知搜-全球专利检索

  1. Login
  2. Sign Up

Search Results

25 records (took 0.015 seconds)

    HEAT RADIATING STRUCTURE AND ELECTRONIC APPARATUS
    2.
    发明公开
    HEAT RADIATING STRUCTURE AND ELECTRONIC APPARATUS 审中-公开

    公开(公告)号：US20240014098A1

    公开(公告)日：2024-01-11

    申请号：US18332816

    申请日：2023-06-12

    Applicant: LENOVO (SINGAPORE) PTE. LTD.

    Inventor： Ryota Watanabe ,  Junki Hashiba ,  Masahiro Kitamura ,  Takuroh Kamimura

    IPC: H01L23/373 ,  G06F1/20

    CPC classification number: H01L23/3733 ,  G06F1/20

    Abstract: A heat radiating structure includes a mesh which abuts on a surface of a die of a GPU and a copper plate which is equipped with a recessed part into which the mesh fits and which sandwiches and holds the mesh together with the surface of the die. The mesh includes a heat generating element abutment range part into which a liquid metal is impregnated and which abuts on the surface of the die and receives heat from the die and a heat generating element non-abutment region part which is contiguous to the heat generating element abutment range part and does not abut on the surface of the die. The heat generating element non-abutment range part is fixed to the copper plate with the use of a sponge tape. The heat generating element abutment range part is shaped to protrude from the heat generating element abutment range part.

    HEAT TRANSPORT DEVICE AND ELECTRONIC APPARATUS
    3.
    发明申请
    HEAT TRANSPORT DEVICE AND ELECTRONIC APPARATUS 有权

    公开(公告)号：US20210337699A1

    公开(公告)日：2021-10-28

    申请号：US17171107

    申请日：2021-02-09

    Applicant: LENOVO (SINGAPORE) PTE. LTD.

    Inventor： Ryota Watanabe ,  Akinori Uchino ,  Hiroshi Yamazaki

    IPC: H05K7/20 ,  H01L25/10 ,  G06F1/20

    Abstract: A heat transport device includes: a sub heat sink which extends along a surface of a main board on which a chip is mounted, and which has a sheet mounting hole formed in a portion including the chip as observed in plan view; a main heat sink which extends along a back surface opposite from the mounting surface and which is in thermal contact at a position on the back surface that corresponds to the chip; a sheet member which is installed to the sub heat sink in such a manner as to close the sheet mounting hole and which has thermal conductivity; and a bracket which is fixed to the main board and which covers the sheet mounting hole. The sheet member is in thermal contact with a surface of the chip and has lower rigidity than the sub heat sink.

    Electronic apparatus and structure
    6.
    发明授权
    Electronic apparatus and structure 有权

    公开(公告)号：US11751341B2

    公开(公告)日：2023-09-05

    申请号：US17305949

    申请日：2021-07-19

    Applicant: LENOVO (SINGAPORE) PTE. LTD.

    Inventor： Tatsuya Ushioda ,  Jun Iwasaki ,  Masaaki Bandoh ,  Ryota Watanabe ,  Hiroshi Yamazaki

    IPC: H05K5/00 ,  F16B43/00 ,  G06F1/16 ,  H05K7/20 ,  F16B35/00

    CPC classification number: H05K5/0008 ,  F16B35/00 ,  F16B43/00 ,  G06F1/1628 ,  H05K7/205

    Abstract: An electronic apparatus includes a bottom cover, a main board provided with a stud, a screw, a washer, and a sponge. The screw has a head portion having a diameter larger than that of an attachment hole, a male screw portion configured to be screwed into a first female screw portion, and a columnar portion having a diameter smaller than a root diameter of the male screw portion. The washer has a flange portion having a diameter larger than that of the attachment hole, a cylindrical portion having a diameter smaller than that of the attachment hole, and a second female screw portion which the male screw portion is screwable into and passable through. The head portion abuts on the bottom cover to fix the bottom cover by the male screw portion. The flange portion is between the stud and the bottom cover.

    ELECTRONIC APPARATUS
    7.
    发明申请
    ELECTRONIC APPARATUS 有权

    公开(公告)号：US20210018965A1

    公开(公告)日：2021-01-21

    申请号：US16600246

    申请日：2019-10-11

    Applicant: LENOVO (SINGAPORE) PTE. LTD.

    Inventor： Ryota Watanabe ,  Yasumichi Tsukamoto ,  Masayuki Amano

    IPC: G06F1/20 ,  H05K7/20

    Abstract: An electronic apparatus includes: a cooling fan having a radiating fin; a system chassis that houses the cooling fan, and is provided with an air outlet on an extension of the radiating fin; a display chassis openably and closably coupled to the system chassis through a hinge; and a temperature sensor housed in the back of, of a bezel of the display chassis, an air outlet facing portion that faces the air outlet at least when the display chassis is open with respect to the system chassis.

Patent Agency Ranking