公开(公告)号：US20160099159A1

公开(公告)日：2016-04-07

申请号：US14563798

申请日：2014-12-08

Applicant: Apple Inc.

Inventor： Scott L. Gooch ,  Shankar S. Pennathur

IPC: H01L21/56

CPC classification number: H01L21/565 ,  B29C45/02 ,  B29C45/14655 ,  B29C45/27 ,  B29C45/766 ,  B29C2945/76006 ,  B29C2945/7611 ,  B29C2945/762 ,  B29C2945/76381 ,  B29C2945/76498 ,  B29C2945/76595 ,  B29C2945/76678 ,  B29C2945/76859 ,  B29L2031/3425 ,  H01L21/563 ,  H01L21/568 ,  H01L2924/181 ,  H05K3/0091 ,  H05K3/284 ,  H05K2203/1316 ,  H01L2924/00012

Abstract: Molding assemblies and methods for dual side package molding are described. In an embodiment, a molding compound is injected into a front cavity with a first actuator, and a molding compound is injected into a back cavity with a second actuator, with the first and second actuator assemblies being independently controlled. In an embodiment, the molding compound flows through a through-hole in a molding substrate from a front side of the molding substrate to a back side of the molding substrate, and into the back cavity.

Abstract translation: 描述了用于双面包装成型的成型组件和方法。 在一个实施例中，将模塑料注入到具有第一致动器的前腔中，并且将模塑料注入具有第二致动器的后腔中，其中第一和第二致动器组件被独立地控制。 在一个实施方案中，模塑料从模塑基材的前侧流过成型基材的通孔到模制基材的背面，并流入后腔。

公开(公告)号：US20150271959A1

公开(公告)日：2015-09-24

申请号：US14308386

申请日：2014-06-18

Applicant: Apple Inc.

Inventor： Yanfeng Chen ,  Shankar S. Pennathur

IPC: H05K9/00

CPC classification number: H05K9/0024 ,  H01L2924/1815 ,  H01L2924/3025 ,  H05K1/0215 ,  H05K1/0218 ,  H05K3/284 ,  H05K9/0039 ,  H05K2201/0715 ,  H05K2201/0723 ,  H05K2201/09972 ,  H05K2201/1056

Abstract: A portable electronic device packaged into a System-in-Package assembly is disclosed. The portable electronic device can include a substrate and a plurality of components mounted on the substrate and included in one or more subsystems. Interference between subsystems or from external sources can be reduced or eliminated by disposing an insulating layer over the components, forming narrow trenches between subsystems, and conformally coating the insulating layer and trenches with a metal shielding layer. In some examples, trenches between subsystems can be formed using a laser source. In some examples, trenches between subsystems can have angled walls. In some examples, the metal shielding layer can be formed using at least one of electroplating, electroless plating, chemical vapor deposition, and physical vapor deposition.

Abstract translation: 公开了一种封装在系统级封装中的便携式电子设备。 便携式电子设备可以包括基板和安装在基板上并包括在一个或多个子系统中的多个部件。 通过在部件之间设置绝缘层，在子系统之间形成窄沟槽，并用金属屏蔽层保形地涂覆绝缘层和沟槽，可以减少或消除子系统之间或外部源之间的干扰。 在一些示例中，子系统之间的沟槽可以使用激光源形成。 在一些示例中，子系统之间的沟槽可以具有成角度的壁。 在一些示例中，可以使用电镀，化学镀，化学气相沉积和物理气相沉积中的至少一种来形成金属屏蔽层。