公开(公告)号：US10571161B2

公开(公告)日：2020-02-25

申请号：US15656711

申请日：2017-07-21

Applicant: Electronics and Telecommunications Research Institute

Inventor： Junsoo Kim ,  Jungyun Kwon ,  Seungeon Moon ,  Seung Min Lee ,  Jaewoo Lee ,  Solyee Im

IPC: F25B19/00 ,  F25B39/02 ,  F25B41/04 ,  F16K31/00 ,  F16K99/00

Abstract: Provided is a cooling device including a valve structure including a temperature-responsive material that changes in volume in response to changes in temperature, a supporting structure, which is joined to the valve structure and supports the valve structure, and a solvent which contacts the valve structure, wherein a portion of the solvent contacts the valve structure and another portion of the solvent is externally exposed, the valve structure changes in volume in response to changes in temperature and thereby regulating the externally exposed surface area of the solvent.

公开(公告)号：US11502555B2

公开(公告)日：2022-11-15

申请号：US17246244

申请日：2021-04-30

Applicant: ELECTRONICS AND TELECOMMUNICATIONS RESEARCH INSTITUTE

Inventor： Sang-Won Kim ,  Ho Jin Lee ,  In Kui Cho ,  Seong-Min Kim ,  Jung Ick Moon ,  Jang Yeol Kim ,  Je Hoon Yun ,  Jaewoo Lee ,  Hyunjoon Lee ,  Dong Won Jang

IPC: H02J50/80 ,  H02J50/10 ,  H02J50/90 ,  H02J50/40

Abstract: A wireless power transmission system and method are disclosed. The wireless power transmission system includes a plurality of wireless power transmitters configured to provide power to a plurality of wireless power receivers, and a controller configured to control the wireless power transmitters based on information of the wireless power receivers. The controller is configured to receive information of a wireless power receiver from the wireless power receiver, calculate a transmission parameter associated with a transmission efficiency of power to be provided to the wireless power receiver using the information of the wireless power receiver, and provide power to the wireless power receiver through the wireless power transmitters based on the transmission parameter.

公开(公告)号：US09210515B2

公开(公告)日：2015-12-08

申请号：US14243755

申请日：2014-04-02

Applicant: Electronics and Telecommunications Research Institute

Inventor： Jaewoo Lee ,  Chang Han Je ,  Woo Seok Yang ,  Jong-Kee Kwon

IPC: H04R25/00 ,  H04R19/00

CPC classification number: H04R19/005 ,  H04R2201/003

Abstract: Provided are an acoustic sensor and a method of manufacturing the same. The acoustic sensor includes a substrate including an acoustic chamber, a first hole, and a second hole, penetrating the substrate, a lower electrode pad extended onto a top surface of the substrate while covering a sidewall of the first hole, a diaphragm pad extended onto the top surface of the substrate while covering a sidewall of the second hole, a lower electrode provided on the acoustic chamber and connected to the lower electrode pad, and a diaphragm above the lower electrode while being separated from the lower electrode and connected to the diaphragm pad.

Abstract translation: 提供一种声传感器及其制造方法。 该声学传感器包括：衬底，包括穿透衬底的声学室，第一孔和第二孔;延伸到衬底顶表面上的下电极焊盘，同时覆盖第一孔的侧壁， 衬底的顶表面，同时覆盖第二孔的侧壁，设置在声学室上并连接到下电极焊盘的下电极，以及在与下电极分离并连接到隔膜的下电极之上的膜片 垫。

公开(公告)号：US08912613B2

公开(公告)日：2014-12-16

申请号：US13909477

申请日：2013-06-04

Applicant: Electronics and Telecommunications Research Institute

Inventor： Hyung-Kun Lee ,  Seungeon Moon ,  Nak Jin Choi ,  Jaewoo Lee

IPC: H01L27/14 ,  G01N27/12

CPC classification number: G01N27/128 ,  G01N27/123

Abstract: Provided are a dual-side micro gas sensor and a method of fabricating the same. The sensor may include an elastic layer, a heat-generating resistor layer on the elastic layer, an interlayered insulating layer on the heat-generating resistor layer, an upper sensing layer on the interlayered insulating layer, and a lower sensing layer provided below the elastic layer to face the heat-generating resistor layer, thereby reducing heat loss of the heat-generating resistor layer.

Abstract translation: 提供双面微气体传感器及其制造方法。 传感器可以包括弹性层，弹性层上的发热电阻层，发热电阻层上的层间绝缘层，层间绝缘层上的上感测层，以及设置在弹性层下方的下感测层 面对发热电阻层，从而减少发热电阻层的热损失。