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公开(公告)号:US10355160B2
公开(公告)日:2019-07-16
申请号:US15976308
申请日:2018-05-10
IPC分类号: H01L31/02 , H01L31/0264 , H01L31/0749 , H01L31/18 , H01L31/0216 , H01L31/032 , H01L31/072
摘要: A photovoltaic device and method include a substrate, a conductive layer formed on the substrate and an absorber layer formed on the conductive layer from a Cu—Zn—Sn containing chalcogenide material. An emitter layer is formed on the absorber layer and a buffer layer is formed on the emitter layer including an atomic layer deposition (ALD) layer. A transparent conductor layer is formed on the buffer layer.
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公开(公告)号:US09443997B2
公开(公告)日:2016-09-13
申请号:US13930975
申请日:2013-06-28
发明人: Tayfun Gokmen , Oki Gunawan , Richard A. Haight , Jeehwan Kim , David B. Mitzi , Mark T. Winkler
IPC分类号: H01L31/032 , H01L31/18
CPC分类号: H01L31/075 , H01L31/0322 , H01L31/0324 , H01L31/0326 , H01L31/0328 , H01L31/077 , H01L31/18 , Y02E10/541
摘要: A photovoltaic device includes a first contact and a hybrid absorber layer. The hybrid absorber layer includes a chalcogenide layer and a semiconductor layer in contact with the chalcogenide layer. A buffer layer is formed on the absorber layer, and a transparent conductive contact layer is formed on the buffer layer.
摘要翻译: 光伏器件包括第一接触和混合吸收层。 混合吸收层包括硫族化物层和与硫族化物层接触的半导体层。 在吸收层上形成缓冲层,在缓冲层上形成透明导电接触层。
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公开(公告)号:US09153729B2
公开(公告)日:2015-10-06
申请号:US13685126
申请日:2012-11-26
IPC分类号: H01L31/02 , H01L31/0264 , H01L31/18 , H01L31/0216 , H01L31/032 , H01L31/072
CPC分类号: H01L31/0749 , H01L31/02167 , H01L31/0326 , H01L31/072 , H01L31/18 , H01L31/1868 , Y02E10/50
摘要: A photovoltaic device and method include a substrate, a conductive layer formed on the substrate and an absorber layer formed on the conductive layer from a Cu—Zn—Sn containing chalcogenide material. An emitter layer is formed on the absorber layer and a buffer layer is formed on the emitter layer including an atomic layer deposition (ALD) layer. A transparent conductor layer is formed on the buffer layer.
摘要翻译: 光电器件和方法包括:衬底,形成在衬底上的导电层和由含有Cu-Zn-Sn的硫族化物材料形成在导电层上的吸收层。 在吸收层上形成发射极层,在包括原子层沉积(ALD)层的发射极层上形成缓冲层。 在缓冲层上形成透明导体层。
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公开(公告)号:US20150059855A1
公开(公告)日:2015-03-05
申请号:US14013827
申请日:2013-08-29
IPC分类号: H01L31/032 , H01L31/18
CPC分类号: H01L31/0327 , H01L31/0326 , H01L31/1864 , H01L31/1872 , Y02E10/50 , Y02P70/521
摘要: A method for fabricating a photovoltaic device includes forming a film including titanium on a conductive layer formed on a substrate. An absorber layer is formed including a Cu—Zn—Sn containing chalcogenide compound with a kesterite structure of the formula: Cu2-xZn1+ySn(S1-zSez)4+q wherein 0≦x≦1; 0≦y≦1; 0≦z≦1; −1≦q≦1 (CZTS) on the film. The absorber layer is annealed to diffuse titanium therein and to recrystallize the CZTS material of the film. A buffer layer is formed on the absorber layer, and a transparent conductive layer is formed on the buffer layer.
摘要翻译: 一种制造光伏器件的方法包括在形成在衬底上的导电层上形成包含钛的膜。 形成吸收层,其包含含有下式的K酯类结构的含有Cu-Zn-Sn的硫族化合物:Cu2-xZn1 + ySn(S1-zSez)4 + q其中0≦̸ x≦̸ 1; 0≦̸ y≦̸ 1; 0≦̸ z≦̸ 1; -1≦̸ q≦̸ 1(CZTS)上的电影。 将吸收层退火以在其中扩散钛并使膜的CZTS材料再结晶。 在吸收层上形成缓冲层,在缓冲层上形成透明导电层。
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公开(公告)号:US20150027521A1
公开(公告)日:2015-01-29
申请号:US13948645
申请日:2013-07-23
发明人: Keith E. Fogel , Jeehwan Kim , David B. Mitzi , Mark T. Winkler
IPC分类号: H01L31/0224 , H01L31/18
CPC分类号: H01L31/1888 , H01L31/022483 , H01L31/02366 , H01L31/0326 , H01L31/0749 , Y02E10/541
摘要: A method for forming a photovoltaic device includes forming a photovoltaic absorption stack on a substrate including one or more of I-III-VI2 and I2-II-IV-VI4 semiconductor material. A transparent conductive contact layer is deposited on the photovoltaic absorption stack at a temperature less than 200 degrees Celsius. The transparent conductive contact layer has a thickness of about one micron and is formed on a front light-receiving surface. The surface includes pyramidal structures due to an as deposited thickness. The transparent conductive contact layer is wet etched to further roughen the front light-receiving surface to reduce reflectance.
摘要翻译: 一种形成光伏器件的方法包括在包括I-III-VI2和I2-II-IV-VI4半导体材料中的一种或多种的衬底上形成光伏吸收堆叠。 透明导电接触层在低于200摄氏度的温度下沉积在光伏吸收层上。 透明导电接触层的厚度约为1微米,并形成在前光接收表面上。 该表面由于沉积厚度而包括金字塔形结构。 透明导电接触层被湿式蚀刻以进一步粗糙化前光接收表面以降低反射率。
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