公开(公告)号：US20180047314A1

公开(公告)日：2018-02-15

申请号：US15531181

申请日：2016-11-05

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Liqiang CHEN ,  Hong LI

IPC: G09F9/30 ,  H01L23/48 ,  H01L27/12 ,  H01L23/00 ,  H05K13/04 ,  G09G3/20 ,  H05K1/11 ,  H01L23/528 ,  H01L21/77

CPC classification number: G09F9/301 ,  G09G3/20 ,  G09G2380/02 ,  H01L21/77 ,  H01L23/48 ,  H01L23/528 ,  H01L23/544 ,  H01L24/13 ,  H01L24/14 ,  H01L24/16 ,  H01L24/81 ,  H01L27/12 ,  H01L2223/54486 ,  H01L2224/11 ,  H01L2224/12 ,  H01L2224/13012 ,  H01L2224/1412 ,  H01L2224/16225 ,  H01L2224/81125 ,  H01L2224/81127 ,  H01L2224/81201 ,  H05K1/11 ,  H05K13/046

Abstract: A display device and chip bonding method thereof are provided. The display device includes a flexible display panel and a chip bonded to the non-display area of the flexible display panel with the extension directions of individual bumps satisfying, depending on the area in which the bumps are located, the following requirements: in each row of bumps, at least the individual bumps in lateral zones have their extension lines on the same side converging at a same point on the reference line, and the two bumps belong to a same bump group have their extension lines respectively forming an angle with respect to the reference line, the angles being equal to each other.

公开(公告)号：US20170086310A1

公开(公告)日：2017-03-23

申请号：US15124328

申请日：2015-07-29

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Hong LI

IPC: H05K5/00 ,  H05K3/22 ,  H01B1/20 ,  H05K1/02

CPC classification number: H05K5/0017 ,  G02F1/13452 ,  H01B1/20 ,  H05K1/028 ,  H05K3/22 ,  H05K3/323 ,  H05K2201/10681

Abstract: The present disclosure relates to an anisotropic conductive film, a display device and a reworking method thereof. The anisotropic conductive film comprises: a first resin layer having positively photosensitive characteristics and conductive particles distributed in the first resin layer. Since the first resin layer has positively photosensitive characteristics, it can be decomposed after the exposure process. In this case, when failures occur in the binding of the display panel with the external circuit by the anisotropic conductive film, the first resin layer in the anisotropic conductive film can be decomposed by performing an exposure process on the anisotropic conductive film, so as to separate the external circuit from the display panel for reworking of the display panel. In this way, no heating process is needed, which not only simplifies the reworking procedure, but also is suitable for the reworking of a flexible display panel.

公开(公告)号：US20180047315A1

公开(公告)日：2018-02-15

申请号：US15540109

申请日：2016-06-15

Applicant: BOE TECHNOLOGY GROUP CO., LTD.

Inventor： Hong LI ,  Liqiang CHEN

IPC: G09F9/30 ,  H01L27/12 ,  H01L23/00 ,  G09G3/20 ,  H01L23/488 ,  H01L23/528 ,  H01L21/77

Abstract: A chip on film, including a base material provided with at least one row of output pads, wherein along an arranging direction of the output pads, an area where each row of output pads is located includes a first region, a second region and a third region, the second region is in the middle of the area where the row of output pads is located; the shape of each output pad located in the second region is different from the shape of each output pad located in the first region and the third region, and a maximum length spanned by each output pad located in the second region in the arranging direction is smaller than a minimum value among maximum lengths spanned by each output pad located in the first region and the third region in the arranging direction. A flexible display panel and a display device are further disclosed.