公开(公告)号：US20140165804A1

公开(公告)日：2014-06-19

申请号：US14123568

申请日：2010-08-02

申请人： Timothy Dumm ,  Kan-yin Ng

发明人： Timothy Dumm ,  Kan-yin Ng

IPC分类号： B23D61/18 ,  B28D5/04

CPC分类号： B23D61/185 ,  B23D65/00 ,  B28D5/045 ,  Y10T83/0414 ,  Y10T83/9292 ,  Y10T428/292

摘要： A wire having a surface and diamond particles bonded to said surface by a bond matrix, wherein each diamond particle has surface roughness of about 0.60 to about 0.80 and a sphericity of about 0.25 to about 0.50.

摘要翻译： 具有表面的金属丝和金刚石颗粒通过接合基体结合到所述表面，其中每个金刚石颗粒具有约0.60至约0.80的表面粗糙度和约0.25至约0.50的球形度。

公开(公告)号：US20100068524A1

公开(公告)日：2010-03-18

申请号：US12560923

申请日：2009-09-16

申请人： Timothy F. Dumm ,  Kan-Yin Ng

发明人： Timothy F. Dumm ,  Kan-Yin Ng

IPC分类号： C09K3/14 ,  C09C1/68 ,  C01B31/04

CPC分类号： C09K3/1445 ,  B24B37/042 ,  C01B21/064 ,  C01B25/165 ,  C01B32/20 ,  C01B32/25 ,  C01B32/28 ,  C01P2004/61 ,  C01P2004/62 ,  C01P2004/80 ,  C01P2004/90 ,  C09K3/1409 ,  C09K3/1436 ,  C30B29/04 ,  C30B33/08 ,  Y10T428/2982 ,  Y10T428/2991

摘要： An abrasive particle having an irregular surface, wherein the surface roughness of the particle is less than about 0.95. A method for producing abrasive particles having a unique surface morphology including providing a plurality of abrasive particles; providing a plurality of metal particles; mixing the abrasive particles and the metal particles to form a mixture; compressing the mixture to form a compressed mixture; heating the compressed mixture; and recovering modified abrasive particles.

摘要翻译： 具有不规则表面的磨料颗粒，其中颗粒的表面粗糙度小于约0.95。 一种用于生产具有独特表面形态的磨料颗粒的方法，包括提供多个磨料颗粒; 提供多个金属颗粒; 混合研磨颗粒和金属颗粒以形成混合物; 压缩混合物以形成压缩混合物; 加热压缩混合物; 并回收改性的磨料颗粒。

公开(公告)号：US20100064593A1

公开(公告)日：2010-03-18

申请号：US12560960

申请日：2009-09-16

申请人： Timothy F. Dumm ,  Kan-Yin Ng

发明人： Timothy F. Dumm ,  Kan-Yin Ng

IPC分类号： C09K3/14

CPC分类号： C30B33/08 ,  C09K3/1409 ,  C09K3/1445 ,  C09K3/1463 ,  C30B29/04

摘要： A slurry containing a plurality of monocrystalline diamond particles, wherein the average surface roughness of said particles is less than about 0.95; a major vehicle selected from the group of water-based vehicles, glycol-based vehicles, oil-based vehicles or hydrocarbon-based vehicles and combinations thereof; and one or more optional additives.

摘要翻译： 含有多个单晶金刚石颗粒的浆料，其中所述颗粒的平均表面粗糙度小于约0.95; 选自水基车辆，乙二醇型车辆，油基车辆或烃类车辆及其组合的主要车辆; 和一种或多种任选的添加剂。

公开(公告)号：US06479386B1

公开(公告)日：2002-11-12

申请号：US09505269

申请日：2000-02-16

申请人： Kan-Yin Ng ,  Yun-Biao Xin ,  Henry Erk ,  Darrel Harris ,  James Jose ,  Stephen Hensiek ,  Gene Hollander ,  Dennis Buese ,  Giovanni Negri

发明人： Kan-Yin Ng ,  Yun-Biao Xin ,  Henry Erk ,  Darrel Harris ,  James Jose ,  Stephen Hensiek ,  Gene Hollander ,  Dennis Buese ,  Giovanni Negri

IPC分类号： H01L21302

CPC分类号： B24B37/345 ,  B24B37/042

摘要： A process for forming a semiconductor wafer which is single side polished improves nanotopology and flatness of the polished wafer. The process reduces the effect of back side surface features, such as edge ring phenomena and back side laser marks, on nanotopology, thereby improving oxide layer uniformity for chemical/mechanical planarization (CMP) processing, and flatness on the polished front side of the wafer after polishing. The wafer is mounted on a polishing block by wax. The edge ring causes certain deformation and stress in the wafer upon mounting, which is held by the wax. After mounting, the wax is heated to allow the wafer to relax, removing the stress, without degrading the bond of the wafer to the polishing block. The wafer is polished and removed from the polishing blocks. The polished surface substantially retains its shape after being de-mounted from the block.

摘要翻译： 用于形成单面抛光的半导体晶片的工艺改善了抛光晶片的纳米拓扑和平坦度。 该方法降低了背面表面特征（例如边缘环现象和背面激光标记）对纳米拓扑学的影响，从而提高了化学/机械平面化（CMP）处理的氧化层均匀性，并且在晶片的抛光正面上的平坦度 抛光后。 晶片通过蜡安装在抛光块上。 边缘环在由蜡保持的安装时在晶片中引起一定的变形和应力。 在安装之后，蜡被加热以允许晶片松弛，消除应力，而不降低晶片与抛光块的结合。 抛光晶片并从抛光块移除。 抛光表面在从块上拆卸之后基本上保持其形状。