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公开(公告)号:US11751341B2
公开(公告)日:2023-09-05
申请号:US17305949
申请日:2021-07-19
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor: Tatsuya Ushioda , Jun Iwasaki , Masaaki Bandoh , Ryota Watanabe , Hiroshi Yamazaki
CPC classification number: H05K5/0008 , F16B35/00 , F16B43/00 , G06F1/1628 , H05K7/205
Abstract: An electronic apparatus includes a bottom cover, a main board provided with a stud, a screw, a washer, and a sponge. The screw has a head portion having a diameter larger than that of an attachment hole, a male screw portion configured to be screwed into a first female screw portion, and a columnar portion having a diameter smaller than a root diameter of the male screw portion. The washer has a flange portion having a diameter larger than that of the attachment hole, a cylindrical portion having a diameter smaller than that of the attachment hole, and a second female screw portion which the male screw portion is screwable into and passable through. The head portion abuts on the bottom cover to fix the bottom cover by the male screw portion. The flange portion is between the stud and the bottom cover.
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公开(公告)号:US20210018965A1
公开(公告)日:2021-01-21
申请号:US16600246
申请日:2019-10-11
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor: Ryota Watanabe , Yasumichi Tsukamoto , Masayuki Amano
Abstract: An electronic apparatus includes: a cooling fan having a radiating fin; a system chassis that houses the cooling fan, and is provided with an air outlet on an extension of the radiating fin; a display chassis openably and closably coupled to the system chassis through a hinge; and a temperature sensor housed in the back of, of a bezel of the display chassis, an air outlet facing portion that faces the air outlet at least when the display chassis is open with respect to the system chassis.
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公开(公告)号:US12238897B2
公开(公告)日:2025-02-25
申请号:US18079375
申请日:2022-12-12
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor: Ryota Watanabe , Masahiro Kitamura , Mizuki Itoyama , Takuroh Kamimura , Junrong Zhou
Abstract: A heat dissipation structure, for a heat-generating electric component, includes: a heat dissipator disposed along a surface of the electric component; and a porous material held between the electric component and the heat dissipator. The porous material of the heat dissipation structure is impregnated with heat-transfer fluid. The heat-transfer fluid may include liquid metal.
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公开(公告)号:US20250016951A1
公开(公告)日:2025-01-09
申请号:US18735550
申请日:2024-06-06
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor: Yuki Saigusa , Ryota Watanabe , Atsushi Ohyama , Kengo Sano
Abstract: An electronic apparatus includes: a chassis; a heat generation element provided in the chassis; a heat transfer member in contact with the heat generation element in a heat-transferable manner; and one or a plurality of heat dissipation mechanisms configured to cool the heat transfer member. The heat dissipation mechanism includes a first cooling device configured to cool a first main surface of the heat transfer member, and a second cooling device configured to cool a second main surface of the heat transfer member opposite to the first main surface. The first cooling device includes a first heat dissipation plate in contact with the first main surface in a heat-transferable manner, and a first blower mechanism configured to blow a gas to come into contact with the first heat dissipation plate.
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公开(公告)号:US20240121916A1
公开(公告)日:2024-04-11
申请号:US18469958
申请日:2023-09-19
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor: Masahiro Kitamura , Takuroh Kamimura , Ryota Watanabe , Junki Hashiba
IPC: H05K7/20
CPC classification number: H05K7/2039
Abstract: A heat radiation structure includes a mesh that abuts on a surface of a die, and a vapor chamber that interposes the mesh between the surface of the die and the vapor chamber. The mesh includes a heat generation element abutting range portion that is provided at a central portion of the mesh, is impregnated with a liquid metal, and abuts on the surface of the die to receive heat, and a pair of heat generation element non-abutting range portions that continuously extends from both sides of the heat generation element abutting range portion and does not abut on the surface of the die. Each of the pair of heat generation element non-abutting range portions is fixed to the vapor chamber via a sheet material. Each of a pair of the heat generation element non-abutting range portions is interposed between a pair of the sheet materials.
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公开(公告)号:US20240061481A1
公开(公告)日:2024-02-22
申请号:US18498590
申请日:2023-10-31
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor: Ryota Watanabe , Takuroh Kamimura , Atsunobu Nakamura , Yuichiro Seto , Yusaku Morishige , Ke Ma
IPC: G06F1/20 , G05B19/042
CPC classification number: G06F1/206 , G05B19/042 , G05B2219/23345
Abstract: An information processing apparatus includes: a controller that outputs notification information based on input information; and a processor that executes system processing based on an operating system (OS) and operation of thermal control processing by control of a Basic Input Output System (BIOS) using the notification information output from the controller. The controller accepts an operation signal indicative of an operated key according to a user's operation on a keyboard; determines whether the operated key is of a specific combination of keys based on the accepted operation signal; upon making a determination that the operated key is of the specific combination of keys, outputs, to the processor, a result of the determination as the notification information; and without another key being pressed after the result of the determination is output from the controller, the processor executes the thermal control processing based on the result of the determination.
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公开(公告)号:US20240038622A1
公开(公告)日:2024-02-01
申请号:US18357364
申请日:2023-07-24
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor: Ryota Watanabe , Masahiro Kitamura , Junki Hashiba , Takuroh Kamimura
IPC: H01L23/373 , G06F1/20
CPC classification number: H01L23/3733 , G06F1/20 , H01L23/3735
Abstract: A heat radiation component radiates heat from a GPU that generates heat, and includes a mesh impregnated with a liquid metal, and two film bodies that cover both surfaces of the mesh and have sealed peripheries. An opening is formed in the film body. In the mesh, an exposed portion that is exposed through the opening abuts on a surface of a die of the GPU. In the mesh, the portion exposed through the opening is formed of two layers, a first layer and a second layer. In the mesh, an area of the exposed portion exposed through the opening is smaller than an area of the other portion.
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公开(公告)号:US20230124239A1
公开(公告)日:2023-04-20
申请号:US17931901
申请日:2022-09-14
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor: Masahiro Kitamura , Takuroh Kamimura , Akinori Uchino , Ryota Watanabe
Abstract: An electronic apparatus includes: a heating element; and a plurality of heat pipes that is thermally connected to the heating element. Each of the heat pipes has a cross section having a rectangular shape, a heat receiving surface thermally connected to the heating element, and a side surface orthogonal to the heat receiving surface. The side surfaces of the heat pipes, which are adjacent to each other, are in surface contact with each other.
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公开(公告)号:US20220159881A1
公开(公告)日:2022-05-19
申请号:US17447811
申请日:2021-09-15
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor: Ryota Watanabe , Atsushi Ohyama , Akinori Uchino
Abstract: An information apparatus includes a main body chassis having a CPU and a display chassis having a display, the main body chassis and the display chassis being rotatably connected at their respective connecting edge parts. The information apparatus includes a vapor chamber provided in the main body chassis and thermally connected to the CPU, a display controller provided in the main body chassis and controlling display of the display, an FPC connecting the display controller and the display through the connecting edge parts, and a graphite sheet thermally connected to the vapor chamber, overlaid with the FPC to pass through the connecting edge parts, and provided extending from the main body chassis to the display chassis. The graphite sheet is connected to a rear cover.
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公开(公告)号:US20220155833A1
公开(公告)日:2022-05-19
申请号:US17183464
申请日:2021-02-24
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor: Ryota Watanabe , Takuroh Kamimura , Atsunobu Nakamura , Yuichiro Seto , Yusaku Morishige , Ke Ma
IPC: G06F1/20 , G05B19/042
Abstract: An information processing apparatus includes: a controller that outputs notification information based on input information; and a processor that functions as a system processing unit that executes system processing based on an operating system (OS) and a Basic Input Output System (BIOS) processing unit that executes control related to the performance of the system processing by control of a BIOS using the notification information output from the controller.
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