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    Wafer Inspection
    12.
    发明申请
    Wafer Inspection 有权
    晶圆检验

    公开(公告)号：US20150369753A1

    公开(公告)日：2015-12-24

    申请号：US14838194

    申请日：2015-08-27

    Applicant: KLA-Tencor Corporation

    Inventor： Anatoly Romanovsky ,  Ivan Maleev ,  Daniel Kavaldjiev ,  Yury Yuditsky ,  Dirk Woll ,  Stephen Biellak ,  Mehdi Vaez-Iravani ,  Guoheng Zhao

    IPC: G01N21/88 ,  G01N21/95

    CPC classification number: G01N21/9501 ,  G01N21/47 ,  G01N21/8806 ,  G01N21/8851 ,  G01N21/956

    Abstract: Systems configured to inspect a wafer are provided. One system includes an illumination subsystem configured to direct pulses of light to an area on a wafer; a scanning subsystem configured to scan the pulses of light across the wafer; a collection subsystem configured to image pulses of light scattered from the area on the wafer to a sensor, wherein the sensor is configured to integrate a number of the pulses of scattered light that is fewer than a number of the pulses of scattered light that can be imaged on the entire area of the sensor, and wherein the sensor is configured to generate output responsive to the integrated pulses of scattered light; and a computer subsystem configured to detect defects on the wafer using the output generated by the sensor.

    Abstract translation: 提供了配置用于检查晶片的系统。 一个系统包括被配置为将光脉冲引导到晶片上的区域的照明子系统; 扫描子系统，被配置为扫描穿过所述晶片的光脉冲; 配置为将从晶片上的区域散射的光脉冲成像到传感器的集合子系统，其中，所述传感器被配置为将少数散射光的脉冲的数量积分成散射光的脉冲数， 在传感器的整个区域成像，并且其中传感器被配置为响应于散射光的积分脉冲产生输出; 以及计算机子系统，被配置为使用由所述传感器产生的输出来检测所述晶片上的缺陷。

    Monitoring incident beam position in a wafer inspection system
    13.
    发明授权
    Monitoring incident beam position in a wafer inspection system 有权
    监测晶圆检测系统中的入射光束位置

    公开(公告)号：US08934091B2

    公开(公告)日：2015-01-13

    申请号：US13794030

    申请日：2013-03-11

    Applicant: KLA-Tencor Corporation

    Inventor： Juergen Reich ,  Aleksey Petrenko ,  Richard Fong ,  Bret Whiteside ,  Jien Cao ,  Christian Wolters ,  Anatoly Romanovsky ,  Daniel Kavaldjiev

    IPC: G01J1/00 ,  H01L21/67 ,  G01J1/42

    CPC classification number: G01J1/4257 ,  G01N21/9501 ,  H01L21/67259 ,  H01L21/681

    Abstract: Methods, systems, and structures for monitoring incident beam position in a wafer inspection system are provided. One structure includes a feature formed in a chuck configured to support a wafer during inspection by the wafer inspection system. The chuck rotates the wafer in a theta direction and simultaneously translates the wafer in a radial direction during the inspection. An axis through the center of the feature is aligned with a radius of the chuck such that a position of the axis relative to an incident beam of the wafer inspection system indicates changes in the incident beam position in the theta direction.

    Abstract translation: 提供了用于监测晶片检测系统中的入射光束位置的方法，系统和结构。 一种结构包括形成在卡盘中的特征，其构造成在晶片检查系统检查期间支撑晶片。 卡盘在θ方向旋转晶片，同时在检查期间沿径向方向平移晶片。 穿过特征中心的轴与卡盘的半径对准，使得轴相对于晶片检查系统的入射光束的位置指示在θ方向上的入射光束位置的变化。

    System and method for reducing radiation-induced false counts in an inspection system
    15.
    发明授权
    System and method for reducing radiation-induced false counts in an inspection system 有权

    公开(公告)号：US09841512B2

    公开(公告)日：2017-12-12

    申请号：US14946563

    申请日：2015-11-19

    Applicant: KLA-Tencor Corporation

    Inventor： Ximan Jiang ,  Anatoly Romanovsky ,  Christian Wolters ,  Stephen Biellak ,  Mous Tatarkhanov

    IPC: G01T1/24 ,  G01N21/95

    CPC classification number: G01T1/24 ,  G01N21/9501

    Abstract: An inspection system with radiation-induced false count mitigation includes an illumination source configured to illuminate a sample, a detector assembly comprising an illumination sensor configured to detect illumination from the sample, and one or more radiation sensors configured to detect particle radiation, and control circuitry communicatively coupled to the detector. The control circuitry is configured to perform the steps of determining a set of radiation detection events based on one or more radiation signals received from the radiation sensors, determining a set of imaging events based on the illumination signal received from the illumination sensor, comparing the set of radiation detection events to the set of imaging events to generate a set of coincidence events, wherein the set of coincidence events comprises simultaneous imaging and radiation detection events, and excluding the set of coincidence events from the set of imaging events to generate a set of identified defect sites.

    Scanning Inspection System With Angular Correction
    16.
    发明申请
    Scanning Inspection System With Angular Correction 有权
    具有角度校正的扫描检查系统

    公开(公告)号：US20140278188A1

    公开(公告)日：2014-09-18

    申请号：US13826790

    申请日：2013-03-14

    Applicant: KLA-TENCOR CORPORATION

    Inventor： Yury Yuditsky ,  Alexander Slobodov ,  Anatoly Romanovsky

    IPC: G01N21/93 ,  G01B21/22

    CPC classification number: G01B21/045 ,  G01N21/9501 ,  G03F1/84

    Abstract: A wafer is moved under an inspection spot by a rotary inspection system. The system rotates the wafer about an axis of rotation and translates the wafer along a linear trajectory. When the inspection spot is not aligned with the trajectory of the axis of rotation, an angular error is introduced in the representation of the position of the inspection spot with respect to the wafer by the rotary encoder. The angular error is corrected based on an angular error correction value. The angular error correction value is determined based on the distance between the inspection spot and the trajectory of the axis of rotation, the radial distance between the axis of rotation and the inspection spot at a first instance of a particular angular position, and a second radial distance between the axis of rotation and the inspection location at a second instance of the angular position.

    Abstract translation: 通过旋转检查系统将晶片在检查点下移动。 系统围绕旋转轴旋转晶片，并沿着线性轨迹平移晶片。 当检查点不与旋转轴线的轨迹对准时，通过旋转编码器在检查点相对于晶片的位置的表示中引入角度误差。 基于角度误差校正值校正角度误差。 角度误差校正值基于检查点与旋转轴线的轨迹之间的距离，旋转轴线与特定角度位置的第一阶段的检查点之间的径向距离和第二径向 在角位置的第二个实例处，旋转轴线与检查位置之间的距离。

    Method and System for Tilt and Height Control of a Substrate Surface in an Inspection System
    17.
    发明申请
    Method and System for Tilt and Height Control of a Substrate Surface in an Inspection System 有权
    检测系统中基体表面倾斜和高度控制的方法和系统

    公开(公告)号：US20140071457A1

    公开(公告)日：2014-03-13

    申请号：US14022305

    申请日：2013-09-10

    Applicant: Kla-Tencor Corporation

    Inventor： Zhongping Cai ,  Jingyi Xiong ,  Tyler Trytko ,  Alexander Slobodov ,  Paul Doyle ,  Anatoly Romanovsky

    IPC: G01N21/01

    CPC classification number: G01N21/01 ,  G01B5/0004 ,  G01N21/956

    Abstract: A system for substrate tilt and focus control in an inspection system includes a dynamically actuatable substrate stage assembly including a substrate stage for securing a substrate; a tilt-height detection system including: a height detection sub-system and a tilt detection sub-system. The system further includes a first actuator configured to selectably actuate the substrate along a direction perpendicular to the surface of the substrate at a location of the substrate stage assembly; and an additional actuator configured to selectably actuate the substrate along a direction substantially perpendicular to the surface of the substrate at an additional location of the substrate stage assembly; and a MIMO tilt-focus controller communicatively coupled to the height detection sub-system, the tilt detection sub-system, the first actuator and the additional actuator.

    Abstract translation: 用于检查系统中的基板倾斜和聚焦控制的系统包括可动态致动的基板台组件，其包括用于固定基板的基板台; 倾斜高度检测系统，包括：高度检测子系统和倾斜检测子系统。 该系统还包括第一致动器，其被配置为在衬底台组件的位置处沿着垂直于衬底的表面的方向可选择地致动衬底; 以及附加致动器，其构造成在衬底台组件的附加位置处沿着基本上垂直于衬底表面的方向可选择地致动衬底; 以及通信地耦合到高度检测子系统，倾斜检测子系统，第一致动器和附加致动器的MIMO倾斜对焦控制器。

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