R27/02 ,  G01R1/073

Abstract: Discussed is a method of manufacturing a display device, the method including: introducing semiconductor light emitting devices including a magnetic material into a fluid chamber; transferring a substrate to the fluid chamber, the substrate including assembly electrodes, an insulating layer covering the assembly electrodes, and open holes in the insulating layer and exposing portions of both ends of the assembly electrodes; applying a magnetic force to the semiconductor light emitting devices introduced into the fluid chamber to move the semiconductor light emitting devices in one direction; and forming an electric field so that the moving semiconductor light emitting devices are disposed at preset positions of the substrate, wherein a probe pin is in contact with the assembly electrodes exposed through the open holes to individually apply a voltage to the assembly electrodes to form the electric field.

公开(公告)号：US20220415859A1

公开(公告)日：2022-12-29

申请号：US17619549

申请日：2019-07-01

Applicant: LG ELECTRONICS INC.

Inventor： Wonseok CHOI ,  Soohyun KIM ,  Sungmin PARK

IPC: H01L25/075 ,  H01L21/683 ,  H01L33/62

Abstract: Disclosed in the present specification are a micro LED display device in which an assembly electrode capable of forming a non-uniform electric field is assembled in a provided assembly hole, and a manufacturing method therefor. The display device according to one embodiment of the present invention comprises: a substrate; a first assembly electrode and a second assembly electrode arranged to be spaced apart on the substrate; an insulating layer deposited on top of the first assembly electrode and the second assembly electrode; an assembly hole defining a pixel area formed on the insulating layer; a semiconductor light-emitting element assembled in the assembly hole; and a wiring electrode electrically connected to the semiconductor light-emitting element, wherein the first assembly electrode and the second assembly electrode have a pattern for generating non-uniform electric field in the assembly hole by means of applied voltage, and the semiconductor light-emitting element is assembled, on the basis of the non-uniform electric field, at a specific location in the assembly hole after moving in a specific direction.

公开(公告)号：US20220278260A1

公开(公告)日：2022-09-01

申请号：US17631204

申请日：2019-08-27

Applicant: LG ELECTRONICS INC.

Inventor： Jaewon CHANG ,  Soohyun KIM

IPC: H01L33/62 ,  H01L25/075

Abstract: The present disclosure is applicable to a display apparatus-related technology field, and relates to, for example, a display apparatus using a micro light emitting diode (LED), which is a semiconductor light emitting device. The present invention provides a display apparatus using a light emitting device operated in an active matrix scheme, the display apparatus comprising: a substrate; a pixel area layer configuring multiple pixel areas, which are arranged on the substrate and each of which includes a light emitting area and a pixel transistor area; and an assembly wiring layer including multiple pairs of assembly wires arranged between the substrate and the pixel area layer, wherein each of the pixel areas may include a light emitting area in which a light emitting device is mounted, and a pixel transistor area, which is positioned in a first direction with respect to the light emitting area and in which a thin film transistor for lighting the light emitting device is disposed, and the assembly wires may be arranged in a second direction different from the first direction.

公开(公告)号：US20180301577A1

公开(公告)日：2018-10-18

申请号：US15951379

申请日：2018-04-12

Applicant: LG Electronics Inc.

Inventor： Younho HEO ,  Soohyun KIM ,  Hyun LEE ,  Changhyun JEONG

IPC: H01L31/0224 ,  H01L31/02 ,  H01L31/18 ,  H01L31/0216

CPC classification number: H01L31/022441 ,  H01L31/02008 ,  H01L31/02168 ,  H01L31/0304 ,  H01L31/1868 ,  H01L31/1888 ,  H01L31/1892 ,  Y02E10/50

Abstract: According to an aspect of the present invention, there is provided a method for manufacturing a compound semiconductor solar cell, comprising: forming a sacrificial layer on one surface of a mother substrate; forming a compound semiconductor layer on the sacrificial layer; forming a first protective layer formed of a compound semiconductor on the compound semiconductor layer; depositing a second passivation layer on the first passivation layer; attaching a first lamination film on the second protective layer; separating the compound semiconductor layer, the first and second protective layers, and the first lamination film from the mother substrate by performing an ELO process to remove the sacrificial layer; forming a back electrode on the compound semiconductor layer; attaching a second lamination film on the back electrode; removing the first lamination film; removing the second protective layer; removing the first protective layer; and forming a front electrode on the compound semiconductor layer.

公开(公告)号：US20180301575A1

公开(公告)日：2018-10-18

申请号：US15948231

申请日：2018-04-09

Applicant: LG ELECTRONICS INC.

Inventor： Soohyun KIM ,  Gunho KIM ,  Jinhee PARK ,  Wonki YOON

IPC: H01L31/0224

Abstract: The disclosure relates to a compound solar cell and manufacturing method therefor.According to one aspect of the subject matter described in this application, a method for manufacturing a front electrode of a compound solar cell comprises a step of forming a seed metal layer entirely on a front surface of a compound semiconductor layer, a step of forming a first mask layer covering the seed metal layer in the remaining region except a front electrode formation region, a step of forming a second mask layer on the first mask layer in the same pattern as the first mask layer, a step of forming an electrode metal layer on the seed metal layer in the front electrode formation region, a step of removing the seed metal layer under the first mask layer, and a step of forming a front electrode including the seed metal layer and the electrode metal layer positioned on the front electrode formation region by removing the first mask layer and the second mask layer.

公开(公告)号：US20180158975A1

公开(公告)日：2018-06-07

申请号：US15833692

申请日：2017-12-06

Applicant: LG Electronics Inc.

Inventor： Gunho KIM ,  Soohyun KIM

IPC: H01L31/056 ,  H01L31/0693 ,  H01L31/0224

CPC classification number: H01L31/056 ,  H01L31/02168 ,  H01L31/022425 ,  H01L31/0693 ,  Y02E10/52 ,  Y02E10/544

Abstract: According to an aspect of the present invention, there is provided a compound semiconductor solar cell, comprising: a light absorbing layer comprising a compound semiconductor; a first electrode positioned on a front surface of the light absorption layer; a first contact layer positioned between the light absorbing layer and the first electrode; a second electrode positioned on a rear surface of the light absorbing layer and having a sheet shape; and a second contact layer positioned between the light absorbing layer and the second electrode. The second contact layer is partially formed on the rear surface of the light absorbing layer on the projection surface, and the second electrode includes a first portion in direct contact with the second contact layer and a second portion located between the first portions.

公开(公告)号：US20230420423A1

公开(公告)日：2023-12-28

申请号：US18247789

申请日：2020-10-06

Applicant: LG ELECTRONICS INC.

Inventor： Soohyun KIM ,  Junoh SHIN ,  Youngdo KIM ,  Wonseok CHOI ,  Dohan KIM

IPC: H01L25/075 ,  H01L33/62

CPC classification number: H01L25/0753 ,  H01L2933/0066 ,  H01L33/62

Abstract: A display device according to embodiments of the present invention comprises: a substrate; a plurality of first metal wiring layers formed on the substrate; a first insulating layer stacked on the substrate to cover the first metal wiring; a second metal wiring layer stacked on at least a portion of the first insulating layer so as to be spaced apart therefrom; and a second insulating layer stacked on the second metal wiring. The second metal wiring layer comprises: at least one first metal layer having a first conductivity; and at least one second metal layer having a higher conductivity than the first metal layer, wherein the first metal layer may block diffusion of the second metal layer.

公开(公告)号：US20230119947A1

公开(公告)日：2023-04-20

申请号：US17798219

申请日：2021-02-26

Applicant: LG ELECTRONICS INC.

Inventor： Jaewon CHANG ,  Hyunho LEE ,  Soohyun KIM

IPC: H01L21/683 ,  H01L33/00 ,  H01L27/15

Abstract: According to the present disclosure, a substrate for manufacturing a display device has a structure in which a semiconductor light-emitting device package composed of a plurality of electrodes and semiconductor light-emitting devices can be uniformly aligned. As a result, according to the present disclosure, a semiconductor light-emitting device package that has been transferred by a pick-and-place method in the related art may be allowed to be transferred through self-assembly, thereby having an effect of improving process efficiency (improving process speed and reducing time).