公开(公告)号：US20160268248A1

公开(公告)日：2016-09-15

申请号：US14641486

申请日：2015-03-09

Applicant: Apple Inc.

Inventor： Xiaofeng Fan ,  Xin Yi Zhang

IPC: H01L27/02 ,  H01L23/50 ,  H01L23/60

CPC classification number: H01L27/0255 ,  H01L23/552 ,  H01L23/60 ,  H01L27/0288 ,  H01L27/0292

Abstract: In an embodiment, an integrated circuit (IC) may include a circuit block that couples to one or more pins of the IC to communicate and/or receive power on the pins. The circuit block may include a ground connection, which may be electrically insulated/electrically separate from the ground connection of other components of the integrated circuit. In an embodiment, the circuit block may include an ESD protection circuit for the pad coupled to the pin. The IC may include another ESD protection circuit for the pad. The circuit block's ESD protection circuit may be sized for the current that may produced within the circuit block for an ESD event, and the IC's ESD protection circuit may be sized for the current that may be produced from the other components of the IC.

Abstract translation: 在一个实施例中，集成电路（IC）可以包括耦合到IC的一个或多个引脚以在引脚上传送和/或接收电力的电路块。 电路块可以包括接地连接，其可以与集成电路的其它部件的接地连接电绝缘/电分离。 在一个实施例中，电路块可以包括用于耦合到引脚的焊盘的ESD保护电路。 IC可以包括用于焊盘的另一ESD保护电路。 电路块的ESD保护电路可以针对ESD事件在电路块内可能产生的电流的大小，并且IC的ESD保护电路的大小适合于可从IC的其他部件产生的电流。

公开(公告)号：US09318479B2

公开(公告)日：2016-04-19

申请号：US14684872

申请日：2015-04-13

Applicant: Apple Inc.

Inventor： Junjun Li ,  Xin Yi Zhang ,  Xiaofeng Fan

IPC: H01L27/02 ,  H01L27/088 ,  H01L29/06 ,  H01L29/744 ,  H01L29/10 ,  H01L27/06 ,  H01L29/74 ,  H01L21/00

CPC classification number: H01L27/0259 ,  H01L27/0262 ,  H01L27/0635 ,  H01L27/0886 ,  H01L29/0649 ,  H01L29/1095 ,  H01L29/7416 ,  H01L29/7436 ,  H01L29/744

Abstract: In an embodiment, an ESD protection circuit may include an STI-bound SCR and a gated SCR that may be electrically in parallel with the STI-bound SCR. The gated SCR may be perpendicular to the STI-bound SCR in a plane of the semiconductor substrate. In an embodiment, the gated SCR may trigger more quickly and turn on more quickly than the STI-bound SCR. The STI-bound SCR may form the main current path for an ESD event. A low capacitive load with rapid response to ESD events may thus be formed. In an embodiment, the anode of the two SCRs may be shared.

Abstract translation: 在一个实施例中，ESD保护电路可以包括可以与STI结合的SCR并联的STI结合的SCR和门控SCR。 门控SCR可以在半导体衬底的平面中垂直于STI结合的SCR。 在一个实施例中，门控SCR可以比STI结合的SCR更快地触发并且更快地触发。 STI结合的SCR可以形成用于ESD事件的主电流路径。 因此可以形成具有对ESD事件的快速响应的低容性负载。 在一个实施例中，两个SCR的阳极可以共享。