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公开(公告)号：US20250008696A1
公开(公告)日：2025-01-02
申请号：US18615207
申请日：2024-03-25
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Masahiro Kitamura , Junki Hashiba , Takuroh Kamimura , Ryota Watanabe
Abstract: A heat radiation structure includes a metal mesh brought into contact with the surface of a die, and a heat receiving plate configured to sandwich the mesh between the surface of the die and the heat receiving plate. The mesh is impregnated with a liquid metal at least at a portion brought into contact with the surface of the die and has a shape in which intersection points of vertical and horizontal element wires are crushed in a thickness direction of the mesh. The mesh has a flat portion formed on the surface side of the element wire at each intersection point.
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公开(公告)号：US20240014098A1
公开(公告)日：2024-01-11
申请号：US18332816
申请日：2023-06-12
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Ryota Watanabe , Junki Hashiba , Masahiro Kitamura , Takuroh Kamimura
IPC: H01L23/373 , G06F1/20
CPC classification number: H01L23/3733 , G06F1/20
Abstract: A heat radiating structure includes a mesh which abuts on a surface of a die of a GPU and a copper plate which is equipped with a recessed part into which the mesh fits and which sandwiches and holds the mesh together with the surface of the die. The mesh includes a heat generating element abutment range part into which a liquid metal is impregnated and which abuts on the surface of the die and receives heat from the die and a heat generating element non-abutment region part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the die. The heat generating element non-abutment range part is fixed to the copper plate with the use of a sponge tape. The heat generating element abutment range part is shaped to protrude from the heat generating element abutment range part.
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公开(公告)号：US20210337699A1
公开(公告)日：2021-10-28
申请号：US17171107
申请日：2021-02-09
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Ryota Watanabe , Akinori Uchino , Hiroshi Yamazaki
Abstract: A heat transport device includes: a sub heat sink which extends along a surface of a main board on which a chip is mounted, and which has a sheet mounting hole formed in a portion including the chip as observed in plan view; a main heat sink which extends along a back surface opposite from the mounting surface and which is in thermal contact at a position on the back surface that corresponds to the chip; a sheet member which is installed to the sub heat sink in such a manner as to close the sheet mounting hole and which has thermal conductivity; and a bracket which is fixed to the main board and which covers the sheet mounting hole. The sheet member is in thermal contact with a surface of the chip and has lower rigidity than the sub heat sink.
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公开(公告)号：US20240160258A1
公开(公告)日：2024-05-16
申请号：US18457514
申请日：2023-08-29
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Ryota Watanabe , Qianyi Lu , Jun Iwasaki , Masaaki Bandoh
CPC classification number: G06F1/203 , G06F1/1656 , G06F1/1698 , H05K7/20154 , H05K7/20336 , H05K7/2049 , H05K9/0022
Abstract: An electronic apparatus includes a chassis, a heat generating body provided in the chassis, an antenna configured to be provided in the chassis and be capable of receiving radio waves, an electronic part arranged to be aligned with the antenna within the chassis, and a cooling module configured to have a plate-shaped metal part and cool the heat generating body within the chassis. The metal part includes a shield wall interposed between the antenna and the electronic part.
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公开(公告)号：US20240038710A1
公开(公告)日：2024-02-01
申请号：US18338453
申请日：2023-06-21
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Junki Hashiba , Takuroh Kamimura , Masahiro Kitamura , Ryota Watanabe
IPC: H01L23/00 , H01L23/373
CPC classification number: H01L24/29 , H01L24/32 , H01L23/3733 , H01L2924/10158 , H01L25/16
Abstract: A heat radiation structure includes a vapor chamber provided along a surface of a die, a mesh interposed between the die and the vapor chamber, and a liquid metal impregnated in the mesh. In the mesh, a peripheral portion has a higher material density per unit volume than a central portion. In the mesh, the central portion may be formed of a single layer, and the peripheral portion is formed of two layers. The mesh may be a resin material.
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Patent Agency Ranking
公开(公告)号：US11751341B2
公开(公告)日：2023-09-05
申请号：US17305949
申请日：2021-07-19
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Tatsuya Ushioda , Jun Iwasaki , Masaaki Bandoh , Ryota Watanabe , Hiroshi Yamazaki
CPC classification number: H05K5/0008 , F16B35/00 , F16B43/00 , G06F1/1628 , H05K7/205
Abstract: An electronic apparatus includes a bottom cover, a main board provided with a stud, a screw, a washer, and a sponge. The screw has a head portion having a diameter larger than that of an attachment hole, a male screw portion configured to be screwed into a first female screw portion, and a columnar portion having a diameter smaller than a root diameter of the male screw portion. The washer has a flange portion having a diameter larger than that of the attachment hole, a cylindrical portion having a diameter smaller than that of the attachment hole, and a second female screw portion which the male screw portion is screwable into and passable through. The head portion abuts on the bottom cover to fix the bottom cover by the male screw portion. The flange portion is between the stud and the bottom cover.
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公开(公告)号：US20210018965A1
公开(公告)日：2021-01-21
申请号：US16600246
申请日：2019-10-11
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Ryota Watanabe , Yasumichi Tsukamoto , Masayuki Amano
Abstract: An electronic apparatus includes: a cooling fan having a radiating fin; a system chassis that houses the cooling fan, and is provided with an air outlet on an extension of the radiating fin; a display chassis openably and closably coupled to the system chassis through a hinge; and a temperature sensor housed in the back of, of a bezel of the display chassis, an air outlet facing portion that faces the air outlet at least when the display chassis is open with respect to the system chassis.
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公开(公告)号：US20250016951A1
公开(公告)日：2025-01-09
申请号：US18735550
申请日：2024-06-06
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor： Yuki Saigusa , Ryota Watanabe , Atsushi Ohyama , Kengo Sano
Abstract: An electronic apparatus includes: a chassis; a heat generation element provided in the chassis; a heat transfer member in contact with the heat generation element in a heat-transferable manner; and one or a plurality of heat dissipation mechanisms configured to cool the heat transfer member. The heat dissipation mechanism includes a first cooling device configured to cool a first main surface of the heat transfer member, and a second cooling device configured to cool a second main surface of the heat transfer member opposite to the first main surface. The first cooling device includes a first heat dissipation plate in contact with the first main surface in a heat-transferable manner, and a first blower mechanism configured to blow a gas to come into contact with the first heat dissipation plate.
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公开(公告)号：US20240121916A1
公开(公告)日：2024-04-11
申请号：US18469958
申请日：2023-09-19
Applicant: LENOVO (SINGAPORE) PTE. LTD.
Inventor： Masahiro Kitamura , Takuroh Kamimura , Ryota Watanabe , Junki Hashiba
IPC: H05K7/20
CPC classification number: H05K7/2039
Abstract: A heat radiation structure includes a mesh that abuts on a surface of a die, and a vapor chamber that interposes the mesh between the surface of the die and the vapor chamber. The mesh includes a heat generation element abutting range portion that is provided at a central portion of the mesh, is impregnated with a liquid metal, and abuts on the surface of the die to receive heat, and a pair of heat generation element non-abutting range portions that continuously extends from both sides of the heat generation element abutting range portion and does not abut on the surface of the die. Each of the pair of heat generation element non-abutting range portions is fixed to the vapor chamber via a sheet material. Each of a pair of the heat generation element non-abutting range portions is interposed between a pair of the sheet materials.
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公开(公告)号：US20240061481A1
公开(公告)日：2024-02-22
申请号：US18498590
申请日：2023-10-31
Applicant: Lenovo (Singapore) Pte. Ltd.
Inventor： Ryota Watanabe , Takuroh Kamimura , Atsunobu Nakamura , Yuichiro Seto , Yusaku Morishige , Ke Ma
IPC: G06F1/20 , G05B19/042
CPC classification number: G06F1/206 , G05B19/042 , G05B2219/23345
Abstract: An information processing apparatus includes: a controller that outputs notification information based on input information; and a processor that executes system processing based on an operating system (OS) and operation of thermal control processing by control of a Basic Input Output System (BIOS) using the notification information output from the controller. The controller accepts an operation signal indicative of an operated key according to a user's operation on a keyboard; determines whether the operated key is of a specific combination of keys based on the accepted operation signal; upon making a determination that the operated key is of the specific combination of keys, outputs, to the processor, a result of the determination as the notification information; and without another key being pressed after the result of the determination is output from the controller, the processor executes the thermal control processing based on the result of the determination.
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