公开(公告)号：US20230188853A1

公开(公告)日：2023-06-15

申请号：US18167788

申请日：2023-02-10

Applicant: Apple Inc.

Inventor： Nicholas D. Smyth ,  Jian Ouyang ,  Scott W. Miller ,  Samuel M. Hyatt ,  Martin Auclair ,  Phillip R. Sommer

IPC: H04N23/68 ,  H04N23/54 ,  H04N23/67

CPC classification number: H04N23/687 ,  H04N23/54 ,  H04N23/67

Abstract: Various embodiments include a dynamic flex circuit that may be used in a camera with a moveable image sensor. The dynamic flex circuit may include one or more fixed end portions, a moveable end portion, and an intermediate portion. In some embodiments, the fixed end portion may be connected to another flex circuit of the camera. The moveable end portion may be coupled with the moveable image sensor. The intermediate portion may be configured to allow the moveable end portion to move with the moveable image sensor. Some embodiments include a reinforcement arrangement that reinforces one or more portions of the dynamic flex circuit.

公开(公告)号：US20230056192A1

公开(公告)日：2023-02-23

申请号：US17818813

申请日：2022-08-10

Applicant: Apple Inc.

Inventor： Himesh Patel ,  Phillip R. Sommer

IPC: H04N5/225

Abstract: Various embodiments include sensor shift flexure arrangements for improved signal routing. For example, a camera with sensor shift actuation may include a flexure for suspending an image sensor from a stationary structure of the camera, and for allowing motion of the image sensor enabled by one or more actuators of the camera. The flexure may be configured to convey electrical signals between the image sensor and a flex circuit in some embodiments. According to some embodiments, the flexure may include a stack of layers comprising an electrical grounding portion that has an additional conductive layer adjacent to a base layer, which may reduce the overall resistivity of a ground current return path. In some embodiments, the flexure may additionally or alternatively include an impedance adjusting feature configured to adjust the impedance of an electrical signal pad used to connect the flexure with another component of the camera.

公开(公告)号：US10147685B2

公开(公告)日：2018-12-04

申请号：US15403046

申请日：2017-01-10

Applicant: Apple Inc.

Inventor： Phillip R. Sommer ,  Shankar Pennathur ,  Meng Chi Lee ,  Shakti S. Chauhan ,  Yanfeng Chen

IPC: H01L23/552 ,  H01L23/31 ,  H01L25/065 ,  H01L23/498 ,  H01L21/288 ,  H01L21/3205 ,  H01L21/285 ,  H01L21/268 ,  H01L23/00 ,  H01L21/56

Abstract: Electrical components may be packaged using system-in-package configurations or other component packages. Integrated circuit dies and other electrical components may be soldered or otherwise mounted on printed circuits. A layer of encapsulant may be used to encapsulate the integrated circuits. A shielding layer may be formed on the encapsulant layer to shield the integrate circuits. The shielding layer may include a sputtered metal seed layer and an electroplated layer of magnetic material. The electroplated layer may be a magnetic material that has a high permeability such as permalloy or mu metal to provide magnetic shielding for the integrated circuits. Integrated circuits may be mounted on one or both sides of the printed circuit. A temporary carrier and sealant may be used to hold the encapsulated integrated circuits during electroplating.