公开(公告)号：US12167567B2

公开(公告)日：2024-12-10

申请号：US17498164

申请日：2021-10-11

Applicant: Cisco Technology, Inc.

Inventor： Vic Hong Chia ,  Yongguo Chen ,  Yaotsan Tsai ,  Hua Yang ,  Xin Mao

IPC: H05K7/20 ,  F04D29/66 ,  G10K11/16 ,  H05K9/00

Abstract: A fan silencer module includes a housing having a first end of the housing, a second end of the housing, and an interior surface between the first end of the housing and the second end of the housing. Acoustic absorbing material is disposed on the interior surface. A honeycomb air flow director is disposed at the second end of the housing. And an electromagnetic interference gasket surrounds an outer edge of the honeycomb air flow director. In an embodiment, a depth of the electromagnetic interference gasket is at least as deep as a depth of the honeycomb air flow director. Also provided is a handle, and a latch actuator, to enable removal and replacement of the fan silencer module and an associated fan module from a chassis.

公开(公告)号：US20230389224A1

公开(公告)日：2023-11-30

申请号：US17826520

申请日：2022-05-27

Applicant: Cisco Technology, Inc.

Inventor： Vic Hong Chia ,  Yongguo Chen ,  Yaotsan Tsai ,  Hua Yang ,  Xin Mao

IPC: H05K7/20

CPC classification number: H05K7/20172 ,  H05K7/20145

Abstract: A fan assembly comprises: a fan having a fan intake and a fan exit downstream from the fan intake, wherein the fan is configured to draw air into the fan intake and propel the air downstream through the fan exit; a housing having a housing inlet configured to be coupled to the fan exit and a housing outlet downstream from the housing inlet; and an air guider, mounted inside the housing adjacent to the housing inlet, having a conical shape with a base adjacent to the housing inlet and an apex opposite the base that points towards the housing outlet, wherein the air guider has a first diameter that tapers from the base to the apex, wherein the first diameter is less than a second diameter of the housing to define a peripheral volume surrounding the air guider that serves as a tunnel, wherein the air guider is configured to reduce air turbulence of the air when the air propelled from the housing inlet to the housing outlet.

公开(公告)号：US11758689B2

公开(公告)日：2023-09-12

申请号：US17242722

申请日：2021-04-28

Applicant: Cisco Technology, Inc.

Inventor： Yaotsan Tsai ,  Yongguo Chen ,  Hua Yang ,  Vic Hong Chia

IPC: H05K7/20

CPC classification number: H05K7/20336 ,  H05K7/20509

Abstract: Presented herein is a cold plate assembly including a sub-plate and a vapor chamber for use as part of a remote fin cooling system for an electronic device. The sub-plate includes a first surface, a second surface, and a plurality of pipes. The vapor chamber includes a first wall and a second wall opposite the first wall. The first wall and the second wall define an interior cavity having a first depth for one or more first portions of the vapor chamber and a second depth for one or more second portions of the vapor chamber. The second surface of the sub-plate is attached to the first wall of the vapor chamber.

公开(公告)号：US20230118952A1

公开(公告)日：2023-04-20

申请号：US17503000

申请日：2021-10-15

Applicant: Cisco Technology, Inc.

Inventor： Paul Ton ,  Yaotsan Tsai

IPC: H05K1/02 ,  H05K7/20

Abstract: A heat sink component includes a cold plate including a first surface configured to engage a circuit component and a second surface opposing the first surface, and a plurality of fins extending transversely from the second surface of the cold plate. The first surface includes a non-planar surface portion and a planar surface portion surrounding the non-planar surface portion. The non-planar surface portion of the cold plate provides an adaptive contour to complement a surface of a circuit component that experiences thermal warpage due to change in temperature during operation.