公开(公告)号：US20220157680A1

公开(公告)日：2022-05-19

申请号：US16952567

申请日：2020-11-19

Applicant: Apple Inc.

Inventor： Karthik Shanmugam ,  Flynn P. Carson ,  Jun Zhai ,  Raymundo M. Camenforte ,  Menglu Li

IPC: H01L23/31 ,  H01L23/498 ,  H01L21/56 ,  H01L21/48

Abstract: Flexible packages and electronic devices with integrated flexible packages are described. In an embodiment, a flexibly package includes a first die and a second die encapsulated in a molding compound layer. A compliant redistribution layer (RDL) spans the molding compound layer and both dies, and includes electrical routing formed directly on landing pads of the dies. A notch is formed in the molding compound layer between the dies to facilitate flexure of the compliant RDL.

公开(公告)号：US20220071013A1

公开(公告)日：2022-03-03

申请号：US17005607

申请日：2020-08-28

Applicant: Apple Inc.

Inventor： Scott D. Morrison ,  Karthik Shanmugam ,  Raymundo M. Camenforte ,  Rakshit Agrawal ,  Flynn P. Carson ,  Kiranjit Dhaliwal

IPC: H05K1/18 ,  H01L23/00

Abstract: Wafer level passive array packages, modules, and methods of fabrication are described. In an embodiment, a module includes a circuit board, and a package mounted on the circuit board in which the package includes a plurality of passive components bonded to a bottom side of the die and a plurality of landing pads of the circuit board.

公开(公告)号：US10993317B2

公开(公告)日：2021-04-27

申请号：US16375493

申请日：2019-04-04

Applicant: Apple Inc.

Inventor： Yinjuan He ,  Karthik Shanmugam ,  Peter R. Harper ,  Tongbi Tom Jiang

IPC: H05K1/02 ,  H01L33/24 ,  H01L33/62 ,  H01L33/08 ,  H01L25/16 ,  H01L23/31 ,  H05K5/06

Abstract: An optical module may be formed on a wafer. The wafer may include a substrate and one or more optical components encapsulated, at least partially, by the substrate. Each of the optical components are configured to emit or sense light. The wafer may also include one or more printed circuit board (PCB) bars encapsulated, at least partially, by the substrate allowing electrical conductivity from a first side of the substrate to a second side of the substrate. The wafer may also include at least one redistribution layer to electrically couple at least one of the optical components to at least one of the PCB bars.