Abstract:
A terahertz band filter for filtering, in a frequency band, a terahertz wave propagating between a pair of metal plates with an upper parallel surface facing a lower parallel surface includes a sheet parallel to the upper and lower parallel surfaces, which is disposed between the metal plates and is spaced apart therefrom, and at least one slit located in the sheet to face the upper and lower parallel surfaces, wherein the sheet comprises a single slit to function as a notch filter for blocking in a specific frequency band.
Abstract:
Disclosed herein is a sectional three-dimensional model, which can be assembled by use of an independent single type of pieces without requiring several kinds of pieces having different shapes from one another, and achieve a three-dimensional connection of the pieces. The sectional three-dimensional model includes a plurality of spherical pieces, and each spherical piece includes a pair of coupling recesses symmetrically formed in the spherical piece along a center axis of the spherical piece, and a plurality of coupling protrusions integrally formed at an outer surface of the spherical piece to be arranged in directions perpendicular to the coupling recesses, thereby allowing the plurality of spherical pieces to be connected to one another via insertion of the coupling protrusions into the coupling recesses.
Abstract:
CMOS image sensors and methods for fabricating the same are disclosed. A disclosed CMOS image sensor comprises: a semiconductor substrate; a photo diode; a microlens located over the photo diode; and a color filter layer located over the microlens.
Abstract:
A terahertz band filter for filtering, in a frequency band, a terahertz wave propagating between a pair of metal plates with an upper parallel surface facing a lower parallel surface includes a sheet parallel to the upper and lower parallel surfaces, which is disposed between the metal plates and is spaced apart therefrom, and at least one slit located in the sheet to face the upper and lower parallel surfaces, wherein the sheet comprises a single slit to function as a notch filter for blocking in a specific frequency band.
Abstract:
Provided are a multiplierless FIR digital filter and a method of designing the same, in which a filtering operation is performed by not multipliers needed as many as the number of tap depending on design requirement but a small addition/subtraction circuit using extracted information after analyzing the property of a given coefficient and extracting information required for design by only adding/subtracting operations. In the method of designing the multiplierless FIR digital filter, four tables are created to extract and store information needed for adding and subtracting operations to coefficients of design requirement, and an addition table is created to set a sixteen-multiple adding section of which a least upper bound is the maximum value of when the coefficient is represented into an integer by taking a decimal part of the coefficient, and to store values obtained by adding the input data input synchronizing with a clock frequency as a unit of sixteen sections. Further, a value corresponding to multiplication is obtained by performing extraction and error correction on the added values from four tables and the addition table, and an adder chain of an output terminal sums up the values and outputs the filtering results, thereby effectively implementing a logic circuit of the multiplierless FIR digital filter.
Abstract:
A CMOS image sensor and manufacturing method thereof are disclosed. The present CMOS image sensor comprises: a semiconductor substrate including an active region having a photo diode region and a transistor region; a gate on the active region, comprising a gate insulating layer and a gate electrode thereon; a first source/drain diffusion region in the transistor region at one side of the gate electrode, including a first conductivity type dopant; a second photo diode diffusion region in the region at the other side of the gate electrode, the second diffusion region including a first conductivity type dopant; insulating sidewalls on sides of the gate electrode; and a third diffusion region over or in the second diffusion region, extending below one of the insulating sidewalls (e.g., closest to the photo diode region), and including a second conductivity type dopant.
Abstract:
A CMOS image sensor and a method for manufacturing the same, capable of preventing an interface between an active region and a field region in the CMOS image sensor from being damaged by ion implantation. The method comprises implanting dopant ions into a source region between a gate electrode of the reset transistor and the photodiode, using an ion implantation mask that covers predetermined locations of the field region and the source region.
Abstract:
The present invention relates to a method of efficiently assigning addresses in a WPAN and a WPAN device. The address assignment method of the present invention is performed by a higher device. Address assignment information for determining an address to be assigned to a lower device, is managed. An address is assigned to a lower device that requests connection from the higher device based on the address assignment information. The address assignment information is updated to a address value as the address value is assigned, and the updated address assignment information is transmitted to lower devices. If an update of address assignment information is requested by the lower device that assigned an address value to a device lower thereto, the address assignment information is updated and the updated address assignment information is transmitted to lower devices.
Abstract:
A method for fabricating a photodiode of a CMOS image sensor is disclosed, to improve a charge accumulation capacity in the photodiode, which includes the steps of defining a semiconductor substrate as an active area and a field area by forming an STI layer; firstly implanting impurity ions for formation of the photodiode to the semiconductor substrate of the active area; secondarily implanting impurity ions for formation of the photodiode to the semiconductor substrate being adjacent to the STI layer; and forming a photodiode ion-implantation diffusion layer by diffusing the implanted impurity ions with a thermal process.
Abstract:
A hose clamping assembly comprises a branched pipe having a plurality of projected stoppers thereon, each of the stoppers formed around an outer surface of each branch of the branched pipe and spaced apart a certain distance from each other, a hose connected to each branch of the branched pipe by sliding onto each of the branches, the hose contacting a nearest stopper from the end portion of the branch among the plurality of stoppers, a clamp formed on an outer surface of the hose and between the stoppers by a molding apparatus, a portion of the clamp on the outer surface of the hose connected to a portion of the clamp between the stoppers and an arm connecting the clamp to an adjacent clamp having a different axial direction, the arm formed by the molding apparatus.