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公开(公告)号：US10461497B1
公开(公告)日：2019-10-29
申请号：US16233112
申请日：2018-12-27
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Hsien-Ying Chou , Chun-Ta Chen , Fu-Cheng Wei , Chih-Lin Liao
Abstract: A light emitting device includes a substrate, a light emitting element, a shielding layer, and a collimator. The light emitting element is embedded in the substrate. The shielding layer is disposed on the substrate and has an opening exposing the light emitting element. The collimator is disposed on the shielding layer.
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公开(公告)号：USD1027182S1
公开(公告)日：2024-05-14
申请号：US29849777
申请日：2022-08-15
Applicant: Interface Technology (ChengDu) Co., Ltd. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Designer： Chun-Ming Cheng , Chih-Lin Liao , Yi-Chia Chiu , Chun-Ta Chen , Po-Lun Chen
Abstract: FIG. 1 is a front perspective view of a heart monitor showing our design.
FIG. 2 is a rear perspective view of the heart monitor in FIG. 1.
FIG. 3 is a front elevation view of the heart monitor in FIG. 1.
FIG. 4 is a rear elevation view of the heart monitor in FIG. 1.
FIG. 5 is a left side elevation view of the heart monitor in FIG. 1.
FIG. 6 is a right side elevation view of the heart monitor in FIG. 1.
FIG. 7 is a top plan view of the heart monitor in FIG. 1; and,
FIG. 8 is a bottom plan view of the heart monitor in FIG. 1.
The broken lines in the drawings are employed to show unclaimed portions of the heart monitor, and form no part of the claimed design.-
公开(公告)号：US11715423B2
公开(公告)日：2023-08-01
申请号：US17547476
申请日：2021-12-10
Applicant: Interface Technology (ChengDu) Co., Ltd. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , INTERFACE OPTOELECTRONICS (WUXI) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： Ya-Chu Hsu , Po-Ching Lin , Po-Lun Chen , Chun-Ta Chen
IPC: G09G3/3258
CPC classification number: G09G3/3258
Abstract: A plurality of package units is on a surface of a substrate, and a driving circuit is on the surface of the substrate. Each package unit includes at least one pixel, and each pixel is provided with a plurality of light-emitting elements. The driving circuit electrically connects to the light-emitting elements and is configured to transmit a plurality of gate driving signals and a plurality of data signals to drive the plurality of light-emitting elements to emit light to display images. The driving circuit is partially in the package units and is partially between adjacent package units. The substrate and a portion of the driving circuit between adjacent package units are made to be stretchable, while the package units are not stretchable.
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公开(公告)号：US11569207B2
公开(公告)日：2023-01-31
申请号：US17209468
申请日：2021-03-23
Applicant: Interface Technology (ChengDu) Co., Ltd. , INTERFACE OPTOELECTRONICS (SHENZHEN) CO., LTD. , GENERAL INTERFACE SOLUTION LIMITED
Inventor： Chien-Yu Huang , Po-Lun Chen , Chun-Ta Chen , Po-Ching Lin , Ya-Chu Hsu , Chia-Ming Fan , Ping-Hsiang Kao
IPC: H01L25/075 , H01L33/00 , H01L33/58 , G02B27/01
Abstract: A light source assembly, a method for making same, and a display device using same are disclosed. The light source assembly includes a circuit substrate, an opaque and light-reflecting colloidal layer on the circuit substrate, micro light-emitting elements electrically connected to the circuit substrate, a base layer, a layer of convex lenses, and a layer of immediately-adjacent concave lenses. The colloidal layer defines grooves. At least two micro light-emitting elements each emitting light of a different color are arranged in each groove. The base layer is infilled into each groove and covers each micro light-emitting element. Each groove is covered by a convex lens which converges the emitted light. Each concave lens, covering one convex lens, substantially corrects optical path deviations of light of different wavelengths (that is, different colors), so reducing chromatic aberrations.
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公开(公告)号：US11515459B2
公开(公告)日：2022-11-29
申请号：US17158020
申请日：2021-01-26
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Ping-Hsiang Kao , Po-Lun Chen , Chun-Ta Chen , Po-Ching Lin , Ya-Chu Hsu , Chia-Ming Fan , Chien-Yu Huang
Abstract: The present invention relates to a micro light-emitting diode display panel and a method for producing the same. A backplane and a light-emitting diode display layer are subjected to a bonding process to form eutectic structures between the backplane and light-emitting diodes of the light-emitting diode display layer. Then, an adhesive bonding layer including a resin material and conducting materials is formed on a surface of the backplane, and a heating process is performed, thereby causing the conducting materials to form a plurality of metallic bridge connection structures. Therefore, a bonding between the light-emitting diode and the backplane is reinforced, and tensile strength of the micro light-emitting diode display panel is enhanced.
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Patent Agency Ranking
公开(公告)号：US20220199596A1
公开(公告)日：2022-06-23
申请号：US17147729
申请日：2021-01-13
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Po-Lun Chen , Chun-Ta Chen , Po-Ching Lin
Abstract: The present invention is a display and manufacturing method thereof, including a thin film substrate, a plurality of packaging layers, and a stretch-resistant unit, wherein one side of the thin film substrate has a plurality of pixel areas, each pixel area contains at least one light-emitting element, and each packaging layer respectively covers one of the pixel areas to form an island-shape structure, and there is a spacing between any two adjacent island-shape structures, and each stretch-resistant unit deposed at the spacing and connects the adjacent island-shape structures.
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公开(公告)号：US11961489B1
公开(公告)日：2024-04-16
申请号：US18064278
申请日：2022-12-11
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： De-Fu Chen , Po Lun Chen , Chun-Ta Chen , Ta-Jen Huang , Po-Tsun Liu , Guang-Ting Zheng , Ting-Yi Yi
CPC classification number: G09G3/3674 , G09G2310/08 , G09G2320/0214 , G09G2330/021
Abstract: The present disclosure provides a scan driving circuit, which includes a pull-up output charging circuit, a pull-down discharge circuit, a pre-charge circuit, an anti-noise start-up circuit and an anti-noise pull-down discharge circuit. The pull-up output charging circuit is electrically connected to an output terminal, and the pull-down discharge circuit is electrically connected to the output terminal. The pre-charge circuit is electrically connected to the pull-up output charging circuit and the pull-down discharge circuit through a driving node. The anti-noise start-up circuit is electrically connected to the pre-charge circuit. The anti-noise pull-down discharge circuit is electrically connected to the anti-noise start-up circuit, and the anti-noise pull-down discharge circuit is electrically connected to the driving node.
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公开(公告)号：US11527516B2
公开(公告)日：2022-12-13
申请号：US17152749
申请日：2021-01-19
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
Inventor： Chia-Ming Fan , Po-Lun Chen , Chun-Ta Chen , Po-Ching Lin , Ya-Chu Hsu , Chien-Yu Huang , Ping-Hsiang Kao
IPC: H01L25/075 , H01L33/54 , H01L33/56 , H01L33/58
Abstract: A micro light-emitting diode (micro LED) display and a package method thereof are described. The micro LED display includes a substrate, various micro LED chips, and an encapsulation film. The substrate includes a wire. The micro LED chips are disposed on a surface of the substrate and are electrically connected to the wire. A light-emitting surface of each of the micro LED chips is set with at least one micro structure, and each micro structure has a top end. The encapsulation film encapsulates the micro LED chips, and covers the surface of the substrate. The top ends of the micro structures are located in a light-emitting surface of the encapsulation film.
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公开(公告)号：US11468863B2
公开(公告)日：2022-10-11
申请号：US17199471
申请日：2021-03-12
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , Interface Optoelectronics (Wuxi) Co., Ltd. , General Interface Solution Limited
Inventor： Po-Lun Chen , Chun-Ta Chen , Chih-Lin Liao , Fu-Cheng Wei , Po-Tsun Liu , Guang-Ting Zheng , Ping-Hung Hsieh
IPC: G09G3/36
Abstract: A gate driving circuit includes a bootstrapping circuit, a pre-charge circuit, and an output control circuit. The bootstrapping circuit is composed of a bootstrapping capacitor and a transistor. A first terminal of the bootstrapping capacitor has a first voltage during a first duration. The pre-charge circuit is connected to the first terminal of the bootstrapping capacitor. The pre-charge circuit boosts the first terminal of the bootstrapping capacitor from the first voltage to a second voltage during a second duration. The bootstrapping circuit boosts the first terminal of the bootstrapping capacitor from the second voltage to a third voltage during a third duration. The output control circuit is connected to the first terminal of the bootstrapping capacitor. The output control circuit boosts the first terminal of the bootstrapping capacitor from the third voltage to a fourth voltage during a fourth duration.
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公开(公告)号：US11320945B1
公开(公告)日：2022-05-03
申请号：US17306962
申请日：2021-05-04
Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , Interface Optoelectronics (Wuxi) Co., Ltd. , General Interface Solution Limited
Inventor： Hsien-Ying Chou , Po-Lun Chen , Chun-Ta Chen , Chih-Lin Liao , Fu-Cheng Wei , Po-Ching Lin
Abstract: A touch panel includes a substrate, a first electrode layer, and a second electrode layer. The first electrode layer is disposed over the substrate. The first electrode layer includes a plurality of first receiving electrodes, and the first receiving electrodes are separated from each other, extend along a first direction, and are arranged along a second direction substantially perpendicular to the first direction. The second electrode layer is disposed over the substrate and is electrically insulated from the first electrode layer. The second electrode layer includes a driving electrode and a second receiving electrode. The driving electrode extends along the first direction. The second receiving electrode is separated from the driving electrode and extends along the first direction.
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