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公开(公告)号:US11019744B2
公开(公告)日:2021-05-25
申请号:US16740793
申请日:2020-01-13
Applicant: Apple Inc.
Inventor: David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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公开(公告)号:US10969834B2
公开(公告)日:2021-04-06
申请号:US16586678
申请日:2019-09-27
Applicant: Apple Inc.
Inventor: Lucy Elizabeth Browning , Benjamin J. Pope , Paul U. Leutheuser , Scott A. Myers , Richard Hung Minh Dinh , Edward S. Huo
Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.
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公开(公告)号:US10912220B2
公开(公告)日:2021-02-02
申请号:US14869774
申请日:2015-09-29
Applicant: Apple Inc.
Inventor: David Pakula , Richard Hung Minh Dinh , Tang Yew Tan
IPC: H05K7/14 , H04M1/02 , G06F1/16 , H05K5/03 , G02B7/02 , H05K5/00 , G02B13/00 , B29L31/34 , H04N5/225
Abstract: Improved housings for electronic devices are disclosed. An electronic device housing can make use of at least one outer member (e.g., cover) that can be aligned, protected and/or secured with respect to other portions of the housing for the electronic device. In one embodiment, an electronic device housing can have one or more outer members (e.g., exposed major surfaces), such as front or back surfaces, that are formed of glass. Protective sides can be provided in some embodiments to protect the edges of the one or more glass surfaces so as to dissipate impact forces and thus reduce damage to the electronic device housing. The one or more glass surfaces can be part of outer member assemblies that can be secured to other portions of the electronic device housing. The electronic device can be portable and in some cases handheld.
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公开(公告)号:US20200154586A1
公开(公告)日:2020-05-14
申请号:US16740793
申请日:2020-01-13
Applicant: Apple Inc.
Inventor: David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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公开(公告)号:US10651879B2
公开(公告)日:2020-05-12
申请号:US15712476
申请日:2017-09-22
Applicant: Apple Inc.
Inventor: Phillip Michael Hobson , Erik L. Wang , Kenneth A. Jenks , Robert J. Hill , Robert W. Schlub , Richard Hung Minh Dinh , Tang Yew Tan , Adam D. Mittleman , Bartley K. Andre , Daniel J. Coster , Daniele de Iuliis , Richard P. Howarth , Jonathan P. Ive , Steven P. Jobs , Duncan Robert Kerr , Shin Nishibori , Matthew Dean Rohrbach , Douglas B. Satzger , Calvin Q. Seid , Christopher J. Stringer , Eugene Antony Whang , Rico L. Zörkendörfer
IPC: H04B1/3827 , H04M1/02
Abstract: A handheld electronic device may be provided that contains a conductive housing and other conductive elements. Transceiver circuitry, such as radio frequency (RF) transceiver circuitry configured to transmit and receive RF signals, may be connected to the resonating elements by transmission lines such as coaxial cables. The electronic device may have an integrated touch screen display in which a user can control the device by interacting directly with the display.
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公开(公告)号:US20200076057A1
公开(公告)日:2020-03-05
申请号:US16142352
申请日:2018-09-26
Applicant: Apple Inc.
Inventor: Paul U. Leutheuser , Martin J. Auclair , Kevin M. Froese , Christopher J. Durning , Jun Ham , Lucy E. Browning , Sawyer I. Cohen , Richard Hung Minh Dinh , Donald J. Parr
Abstract: A device includes a display and a housing. The housing at least partially surrounds the display. The housing includes a first housing segment defining at least a first portion of an exterior surface of the device and a first interlock feature having an interlock surface that is offset with respect to an end surface of the first housing segment. The first interlock feature has a first opening formed in the interlock surface. The housing further includes a second housing segment defining at least a second portion of the exterior surface of the device and a second interlock feature having a second opening aligned with the first opening, and a non-conductive housing component defining a third portion of the exterior surface of the device and extending into the first opening and the second opening.
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公开(公告)号:US10575421B2
公开(公告)日:2020-02-25
申请号:US15989133
申请日:2018-05-24
Applicant: Apple Inc.
Inventor: David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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公开(公告)号:US20200042040A1
公开(公告)日:2020-02-06
申请号:US16586678
申请日:2019-09-27
Applicant: Apple Inc.
Inventor: Lucy Elizabeth Browning , Benjamin J. Pope , Paul U. Leutheuser , Scott A. Myers , Richard Hung Minh Dinh , Edward S. Huo
Abstract: Sensor assemblies for electronic devices are described. According to some embodiments, the sensor assemblies include solid-state sensors, such as capacitive sensors, piezoelectric sensors or piezoresistive sensors. The sensor assemblies can include a number of features that provide a compact profile, making them well suited for integration into small spaces of electronic device enclosures. The sensor assemblies can also include features that isolate movement of various parts of the sensor assemblies, allowing for accurate detection of a sensing event. According to some embodiments, the sensor assemblies are coupled to haptic actuators, speaker, or both, which mimic the feel of a mechanical button and enhance a user's experience.
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公开(公告)号:US10333199B2
公开(公告)日:2019-06-25
申请号:US15784814
申请日:2017-10-16
Applicant: Apple Inc.
Inventor: Phillip M. Hobson , Stephen P. Zadesky , Erik L. Wang , Tang Yew Tan , Richard Hung Minh Dinh , Adam D. Mittleman , Kenneth A. Jenks , Robert J. Hill , Robert W. Schlub
IPC: H01Q1/24 , H01Q1/38 , H01Q1/48 , H01Q9/04 , H01Q9/42 , H01Q13/10 , H01Q21/28 , H01Q5/371 , H01Q5/40 , H01Q1/50 , H01Q7/00 , H01Q1/27 , H01Q1/46
Abstract: A handheld electronic device may be provided that contains a conductive housing and other conductive elements. The conductive elements may form an antenna ground plane. One or more antennas for the handheld electronic device may be formed from the ground plane and one or more associated antenna resonating elements. Transceiver circuitry may be connected to the resonating elements by transmission lines such as coaxial cables. Ferrules may be crimped to the coaxial cables. A bracket with extending members may be crimped over the ferrules to ground the coaxial cables to the housing and other conductive elements in the ground plane. The ground plane may contain an antenna slot. A dock connector and flex circuit may overlap the slot in a way that does not affect the resonant frequency of the slot. Electrical components may be isolated from the antenna using isolation elements such as inductors and resistors.
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公开(公告)号:US20180270976A1
公开(公告)日:2018-09-20
申请号:US15989133
申请日:2018-05-24
Applicant: Apple Inc.
Inventor: David Pakula , Stephen Brian Lynch , Richard Hung Minh Dinh , Tang Yew Tan , Lee Hua Tan
CPC classification number: H05K5/03 , A45C11/00 , A45F5/00 , G06F1/1626 , G06F1/1656 , G06F3/041 , H04M1/0249 , H04M1/0266 , H05K5/0017
Abstract: An electronic device having an enclosure formed from at least one glass cover and a peripheral structure formed adjacent the periphery of the glass cover is disclosed. The peripheral structure can be secured adjacent to the glass cover with an adhesive. The peripheral structure can be molded adjacent the glass cover so that a gapless interface is formed between the peripheral structure and the periphery of the glass cover. In one embodiment, the peripheral structure includes at least an inner peripheral structure and an outer peripheral structure.
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