公开(公告)号：US07992290B2

公开(公告)日：2011-08-09

申请号：US11940900

申请日：2007-11-15

Applicant: Ying-Lin Chen ,  Yung-Chou Chen

Inventor： Ying-Lin Chen ,  Yung-Chou Chen

IPC: H05K3/36 ,  B32B3/10

CPC classification number: H05K3/427 ,  H05K1/0393 ,  H05K1/181 ,  H05K3/4652 ,  H05K2201/0166 ,  H05K2201/043 ,  H05K2201/09536 ,  H05K2203/0264 ,  Y10T29/49126 ,  Y10T29/49128 ,  Y10T29/4913 ,  Y10T29/49156 ,  Y10T29/49165 ,  Y10T156/1052 ,  Y10T428/24273

Abstract: An exemplary method of making an FPC includes forming a substrate comprising metal foil layers interleaved with intervening layers by: (a) laminating intervening layers with metal foil layers; (b) adhering a covering film to outermost surfaces of the substrate; (c) defining a hole in one side of the substrate through the covering film and at least two metal foil layers and the intervening layer between the at least two metal foil layers by etching or laser technology; and (d) plating a portion of an inner wall of the hole with conductive material to form a via to electrically connect the at least two metal foil layers.

Abstract translation: 制造FPC的示例性方法包括：通过以下步骤形成包含与中间层交错的金属箔层的基板：（a）将介入层与金属箔层层压; （b）将覆盖膜粘附到基板的最外表面; （c）通过蚀刻或激光技术通过覆盖膜和至少两个金属箔层和至少两个金属箔层之间的中间层来限定衬底的一侧中的孔; 以及（d）用导电材料电镀所述孔的内壁的一部分以形成通孔以电连接所述至少两个金属箔层。

公开(公告)号：US07929052B2

公开(公告)日：2011-04-19

申请号：US12061883

申请日：2008-04-03

Applicant: Ying-Lin Chen ,  Yung-Chou Chen ,  Wen-Chang Chen

Inventor： Ying-Lin Chen ,  Yung-Chou Chen ,  Wen-Chang Chen

IPC: H04N5/225

CPC classification number: G02B7/02 ,  G03B17/12 ,  H04N5/2251 ,  H04N5/2257 ,  H05K1/183 ,  H05K2201/10121

Abstract: A camera module includes a lens module, an image sensor, and a circuit board. The image sensor module is disposed in an image side of the lens module. The circuit board is electronically connected with the image sensor module. The circuit board includes a receiving chamber defined therein. The receiving chamber receives the image sensor module. The lens module is mounted on the circuit board and covers the receiving chamber. The image sensor module is fixed in the receiving chamber that is defined in the circuit board therein. Therefore, a thickness of the camera module along the axis of the camera module is decreased and a volume of the camera module becomes thinner compare with the conventional camera module.

Abstract translation: 相机模块包括透镜模块，图像传感器和电路板。 图像传感器模块设置在透镜模块的图像侧。 电路板与图像传感器模块电连接。 电路板包括限定在其中的接收室。 接收室接收图像传感器模块。 透镜模块安装在电路板上并覆盖接收室。 图像传感器模块固定在电路板中限定的接收室中。 因此，相机模块沿相机模块的轴线的厚度减小，并且相机模块的体积相对于传统相机模块变薄。

公开(公告)号：US20090094258A1

公开(公告)日：2009-04-09

申请号：US11866907

申请日：2007-10-03

Applicant: YING-LIN CHEN ,  You-Chin Fuh ,  Wei Han ,  Fen-Ling Lin ,  Inderpal Singh Narang ,  Lin Qiao ,  Vijayshankar Raman ,  Kouhorng Allen Yang

Inventor： YING-LIN CHEN ,  You-Chin Fuh ,  Wei Han ,  Fen-Ling Lin ,  Inderpal Singh Narang ,  Lin Qiao ,  Vijayshankar Raman ,  Kouhorng Allen Yang

IPC: G06F7/00

CPC classification number: G06F17/30498

Abstract: A method, storage server, and computer readable medium for off-loading star-join operations from a host information processing system to a storage server. At least a first and second set of keys from a first and second dimension table, respectively are received from a host system. Each of the first and second set of keys is associated with at least one fact table. A set of locations associated with a set of foreign key indexes are received from the host system. A set of fact table indexes are traversed. At least a first set of Row Identifiers (“RIDs”) associated with the first set of keys and at least a second set of RIDs associated with the second set of keys are identified. An operation is performed on the first and second sets of RIDs to identify an intersecting set of RIDs. The intersecting set of RIDs are then stored.

Abstract translation: 一种用于从主机信息处理系统到存储服务器的卸载星形连接操作的方法，存储服务器和计算机可读介质。 分别从主机系统接收来自第一和第二维度表的至少第一和第二组密钥。 第一组和第二组中的每一个与至少一个事实表相关联。 从主机系统接收与一组外键索引相关联的一组位置。 遍历一组事实表索引。 识别与第一组密钥相关联的至少第一组行标识符（“RID”）和与第二组密钥相关联的至少第二组RID。 对第一和​​第二组RID执行操作以识别RID的交叉集合。 然后存储相交的RID集合。

公开(公告)号：US20080309812A1

公开(公告)日：2008-12-18

申请号：US11925317

申请日：2007-10-26

Applicant: YING-LIN CHEN ,  YUNG-CHOU CHEN ,  SU-JEN CHENG

Inventor： YING-LIN CHEN ,  YUNG-CHOU CHEN ,  SU-JEN CHENG

IPC: H04N5/225 ,  H04N5/222

CPC classification number: G03B17/02

Abstract: A camera module includes a lens module including a holder and configured for imaging, an image sensor module received in the holder of the lens module and configured for capturing images, and a protective film adhered to an outer surface of the lens module. Due to the protective film, the outer and inner screw threads of the barrel and the holder are insulated from the outside. As such, use of the protective film maintains the quality of image produced by the camera module.

Abstract translation: 照相机模块包括：透镜模块，包括保持器，用于成像，接收在镜头模块的保持器中并构造成用于拍摄图像的图像传感器模块以及粘附到透镜模块的外表面的保护膜。 由于保护膜，筒体和保持架的外螺纹和内螺纹与外部绝缘。 因此，使用保护膜保持由相机模块产生的图像的质量。

公开(公告)号：US20080084649A1

公开(公告)日：2008-04-10

申请号：US11539958

申请日：2006-10-10

Applicant: Yu-Cheng CHANG ,  Ying-Lin CHEN

Inventor： Yu-Cheng CHANG ,  Ying-Lin CHEN

IPC: H01T23/00

CPC classification number: H01L21/68764 ,  H01J37/321 ,  H01J37/32568 ,  H01L21/67069

Abstract: An apparatus includes a processing chamber having a plasma containing region, a dielectric plate secured on top of the processing chamber, a power source separated from the plasma containing region by the dielectric plate, and a chuck supported within the processing chamber. The chuck is operable and configured to move with respect to the power source.

Abstract translation: 一种装置包括具有等离子体容纳区域的处理室，固定在处理室顶部的电介质板，通过电介质板与等离子体容纳区域分离的电源，以及支撑在处理室内的卡盘。 卡盘可操作和配置成相对于电源移动。

公开(公告)号：US20080083710A1

公开(公告)日：2008-04-10

申请号：US11534495

申请日：2006-09-22

Applicant: Ying-Lin Chen ,  Chi-An Kao ,  Po-Zen Chen ,  Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

Inventor： Ying-Lin Chen ,  Chi-An Kao ,  Po-Zen Chen ,  Yi-Li Hsiao ,  Chen-Hua Yu ,  Jean Wang ,  Lawrance Sheu

IPC: B23K9/00

CPC classification number: H01J37/32568 ,  H01J37/32091 ,  H01J37/321

Abstract: A adjustable upper coil or electrode for a reaction chamber apparatus useable in semiconductor processing, is constructed so that its shape may be selectively changed or so at least two portions thereof may be selectively driven at different power and/or frequencies. The adjustable upper coil or electrode, therefore, enables the plasma density distribution in the reaction chamber apparatus to be selectively controlled.

Abstract translation: 用于可用于半导体处理的反应室装置的可调整的上部线圈或电极被构造成使得其形状可以选择性地改变，或者至少两个部分可以以不同的功率和/或频率被选择性地驱动。 因此，可调节的上部线圈或电极能够选择性地控制反应室设备中的等离子体密度分布。

公开(公告)号：US06448167B1

公开(公告)日：2002-09-10

申请号：US10027976

申请日：2001-12-20

Applicant: Ling-Sung Wang ,  Ying-Lin Chen

Inventor： Ling-Sung Wang ,  Ying-Lin Chen

IPC: H01L214763

CPC classification number: H01L29/665 ,  H01L29/6656 ,  H01L29/6659

Abstract: A process for forming a composite insulator spacer on the sides of a MOSFET gate structure, wherein the underlying component of the composite insulator spacer is comprised of a thin silicon oxide layer obtained via chemical vapor deposition procedures using tetraethylorthosilicate (TEOS), as a source, has been developed. To densify the underlying thin silicon oxide layer an anneal procedure usually performed after implantation of ions used for a lightly doped source/drain region, is delayed and performed after deposition of the thin silicon oxide layer. The anneal procedure is then used for both activation of the lightly doped source/drain ions, and densification of the thin silicon oxide layer. The etch rate of the densified silicon oxide layer, in dilute hydrofluoric acid procedures is now reduced allowing the underlying silicon oxide component, of the composite insulator spacer, to survive subsequent wet clean procedures employing dilute hydrofluoric acid.

Abstract translation: 一种用于在MOSFET栅极结构的侧面上形成复合绝缘体间隔物的方法，其中复合绝缘体间隔物的下面的部件由通过使用四乙基原硅酸盐（TEOS）作为源的化学气相沉积方法获得的薄氧化硅层组成， 已经开发。 为了致密化下面的薄氧化硅层，通常在注入用于轻掺杂源/漏区的离子之后进行的退火工艺在沉积薄氧化硅层之后被延迟和执行。 然后退火过程用于轻掺杂源极/漏极离子的激活和薄氧化硅层的致密化。 在稀氢氟酸方法中，致密化的氧化硅层的蚀刻速率现在减少，允许复合绝缘体间隔物的下面的氧化硅组分在随后的使用稀氢氟酸的湿法清洁程序中存活。