公开(公告)号：US20240175650A1

公开(公告)日：2024-05-30

申请号：US18427369

申请日：2024-01-30

Applicant: Cisco Technology, Inc.

Inventor： M. Baris Dogruoz ,  Mehmet Onder Cap ,  D. Brice Achkir ,  Joel Richard Goergen

IPC: F28F21/02 ,  F28D21/00 ,  F28F3/04

CPC classification number: F28F21/02 ,  F28D21/00 ,  F28F3/04 ,  F28D2021/0029 ,  F28F2280/06

Abstract: In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.

公开(公告)号：US20230354505A1

公开(公告)日：2023-11-02

申请号：US18337724

申请日：2023-06-20

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

CPC classification number: H05K1/0239 ,  H05K1/0242 ,  H05K2201/09245

Abstract: A conductive signal transmission structure for a printed circuit includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps and/or a Nyquist frequency that is at least about 14 gigahertz (GHz).

公开(公告)号：US11644500B2

公开(公告)日：2023-05-09

申请号：US17480773

申请日：2021-09-21

Applicant: Cisco Technology, Inc.

Inventor： Mohammed Ghouse ,  Shailesh Nayak ,  Damaruganath Pinjala ,  Rohit Dev Gupta ,  Mehmet Onder Cap

IPC: G01R31/28 ,  H05K1/02 ,  H05K1/18

CPC classification number: G01R31/2808 ,  G01R31/2817 ,  H05K1/0209 ,  H05K1/181 ,  H05K2201/064

Abstract: In one example, a first tubular member has a first diameter and is configured to attach to a printed circuit board. A second tubular member has a second diameter different from the first diameter and is configured to hold an environmental sensor for collecting data relating to an environment of the printed circuit board. The second tubular member is vertically adjustable relative to the first tubular member.

公开(公告)号：US10912218B1

公开(公告)日：2021-02-02

申请号：US16571588

申请日：2019-09-16

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Mehmet Onder Cap ,  Marc Henry Mantelli ,  Giridharan Rajagopalan ,  M. Baris Dogruoz ,  Robert Gregory Twiss ,  Joel Richard Goergen

IPC: H05K5/03 ,  H05K7/14 ,  H05K5/02 ,  H01R13/453 ,  H01R12/71 ,  H01R12/70 ,  H01R13/52 ,  H01R13/447

Abstract: In one embodiment, an apparatus includes a cover configured for installation over a connector mounted on a printed circuit board and operable to couple a module to the printed circuit board, the cover comprises a lower surface for contact with the printed circuit board and a slot for receiving the module for attachment of the module to the connector. The cover encloses contacts at the connector for mating with the module and the printed circuit board to prevent corrosion of the contacts.

公开(公告)号：US20240215196A1

公开(公告)日：2024-06-27

申请号：US18596926

申请日：2024-03-06

Applicant: Cisco Technology, Inc.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

CPC classification number: H05K7/20154 ,  H05K1/0203 ,  H05K2201/066

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

公开(公告)号：US20220228820A1

公开(公告)日：2022-07-21

申请号：US17154785

申请日：2021-01-21

Applicant: CISCO TECHNOLOGY, INC.

Inventor： M. Baris Dogruoz ,  Mehmet Onder Cap ,  D. Brice Achkir ,  Joel Richard Goergen

IPC: F28F21/02 ,  F28F3/04 ,  F28D21/00

Abstract: In one embodiment, a thermal management device includes a heat sink base and heat sink fins comprising a single element formed from a plurality of graphene layers with carbon nanotubes interposed between the graphene layers. A method is also disclosed herein.

公开(公告)号：US20220217837A1

公开(公告)日：2022-07-07

申请号：US17703051

申请日：2022-03-24

Applicant: Cisco Technology, Inc.

Inventor： Joel Goergen ,  Scott Hinaga ,  Jessica Kiefer ,  Alpesh Umakant Bhobe ,  D. Brice Achkir ,  David Nozadze ,  Amendra Koul ,  Mehmet Onder Cap ,  Madeline Marie Roemer

IPC: H05K1/02

Abstract: A conductive signal transmission structure for an electronic device (e.g., a printed circuit board of an electronic device) includes a copper material and a graphene layer disposed within the copper material at a depth below a surface of the structure. The depth of the graphene layer is further within a skin depth region of the structure when a transmission signal applied to the conductive signal transmission structure has a signal speed of at least 112 Gbps.

公开(公告)号：US20220078941A1

公开(公告)日：2022-03-10

申请号：US17528379

申请日：2021-11-17

Applicant: Cisco Technology, Inc.

Inventor： Mehmet Onder Cap ,  Manigandan Boopalan ,  Joel Richard Goergen ,  Sandeep Mehdiratta ,  Manjunatha Reddy Shivashankara ,  Damaruganath Pinjala

IPC: H05K7/20 ,  H05K1/02

Abstract: In one embodiment, an apparatus includes a chassis base, a printed circuit board mounted on the chassis base, a heatsink positioned over the printed circuit board to prevent corrosion of components on the printed circuit board, wherein the heatsink comprises a plurality of upward extending fins and a plurality of downward extending walls, a seal interposed between an edge of the downward extending walls and the chassis base, and a cover extending over the heatsink.

公开(公告)号：US10690868B1

公开(公告)日：2020-06-23

申请号：US16154589

申请日：2018-10-08

Applicant: CISCO TECHNOLOGY, INC.

Inventor： Joel Richard Goergen ,  Mehmet Onder Cap ,  Arjun Jayaprakash ,  Damaruganath Pinjala ,  Marc Henry Mantelli ,  Umeshbabu Nandanan ,  Jatin Kohli ,  Rohit Dev Gupta

IPC: G02B6/42 ,  G02B6/44

Abstract: In one embodiment, an apparatus includes an optical module comprising a first end for insertion into a network device and a second end extending from the network device when the optical module is inserted into the network device, and a thermal protective layer extending over a portion of the second end of the optical module, the thermal protective layer preventing direct contact with an external surface of the optical module during removal of the optical module from the network device. The thermal protective layer exposes a portion of the external surface of the second end of the optical module to allow heat to be released from the external surface of the optical module.