公开(公告)号：US10811400B2

公开(公告)日：2020-10-20

申请号：US16375503

申请日：2019-04-04

Applicant: Apple Inc.

Inventor： Yinjuan He ,  Karthik Shanmugam ,  Peter R. Harper ,  Tongbi Tom Jiang

IPC: H01L31/12 ,  H01L25/16 ,  H01L33/24 ,  H01L33/62 ,  H01L23/31 ,  H01L33/08 ,  H01L31/18 ,  H01L33/00 ,  H01L27/15

Abstract: A method for manufacturing an optical wafer may include coating multiple optical components with a substrate. The multiple optical components may include a light emitting component and a light detecting component, and each of the optical components may include one or more electrical connections. The method may also include depositing a redistribution layer onto at least one of the electrical connections, wherein the redistribution layer routes the electrical connection within the optical wafer to an external connection. The method may also include depositing a passivation layer over the redistribution layer and depositing a dark photoresist layer on at least the passivation layer. The photoresist layer may operatively reduce optical interference between at least one light emitting component and at least one light detecting component.

公开(公告)号：US10993317B2

公开(公告)日：2021-04-27

申请号：US16375493

申请日：2019-04-04

Applicant: Apple Inc.

Inventor： Yinjuan He ,  Karthik Shanmugam ,  Peter R. Harper ,  Tongbi Tom Jiang

IPC: H05K1/02 ,  H01L33/24 ,  H01L33/62 ,  H01L33/08 ,  H01L25/16 ,  H01L23/31 ,  H05K5/06

Abstract: An optical module may be formed on a wafer. The wafer may include a substrate and one or more optical components encapsulated, at least partially, by the substrate. Each of the optical components are configured to emit or sense light. The wafer may also include one or more printed circuit board (PCB) bars encapsulated, at least partially, by the substrate allowing electrical conductivity from a first side of the substrate to a second side of the substrate. The wafer may also include at least one redistribution layer to electrically couple at least one of the optical components to at least one of the PCB bars.

公开(公告)号：US20200107436A1

公开(公告)日：2020-04-02

申请号：US16375503

申请日：2019-04-04

Applicant: Apple Inc.

Inventor： Yinjuan He ,  Karthik Shanmugam ,  Peter R. Harper ,  Tongbi Tom Jiang

IPC: H05K1/02 ,  H01L33/24 ,  H01L25/16 ,  H01L23/31 ,  H01L33/08 ,  H01L33/62

Abstract: A method for manufacturing an optical wafer may include coating multiple optical components with a substrate. The multiple optical components may include a light emitting component and a light detecting component, and each of the optical components may include one or more electrical connections. The method may also include depositing a redistribution layer onto at least one of the electrical connections, wherein the redistribution layer routes the electrical connection within the optical wafer to an external connection. The method may also include depositing a passivation layer over the redistribution layer and depositing a dark photoresist layer on at least the passivation layer. The photoresist layer may operatively reduce optical interference between at least one light emitting component and at least one light detecting component.