Abstract:
An integrated circuit comprising a balanced differential amplifier. The balanced differential amplifier has a first single-ended differential amplifier coupled at a first negative differential input terminal to a first input signal through a feedback network also coupled to an output terminal of the first amplifier. The first amplifier is also coupled at a first positive differential input terminal to a second input signal through a first resistor and to a reference voltage. The balanced differential amplifier also has a second single-ended differential amplifier coupled at a second negative differential input terminal to the second input signal through a second feedback network also coupled to an output terminal of the second amplifier. The second amplifier is also coupled at a second positive differential input terminal to the first input signal through a second resistor and to the reference voltage.
Abstract:
A memory circuit includes an operational memory and a monitor circuit comprising a circuit element in the operational memory and/or a circuit element substantially identical to a corresponding circuit element in the operational memory. The monitor circuit is operative to measure at least one functional characteristic of the operational memory. A control circuit coupled to the monitor circuit is operative to generate a control signal which varies as a function of the measured characteristic of the operational memory. The memory circuit further includes a programmable voltage source coupled to the operational memory which is operative to generate at least a voltage and/or a current supplied to at least a portion of the operational memory which varies as a function of the control signal.
Abstract:
An integrated circuit device incorporating a metallurgical bond to enhance thermal conduction to a heat sink. In a semiconductor device, a surface of an integrated circuit die is metallurgically bonded to a surface of a heat sink. In an exemplary method of manufacturing the device, the upper surface of a package substrate includes an inner region and a peripheral region. The integrated circuit die is positioned over the substrate surface and a first surface of the integrated circuit die is placed in contact with the package substrate. A metallic layer is formed on a second opposing surface of the integrated circuit die. A preform is positioned on the metallic layer and a heat sink is positioned over the preform. A joint layer is formed with the preform, metallurgically bonding the heat sink to the second surface of the integrated circuit die.
Abstract:
Disclosed is a circuit that adjusts a characteristic of a signal transmitted from a transmitter to a receiver over a communication channel (e.g., a wire, a backplane, etc.). The circuit includes a latch that receives the signal at a predetermined point in the circuit and samples a voltage of the signal many times after a threshold voltage is applied to the latch. The circuit also includes a processor that determines the characteristic of the signal when the sampled voltages indicate a transition point and that adjusts the threshold voltage when the sampled voltages do not indicate a transition point. The processor adjusts the characteristic of the signal by adjusting at least one of a current and a voltage of the transmitter when the characteristic of the signal is outside a predetermined range.
Abstract:
Disclosed is a circuit for adjusting a voltage supplied to an IC by a power supply. The circuit includes a PVT detector configured to generate a control signal and an adjustable resistance device configured to adjust its resistance in response to the control signal.
Abstract:
A variable capacitance circuit on an integrated circuit comprises a MOS transistor, and a capacitance multiplier connected to one end of a channel of the MOS device. A MOS device is formed in series with an inductance, and a capacitance multiplier is formed to be connected to a node between the MOS device and the inductance.
Abstract:
Disclosed is a circuit that adjusts a characteristic of a signal transmitted from a transmitter to a receiver over a communication channel (e.g., a wire, a backplane, etc.). The circuit includes a latch that receives the signal at a predetermined point in the circuit and samples a voltage of the signal many times after a threshold voltage is applied to the latch. The circuit also includes a processor that determines the characteristic of the signal when the sampled voltages indicate a transition point and that adjusts the threshold voltage when the sampled voltages do not indicate a transition point. The processor adjusts the characteristic of the signal by adjusting at least one of a current and a voltage of the transmitter when the characteristic of the signal is outside a predetermined range.
Abstract:
The present invention provides an apparatus and method for detecting if a person has attempted to tamper with an integrated circuit (IC). The apparatus is located on the IC and comprises detection circuitry that detects a build up of electrical charge on the IC and disablement circuitry that disables the IC when the detection circuitry detects a build up of electrical charge on the IC. The method comprises detecting if a build up of electrical charge on the IC has occurred and disabling the IC when a build up of electrical charge on the IC has been detected.
Abstract:
Communication techniques are provided. For example, in one aspect, a communication method comprises the step of inputting information, at the time of placing of a telephone call, that directs a receiving telephone to produce one or more of a plurality of incoming call indicators. The incoming call indicator, which may comprise a particular ring tone, can be used to signify one or more of an identity of a caller, a nature of the call and an importance of the call.
Abstract:
A portable security system includes a portable wireless link and a portable motion sensor, which is adapted to receive control signals from the portable wireless link, and which is adapted to communicate a signal when a security breach occurs. A method of providing security is also described.