公开(公告)号：US10231333B1

公开(公告)日：2019-03-12

申请号：US14307201

申请日：2014-06-17

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed ,  David Geiger ,  Murad Kurwa

IPC: H05K1/09 ,  H05K3/42 ,  H05K1/11

Abstract: Methods of making a copper interconnect plated through hole assembly are disclosed. Nano copper ink dispersed in an organic solvent is able to be filled in the plated through hole and forming the copper interconnect by sintering at a temperature below the melting of the copper.

公开(公告)号：US09674950B1

公开(公告)日：2017-06-06

申请号：US14268775

申请日：2014-05-02

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Zhen Feng ,  Anwar Mohammed

IPC: H05K1/11 ,  H05K1/14 ,  H05K1/03 ,  H05K3/32

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: An electronics assembly includes one or more electronic components coupled to a fabric. Each electronic component includes one or more electrical connection points, such as a bond pad or solder bump. The electronics assembly also includes one or more metal foils, one metal foil coupled to one electrical connection point on an electronic component. The metal foil is stitched to the fabric by an electrically conductive wire, thereby providing an electrical connection between the electronic component and the electrically conductive wire via the metal foil.

公开(公告)号：US09659359B1

公开(公告)日：2017-05-23

申请号：US14704822

申请日：2015-05-05

Applicant: Flextronics AP, LLC

Inventor： Zhen Feng ,  Weifeng Liu ,  David Geiger ,  Anwar Mohammed ,  Murad Kurwa

IPC: G06K9/00 ,  G06T7/00 ,  G06K9/52 ,  G06T11/20

CPC classification number: G06T7/0004 ,  G01N21/9501 ,  G01N21/956 ,  G01N2021/95646 ,  G06T11/206 ,  G06T2207/30152

Abstract: Methods of and Devices for quality control that can be used with automated optical inspection (AOI), solder paste inspection (SPI), and automated x-ray inspection (AXI) are disclosed. Plurality of threshold settings are entered in a testing process. Multiple testing results are obtained from the testing process. A graphic presentation is generated showing the numerical relationship among the data points, such that a quality control person is able to fine-tune the testing process to have a predetermined ratio of Defect Escaped % to False Call ppm.

公开(公告)号：US09593939B1

公开(公告)日：2017-03-14

申请号：US14584951

申请日：2014-12-29

Applicant: Flextronics AP, LLC

Inventor： Hongqiang Xie ,  An Qi Zhao ,  Jiyang Zhang ,  Zhen Feng ,  David Geiger

IPC: G01B11/06 ,  G01B7/00 ,  H05K1/00 ,  G01B17/02 ,  H05K1/02

CPC classification number: G01B11/0625 ,  G01B11/06 ,  G01B11/0608 ,  G01B11/0691 ,  G01B17/025 ,  H05K1/00 ,  H05K1/0266

Abstract: A glue thickness inspection system automates a thickness measurement functionality for determining the thickness of both non-transparent and transparent materials including, but not limited to, glue, gel, solder and epoxy. The glue thickness inspection system includes a laser detector, a movable platform for positioning a unit under test, and a controller for controlling movement of the platform, angle of the laser detector, and calculation of the transparent material thickness. The laser detector includes a laser for emitting a laser light onto the unit under test and a sensor for receiving corresponding reflected light. The sensed data is used by the controller to determine the transparent material thickness.

Abstract translation: 胶水厚度检查系统自动化厚度测量功能，用于确定不透明和透明材料的厚度，包括但不限于胶，凝胶，焊料和环氧树脂。 胶水厚度检查系统包括激光检测器，用于定位被测单元的可移动平台，以及用于控制平台运动的控制器，激光检测器的角度以及透明材料厚度的计算。 激光检测器包括用于将激光发射到被测单元上的激光器和用于接收相应的反射光的传感器。 感测数据由控制器用于确定透明材料厚度。

公开(公告)号：US09338915B1

公开(公告)日：2016-05-10

申请号：US14228021

申请日：2014-03-27

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng

IPC: H05K1/16 ,  H05K1/18 ,  H05K3/30 ,  H05K7/02 ,  H05K3/10

CPC classification number: H01M6/40 ,  A41D1/002 ,  A41D1/005 ,  D05B17/00 ,  H01M2/08 ,  H01M6/12 ,  H01M10/0436 ,  H01R4/00 ,  H01R4/02 ,  H01R4/029 ,  H01R43/005 ,  H01R43/02 ,  H01R43/0235 ,  H05K1/0271 ,  H05K1/0296 ,  H05K1/0298 ,  H05K1/0306 ,  H05K1/0366 ,  H05K1/0373 ,  H05K1/038 ,  H05K1/0393 ,  H05K1/09 ,  H05K1/11 ,  H05K1/111 ,  H05K1/112 ,  H05K1/115 ,  H05K1/18 ,  H05K1/181 ,  H05K1/189 ,  H05K3/284 ,  H05K3/30 ,  H05K3/305 ,  H05K3/32 ,  H05K3/4015 ,  H05K3/42 ,  H05K3/4644 ,  H05K7/02 ,  H05K9/009 ,  H05K13/04 ,  H05K2201/0154 ,  H05K2201/0158 ,  H05K2201/0162 ,  H05K2201/0287 ,  H05K2201/05 ,  H05K2201/09418 ,  H05K2201/09818

Abstract: A wearable electronics assembly includes one or more electronic modules coupled to a wearable electronics fabric. Each of the one or more electronic modules includes one or more plated through holes, through each of which is coupled an electrically conductive wire. The electrically conductive wire is stitched through the plated through hole and to a fabric onto which the electronic module is attached. The electronic module can include one or more electronic components coupled to a printed circuit board.

Abstract translation: 可穿戴电子组件包括耦合到可穿戴电子织物的一个或多个电子模块。 一个或多个电子模块中的每一个包括一个或多个电镀通孔，每个电镀通孔中的每一个都连接有导电线。 导电线穿过电镀通孔和连接电子模块的织物。 电子模块可以包括耦合到印刷电路板的一个或多个电子部件。

公开(公告)号：US09336476B1

公开(公告)日：2016-05-10

申请号：US14483002

申请日：2014-09-10

Applicant: Flextronics AP, LLC

Inventor： Weifeng Liu ,  Anwar Mohammed ,  Zhen Feng ,  Murad Kurwa

IPC: G06K19/077

CPC classification number: G06K19/07754 ,  G06K19/027

Abstract: An RFID device assembly is fabricated by stitching an electrically conductive wire into a fabric as a pattern that forms an antenna. The two ends of the electrically conductive wire are positioned for coupling to antenna contact pads on an RFID device. The RFID device is attached to the fabric either before or after the electrically conductive wire is stitched to the fabric.

Abstract translation: 通过将导电线缝合成织物作为形成天线的图案来制造RFID器件组件。 导电线的两端被定位成耦合到RFID设备上的天线接触焊盘。 在将导电线缝合到织物之前或之后，将RFID装置附接到织物上。