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公开(公告)号：US20240007016A1
公开(公告)日：2024-01-04
申请号：US18467714
申请日：2023-09-14
Applicant: DENSO CORPORATION
Inventor： TOSHIHIRO FUJITA , ATSUSHI SAITO
Abstract: An electronic device includes an upper and lower arm module including an upper arm element and a lower arm element as one module, a relay module including one relay element that switches connection and disconnection between the upper and lower arm module and an output terminal, and a peripheral component including at least one of a current detection element and a noise removal element. The upper and lower arm module, the relay module and the output terminal are arranged in this order along a direction from a centerline of the substrate toward an outer end of the substrate on a same surface of a substrate. The peripheral component is arranged side by side with the relay module in a region between the upper and lower arm module and the output terminal.
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公开(公告)号：US20220223501A1
公开(公告)日：2022-07-14
申请号：US17657064
申请日：2022-03-29
Applicant: DENSO CORPORATION
Inventor： SYUHEI MIYACHI , TOSHIHIRO FUJITA , ATSUSHI SAITOU , NOBORU NAGASE
IPC: H01L23/495 , H01L23/31 , B62D5/04
Abstract: A semiconductor module includes: semiconductor elements having a gate electrode, a first electrode and a second electrode; a resin mold; and conductive members connected to at least one of the semiconductor elements and having a common wiring electrode exposed from the resin mold and connected to the first electrode or the second electrode and a non-common wiring electrode exposed from the resin mold and connected to an electrode of the semiconductor element different from the common wiring electrode. A width of a common wiring connected to the common wiring electrode is wider than the non-common wiring electrode. The common wiring is arranged from one side to an opposite side on a surface of the resin mold, on which the common wiring electrode is exposed, without being electrically connected to the non-common wiring electrode.
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