Invention Grant
- Patent Title: Micro light-emitting diode display panel and method for producing the same
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Application No.: US17158020Application Date: 2021-01-26
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Publication No.: US11515459B2Publication Date: 2022-11-29
- Inventor: Ping-Hsiang Kao , Po-Lun Chen , Chun-Ta Chen , Po-Ching Lin , Ya-Chu Hsu , Chia-Ming Fan , Chien-Yu Huang
- Applicant: Interface Technology (ChengDu) Co., Ltd. , Interface Optoelectronics (ShenZhen) Co., Ltd. , General Interface Solution Limited
- Applicant Address: CN Sichuan; CN Guangdong; TW Miaoli County
- Assignee: Interface Technology (ChengDu) Co., Ltd.,Interface Optoelectronics (ShenZhen) Co., Ltd.,General Interface Solution Limited
- Current Assignee: Interface Technology (ChengDu) Co., Ltd.,Interface Optoelectronics (ShenZhen) Co., Ltd.,General Interface Solution Limited
- Current Assignee Address: CN Sichuan; CN Guangdong; TW Miaoli County
- Agency: CKC & Partners Co., LLC
- Priority: CN202011531349.X 20201222
- Main IPC: H01L33/62
- IPC: H01L33/62 ; H01L33/00 ; H01L27/15 ; H01L33/56

Abstract:
The present invention relates to a micro light-emitting diode display panel and a method for producing the same. A backplane and a light-emitting diode display layer are subjected to a bonding process to form eutectic structures between the backplane and light-emitting diodes of the light-emitting diode display layer. Then, an adhesive bonding layer including a resin material and conducting materials is formed on a surface of the backplane, and a heating process is performed, thereby causing the conducting materials to form a plurality of metallic bridge connection structures. Therefore, a bonding between the light-emitting diode and the backplane is reinforced, and tensile strength of the micro light-emitting diode display panel is enhanced.
Public/Granted literature
- US20220199872A1 MICRO LIGHT-EMITTING DIODE DISPLAY PANEL AND METHOD FOR PRODUCING THE SAME Public/Granted day:2022-06-23
Information query
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