公开(公告)号：US20210217784A1

公开(公告)日：2021-07-15

申请号：US16761335

申请日：2019-11-21

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Zhengliang Li ,  Jiayu He ,  Hehe Hu ,  Wenlin Zhang ,  Song Liu ,  Xiaochen Ma ,  Nianqi Yao ,  Jie Huang

IPC: H01L27/144

Abstract: An array substrate, a method for manufacturing an array substrate, and a display panel are provided. The array substrate includes: a base substrate; a thin film transistor on the base substrate; and a PIN diode on a side of the thin film transistor away from the base substrate, in a direction running away the base substrate from the thin film transistor, the PIN diode including a first electrical conduction type semiconductor layer and an intrinsic semiconductor layer and a second electrical conduction type semiconductor layer stacked in sequence, wherein a material from which the first electrical conduction type semiconductor layer is made includes one or more of following materials: metal oxide, metal sulfide, metal selenide, metal nitride, metal phosphide, or metal arsenide.