公开(公告)号：US20210366756A1

公开(公告)日：2021-11-25

申请号：US16880540

申请日：2020-05-21

Applicant: Applied Materials, Inc.

Inventor： Qin Chen ,  Julian G. Blake ,  Michael W. Osborne ,  Steven M. Anella ,  Jonathan D. Fischer

IPC: H01L21/683 ,  H05F3/00 ,  H05B3/00

Abstract: A method may include providing a substrate on a clamp, and directing radiation from an illumination source to the substrate when the substrate is disposed on the clamp during substrate processing, wherein the radiation is characterized by a radiation energy, wherein at least a portion of the radiation energy is equal to or greater than 2.5 eV.

公开(公告)号：US20210366689A1

公开(公告)日：2021-11-25

申请号：US16880500

申请日：2020-05-21

Applicant: Applied Materials, Inc.

Inventor： Qin Chen ,  Julian G. Blake ,  Michael W. Osborne ,  Steven M. Anella ,  Jonathan D. Fischer

IPC: H01J37/317 ,  H01L21/683 ,  G02B26/10 ,  G02B26/08 ,  H01J37/20

Abstract: An apparatus may include a clamp to clamp a substrate wherein the clamp is arranged opposing a back side of the substrate; and an illumination system, disposed to direct radiation to the substrate, when the substrate is disposed on the clamp, wherein the radiation comprises a radiation energy equal to or above a threshold energy to generate mobile charge in the substrate, where the illumination system is disposed to direct radiation to a front side of the substrate, opposite the back side of the substrate.

公开(公告)号：US11069554B1

公开(公告)日：2021-07-20

申请号：US16749336

申请日：2020-01-22

Applicant: Applied Materials, Inc.

Inventor： Dawei Sun ,  Steven M. Anella ,  Qin Chen ,  Ron Serisky ,  Julian G. Blake ,  David J. Chipman

IPC: H01L21/683 ,  H01T23/00 ,  B23Q3/154

Abstract: A platen having improved thermal conductivity and reduced friction is disclosed. In one embodiment, vertically aligned carbon nanotubes are grown on the top surface of the platen. The carbon nanotubes have excellent thermal conductivity, thus improving the transfer of heat between the platen and the workpiece. Furthermore, the friction between the carbon nanotubes and the workpiece is much lower than that with conventional embossments, reducing particle generation. In another embodiment, a support plate is disposed on the platen, wherein the carbon nanotubes are disposed on the top surface of the support plate.