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    High temperature environment tool system and method
    11.
    发明授权
    High temperature environment tool system and method 有权
    高温环境工具系统及方法

    公开(公告)号：US07017662B2

    公开(公告)日：2006-03-28

    申请号：US10992168

    申请日：2004-11-18

    Applicant: Roger L. Schultz ,  James J. Freeman ,  Paul F. Rodney

    Inventor： Roger L. Schultz ,  James J. Freeman ,  Paul F. Rodney

    IPC: E21B47/12

    CPC classification number: E21B47/0002 ,  B81B2207/115 ,  E21B47/011 ,  G01V1/40 ,  H01L21/86 ,  H01L23/3157 ,  H01L27/12 ,  H01L2224/16225 ,  H01L2224/32225 ,  H01L2224/73204 ,  H01L2224/73253 ,  H01L2924/13091 ,  H01L2924/3011 ,  H01L2924/00

    Abstract: In at least some embodiments, a tool may comprise a tool body and one or more tool components. The tool may further comprise tool electronics located within the tool body, wherein the tool electronics are operable to sense and store tool component characteristics and environmental characteristics. At least some of the tool electronics are operable, at least for one week, when exposed to temperatures of at least 200 Celsius. The tool electronics may be integrated circuits formed on a silicon carbide substrate or a silicon on sapphire substrate. One illustrative embodiment of the tool is a drill bit for employment in a high temperature drill well.

    Abstract translation: 在至少一些实施例中，工具可以包括工具主体和一个或多个工具部件。 工具还可以包括位于工具主体内的工具电子器件，其中工具电子器件可操作以感测和存储工具部件特性和环境特性。 当暴露于至少200摄氏度的温度时，至少一些工具电子器件可操作，至少一周。 工具电子器件可以是形成在碳化硅衬底或蓝宝石衬底上的硅上的集成电路。 该工具的一个说明性实施例是用于高温钻井中的钻头。

    Downhole communication system and method
    13.
    发明授权
    Downhole communication system and method 有权
    井下通信系统及方法

    公开(公告)号：US08857507B2

    公开(公告)日：2014-10-14

    申请号：US11972036

    申请日：2008-01-10

    Applicant: James J. Freeman

    Inventor： James J. Freeman

    IPC: E21B47/12 ,  G01V11/00

    CPC classification number: E21B47/12 ,  G01V11/002

    Abstract: A downhole communication system including a plurality of addressed downhole devices, a plurality of remote devices, and a plurality of conductors. Each of the plurality of conductors is electrically conductively connected to at least one of the plurality of addressed downhole devices and at least one of the plurality of remote devices. The downhole communication system is configured such that at least one of the plurality of devices is able to receive and recognize encoded addresses and encoded data in an electrical signal transmitted to at least one of the plurality of conductors electrically conductively isolated from the device configured to be receptive to the electrical signal having the encoded addresses and encoded data.

    Abstract translation: 一种井下通信系统，包括多个寻址井下装置，多个远程装置和多个导体。 多个导体中的每一个导电地连接到多个寻址井下装置中的至少一个以及多个远程装置中的至少一个。 所述井下通信系统被配置为使得所述多个设备中的至少一个能够接收并识别被传送到所述多个导体中的至少一个的编码地址和编码数据，所述至少一个导体与被配置为 接收具有编码地址和编码数据的电信号。

    High temperature imaging device
    16.
    发明授权
    High temperature imaging device 有权
    高温成像装置

    公开(公告)号：US07442932B2

    公开(公告)日：2008-10-28

    申请号：US10992557

    申请日：2004-11-18

    Applicant: Roger L. Schultz ,  James J. Freeman ,  Neal G. Skinner ,  Steven G. Streich

    Inventor： Roger L. Schultz ,  James J. Freeman ,  Neal G. Skinner ,  Steven G. Streich

    IPC: G01J5/00

    CPC classification number: G11C11/22 ,  H01L21/84 ,  H01L27/11502 ,  H01L27/12 ,  H01L27/1203 ,  H01L27/14601 ,  H01L27/14625

    Abstract: High temperature imaging devices are disclosed. In one embodiment, the imaging device comprises an array of photosensitive elements fabricated on an insulator substrate, and an information storage component coupled to the array. The information storage component stores data representing one or more light patterns detected by the array. The light patterns may be images or spectral patterns. The insulator substrate may be a sapphire or spinel substrate. Alternatively, the substrate may be silicon carbide or an insulated silicon substrate. In at least some embodiments, a processor is integrated on the same substrate as the array.

    Abstract translation: 公开了高温成像装置。 在一个实施例中，成像装置包括制造在绝缘体衬底上的感光元件的阵列和耦合到阵列的信息存储部件。 信息存储部件存储表示由阵列检测出的一个或多个光模式的数据。 光图案可以是图像或光谱图案。 绝缘体衬底可以是蓝宝石或尖晶石衬底。 或者，衬底可以是碳化硅或绝缘硅衬底。 在至少一些实施例中，处理器集成在与阵列相同的衬底上。

    System and method for measuring the power consumed by a circuit on a printed circuit board
    17.
    发明授权
    System and method for measuring the power consumed by a circuit on a printed circuit board 有权
    用于测量印刷电路板上的电路消耗的功率的系统和方法

    公开(公告)号：US06972556B2

    公开(公告)日：2005-12-06

    申请号：US10894240

    申请日：2004-07-20

    Applicant: James M. Kronrod ,  James J. Freeman ,  Kelly Coffey

    Inventor： James M. Kronrod ,  James J. Freeman ,  Kelly Coffey

    IPC: G01R1/20 ,  G01R19/165 ,  H05K1/02 ,  G01R11/32 ,  G01R7/00

    CPC classification number: G01R19/16571 ,  G01R1/203 ,  H05K1/0268 ,  H05K2201/093 ,  H05K2201/09627

    Abstract: A system for measuring power of a circuit on a printed circuit board (PCB) including first and second circuits, a power strip, a power plane, and a calibration strip. The power strip is connected to the power plane to the first circuit, is embedded in the PCB during the manufacturing process, and also has at least two vias for measuring a voltage drop. The calibration strip is also embedded in the PCB during the manufacturing process and has at least two vias for measuring a voltage drop. The second circuit is configured to measure a voltage drop across the power strip as a first voltage and a voltage drop across the calibration strip as a second voltage, and to calculate the power being fed to the first circuit based on the first voltage and the second voltage.

    Abstract translation: 一种用于测量包括第一和第二电路，电源板，电源平面和校准条的印刷电路板（PCB）上的电路的功率的系统。 电源板连接到第一电路的电源平面，在制造过程中嵌入在PCB中，并且还具有至少两个用于测量电压降的通孔。 校准条在制造过程中也嵌入到PCB中，并且具有至少两个用于测量电压降的通孔。 第二电路被配置为测量作为第一电压的电源板上的电压降和跨越校准条的电压降作为第二电压，并且基于第一电压和第二电压来计算馈送到第一电路的功率 电压。

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