公开(公告)号：US12131975B2

公开(公告)日：2024-10-29

申请号：US17728881

申请日：2022-04-25

Applicant: Hyundai Motor Company ,  Kia Corporation

Inventor： Hyeon Uk Kim ,  Hyun Koo Lee ,  Sung Won Park

IPC: H01L23/367 ,  H01L21/56 ,  H01L23/46 ,  H01L23/58

CPC classification number: H01L23/3675 ,  H01L21/565 ,  H01L23/46 ,  H01L23/585

Abstract: A power module that includes a semiconductor chip configured to generate heat, a metal layer electrically connected to the semiconductor chip to allow current to flow therethrough, a cooling channel facing the metal layer for dissipating heat out of the semiconductor chip, and a resin layer interposed between the metal layer and the cooling channel and integrally formed in an internal space of the power module.

公开(公告)号：US12122244B2

公开(公告)日：2024-10-22

申请号：US18134464

申请日：2023-04-13

Applicant: Hyundai Motor Company ,  Kia Corporation

Inventor： Myung Ill You ,  Hyun Koo Lee

IPC: B60L15/00 ,  H01L23/495 ,  H02M3/00 ,  H05K7/10

CPC classification number: B60L15/007 ,  H01L23/49541 ,  H01L23/49575 ,  H02M3/003 ,  H05K7/1015

Abstract: A power module for a vehicle includes: a circuit board provided with a first metallic layer; a first switching portion disposed on a center portion of the circuit board, and including a plurality of semiconductor chips; a second switching portion disposed on the outside the first switching portion on the circuit board and including a plurality of semiconductor chips; a third switching portion disposed on the outside the first switching portion on the circuit board; a lead frame disposed on one side of the circuit board; and a signal lead disposed on the other side of the circuit board.

公开(公告)号：US12028006B2

公开(公告)日：2024-07-02

申请号：US17985562

申请日：2022-11-11

Applicant: Hyundai Motor Company ,  Kia Corporation

Inventor： Myung Ill You ,  Hyun Koo Lee

IPC: H02M1/34 ,  H02M7/48 ,  H02P27/06

CPC classification number: H02P27/06 ,  H02M7/48

Abstract: An embodiment is power module including a plurality of first switching elements of a first type semiconductor on a first substrate, a plurality of second switching elements of a second type semiconductor and a third switching element of the first type semiconductor or the second type semiconductor on a second substrate, wherein the first substrate has a different thermal conductivity than the second substrate, and a connection spacer configured to electrically connect the first substrate and the second substrate.

公开(公告)号：US11935814B2

公开(公告)日：2024-03-19

申请号：US17407494

申请日：2021-08-20

Applicant: Hyundai Motor Company ,  Kia Corporation

Inventor： Hyun Koo Lee ,  Jun Hee Park ,  Sang Cheol Shin ,  Kang Ho Jeong

IPC: H05K7/20 ,  H01L23/46 ,  H02M7/00 ,  H02P27/08

CPC classification number: H01L23/46 ,  H02M7/003 ,  H02P27/08 ,  H05K7/20936

Abstract: A motor drive device includes: a first inverter including a plurality of first switching elements and connected to a plurality of coils; a second inverter including a plurality of second switching elements and connected to the plurality of coils; a plurality of transfer switching elements connected to the second ends; a capacitor disposed at one side of a casing of a motor; first and second cooling channels disposed at both sides of the capacitor; a plurality of first power modules including some of the plurality of first switching elements and some of the transfer switching elements; and a plurality of second power modules including some of the plurality of second switching elements.

公开(公告)号：US10211193B2

公开(公告)日：2019-02-19

申请号：US15612304

申请日：2017-06-02

Applicant: Hyundai Motor Company ,  Kia Motors Corporation

Inventor： Hyun Koo Lee ,  Woo Yong Jeon ,  Sang Cheol Shin

IPC: H01L25/18 ,  H01L23/04 ,  H01L25/065 ,  H05K1/02 ,  H01L23/538 ,  H05K1/14 ,  H01L23/498 ,  H01L23/367

Abstract: A hybrid-type power module having dual-sided cooling is provided. The power module includes semiconductor chips that is disposed on each of an upper board and a lower board at a location between the boards. The semiconductor chips of the upper board and the lower board have different electric capacities.

公开(公告)号：US20240222225A1

公开(公告)日：2024-07-04

申请号：US18347313

申请日：2023-07-05

Applicant: Hyundai Motor Company ,  Kia Corporation

Inventor： Suk Hyun Lim ,  Hyun Koo Lee ,  Sang Hun Lee ,  Se Heun Kwon ,  Ki Young Jang ,  Jun Hee Park

IPC: H01L23/473 ,  H01L23/00 ,  H01L25/07 ,  H01L25/18

CPC classification number: H01L23/473 ,  H01L24/37 ,  H01L24/40 ,  H01L25/072 ,  H01L25/18 ,  H01L2224/37013 ,  H01L2224/40137 ,  H01L2224/40175

Abstract: An embodiment liquid immersion-cooled power module includes an enclosure, an insulating liquid filling the enclosure, a substrate disposed inside the enclosure, the substrate having a plurality of cooling fins in thermal contact with the insulating liquid, and a chip on the substrate inside the enclosure. Another embodiment liquid immersion-cooled power module further includes a connection body electrically connecting the plurality of substrates to each other.

公开(公告)号：US11862537B2

公开(公告)日：2024-01-02

申请号：US17374553

申请日：2021-07-13

Applicant: Hyundai Motor Company ,  Kia Corporation

Inventor： Jun Hee Park ,  Nam Sik Kong ,  Hyun Koo Lee

IPC: H01L23/492 ,  H01L23/00 ,  H05K3/10 ,  H05K3/34

CPC classification number: H01L23/4924 ,  H01L24/32 ,  H01L24/73 ,  H05K3/107 ,  H05K3/3468 ,  H01L2224/2612 ,  H01L2224/32245 ,  H01L2224/73251

Abstract: A soldering structure configured for preventing solder overflow during soldering and a power module, may include a component to be soldered; and a metal layer having a bonding area, to which the component to be soldered is bonded by solder, and a groove portion formed around the bonding area.

公开(公告)号：US20230412106A1

公开(公告)日：2023-12-21

申请号：US17985562

申请日：2022-11-11

Applicant: Hyundai Motor Company ,  Kia Corporation

Inventor： Myung Ill You ,  Hyun Koo Lee

IPC: H02P27/06 ,  H02M7/48

CPC classification number: H02P27/06 ,  H02M7/48

Abstract: An embodiment is power module including a plurality of first switching elements of a first type semiconductor on a first substrate, a plurality of second switching elements of a second type semiconductor and a third switching element of the first type semiconductor or the second type semiconductor on a second substrate, wherein the first substrate has a different thermal conductivity than the second substrate, and a connection spacer configured to electrically connect the first substrate and the second substrate.

公开(公告)号：US20200343828A1

公开(公告)日：2020-10-29

申请号：US16580584

申请日：2019-09-24

Applicant: HYUNDAI MOTOR COMPANY ,  KIA MOTORS CORPORATION

Inventor： Hyun Koo Lee ,  Sung Won Park ,  Hyeon Uk Kim

IPC: H02M7/537 ,  H02M1/32

Abstract: An inverter includes: an upper module having three switching elements, among switching elements defining three poles of a three-phase inverter, which are connected to a positive electrode on a first substrate; and a lower module having three switching elements, among the switching elements defining the three poles of the three-phase inverter, connected to a negative electrode on a second substrate. The upper module and the lower module are configured to be stacked on each other, and a positive terminal of the upper module and a negative terminal of the lower module are stacked so as to be opposite each other with an insulator placed therebetween.