公开(公告)号：US11751322B2

公开(公告)日：2023-09-05

申请号：US17703051

申请日：2022-03-24

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

CPC classification number: H05K1/0239 ,  H05K1/0242 ,  H05K2201/09245

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.

公开(公告)号：US11330702B2

公开(公告)日：2022-05-10

申请号：US17079970

申请日：2020-10-26

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.

公开(公告)号：US20210337657A1

公开(公告)日：2021-10-28

申请号：US17079970

申请日：2020-10-26

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal is applied to the structure that is in the GHz frequency range.

公开(公告)号：US20140119703A1

公开(公告)日：2014-05-01

申请号：US13661095

申请日：2012-10-26

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Scott Hinaga ,  David Senk ,  Brice Achkir

IPC: H05K3/00 ,  G02B6/10

CPC classification number: G02B6/138 ,  G02B6/1221 ,  G02B6/43 ,  H05K1/0274 ,  H05K3/4652 ,  H05K2201/0187 ,  Y10T156/10 ,  Y10T156/1082

Abstract: A printed circuit board (PCB) may be provided. The PCB may comprise a first electrically conductive layer comprising a first signal layer. Also, the PCB may comprise a second electrically conductive layer comprising a second signal layer or a plane layer associated with the first signal layer. The PCB may further comprise a waveguide layer disposed between the first electrically conductive layer and adjacent the second electrically conductive layer. The waveguide layer may transmit optical signals and function as a dielectric between the first electrically conductive layer and the second electrically conductive layer.

Abstract translation: 可以提供印刷电路板（PCB）。 PCB可以包括包括第一信号层的第一导电层。 而且，PCB可以包括第二导电层，其包括与第一信号层相关联的第二信号层或平面层。 PCB还可以包括布置在第一导电层之间并且邻近第二导电层的波导层。 波导层可以传输光学信号并且用作第一导电层和第二导电层之间的电介质。