公开(公告)号：US20170329012A1

公开(公告)日：2017-11-16

申请号：US15526126

申请日：2015-11-09

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Bernhard Büttgen ,  Moshe Doron

IPC: G01S17/48 ,  G01S17/89 ,  G01B11/25

Abstract: The present disclosure describes optoelectronic modules that, in some implementations, address the need to combine precise measurements of scenes over a range of near and far distances. For example, an optoelectronic module can include a light emitter operable to direct modulated structured light onto a scene. The module includes an imager to receive reflected light signals from the scene. The imager includes demodulation pixels operable to provide amplitude and phase information based on the reflected light signals. Various techniques can be used to derive distance or three-dimensional information about the scene based on the signals from the pixels.

公开(公告)号：US20170034499A1

公开(公告)日：2017-02-02

申请号：US15300997

申请日：2015-03-31

Applicant: Heptagon Micro Optics Pte. Ltd.

Inventor： Moshe Doron ,  Ohad Meitav ,  Markus Rossi ,  Dmitry Ryuma ,  Alireza Yasan

IPC: H04N13/02 ,  H04N5/33 ,  G06T7/00 ,  H04N5/225

CPC classification number: H04N13/25 ,  G06T7/521 ,  G06T7/596 ,  G06T2207/10012 ,  G06T2207/10048 ,  H04N5/2256 ,  H04N5/332 ,  H04N2213/003

Abstract: The present disclosure describes structured-stereo imaging assemblies including separate imagers for different wavelengths. The imaging assembly can include, for example, multiple imager sub-arrays, each of which includes a first imager to sense light of a first wavelength or range of wavelengths and a second imager to sense light of a different second wavelength or range of wavelengths. Images acquired from the imagers can be processed to obtain depth information and/or improved accuracy. Various techniques are described that can facilitate determining whether any of the imagers or sub-arrays are misaligned.

Abstract translation: 本公开描述了包括用于不同波长的单独成像器的结构化立体成像组件。 成像组件可以包括例如多个成像器子阵列，每个成像器子阵列包括用于感测第一波长或波长范围的光的第一成像器和用于感测不同第二波长或波长范围的光的第二成像器。 可以处理从成像器获得的图像以获得深度信息和/或改进的准确度。 描述了可以便于确定是否任何一个成像器或子阵列不对准的各种技术。

公开(公告)号：US20160306265A1

公开(公告)日：2016-10-20

申请号：US14903217

申请日：2015-07-22

Applicant: HEPTAGON MICRO OPTICS PTE. LTD.

Inventor： Peter Riel ,  Markus Rossi ,  Daniel Pérez Calero ,  Matthias Gloor ,  Moshe Doron ,  Dmitry Bakin ,  Philippe Bouchilloux

IPC: G03B21/14 ,  G02B7/00 ,  G03B21/20

CPC classification number: G03B21/142 ,  G02B7/003 ,  G02B7/02 ,  G03B21/2033 ,  H01L27/14618 ,  H01L33/483 ,  H01L33/58 ,  H01L2933/0033 ,  H01L2933/0058

Abstract: This disclosure describes various modules that can provide ultra-precise and stable packaging for an optoelectronic device such as a light emitter or light detector. The modules include vertical alignment features that can be machined, as needed, during fabrication of the modules, to establish a precise distance between the optoelectronic device and an optical element or optical assembly disposed over the optoelectronic device.

Abstract translation: 本公开描述了可以为诸如光发射器或光检测器的光电子器件提供超精密和稳定的封装的各种模块。 这些模块包括在模块制造期间可以根据需要加工的垂直对准特征，以在光电器件与设置在光电器件上的光学元件或光学组件之间建立精确的距离。