公开(公告)号：US20080014735A1

公开(公告)日：2008-01-17

申请号：US11775120

申请日：2007-07-09

Applicant: Hyun-Soo CHUNG ,  Seung-Kwan RYU ,  Ju-Il CHOI ,  Dong-Ho LEE ,  Seong-Deok HWANG

Inventor： Hyun-Soo CHUNG ,  Seung-Kwan RYU ,  Ju-Il CHOI ,  Dong-Ho LEE ,  Seong-Deok HWANG

IPC: H01L21/44

CPC classification number: H01L21/76898 ,  H01L23/3128 ,  H01L23/3178 ,  H01L23/481 ,  H01L24/03 ,  H01L24/05 ,  H01L24/06 ,  H01L24/16 ,  H01L24/19 ,  H01L24/20 ,  H01L24/82 ,  H01L25/0657 ,  H01L25/105 ,  H01L25/50 ,  H01L2224/02313 ,  H01L2224/02372 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/036 ,  H01L2224/0401 ,  H01L2224/04105 ,  H01L2224/05009 ,  H01L2224/05548 ,  H01L2224/06181 ,  H01L2224/11334 ,  H01L2224/11462 ,  H01L2224/12105 ,  H01L2224/13024 ,  H01L2224/13025 ,  H01L2224/16145 ,  H01L2224/16235 ,  H01L2224/94 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06586 ,  H01L2225/1058 ,  H01L2924/00 ,  H01L2924/01005 ,  H01L2924/01006 ,  H01L2924/01013 ,  H01L2924/01015 ,  H01L2924/01029 ,  H01L2924/01033 ,  H01L2924/01073 ,  H01L2924/01074 ,  H01L2924/01079 ,  H01L2924/014 ,  H01L2924/15311 ,  H01L2924/181 ,  H01L2924/18162 ,  H01L2924/01028 ,  H01L2224/03

Abstract: Provided are methods of fabricating semiconductor chips, semiconductor chips formed by the methods, and chip-stack packages having the semiconductor chips. One embodiment specifies a method that includes patterning a scribe line region of a semiconductor substrate to form a semiconductor strut spaced apart from edges of a chip region of the semiconductor substrate.

Abstract translation: 提供制造半导体芯片的方法，通过该方法形成的半导体芯片和具有半导体芯片的芯片堆叠封装。 一个实施例规定了一种方法，其包括图案化半导体衬底的划线区域以形成与半导体衬底的芯片区域的边缘间隔开的半导体支柱。

公开(公告)号：US07264991B1

公开(公告)日：2007-09-04

申请号：US10292273

申请日：2002-11-12

Applicant: Charles W. C. Lin

Inventor： Charles W. C. Lin

IPC: H01L21/44

CPC classification number: H01L21/6835 ,  H01L21/56 ,  H01L21/565 ,  H01L23/295 ,  H01L23/3121 ,  H01L23/3164 ,  H01L23/3171 ,  H01L23/3677 ,  H01L24/03 ,  H01L24/05 ,  H01L24/11 ,  H01L24/13 ,  H01L2221/68372 ,  H01L2221/68377 ,  H01L2221/68381 ,  H01L2224/02319 ,  H01L2224/02331 ,  H01L2224/0237 ,  H01L2224/02377 ,  H01L2224/02379 ,  H01L2224/0239 ,  H01L2224/036 ,  H01L2224/0401 ,  H01L2224/05548 ,  H01L2224/11002 ,  H01L2224/1132 ,  H01L2224/11334 ,  H01L2224/1146 ,  H01L2224/116 ,  H01L2224/13008 ,  H01L2224/131 ,  H01L2224/45124 ,  H01L2224/45144 ,  H01L2924/00014 ,  H01L2924/01006 ,  H01L2924/01012 ,  H01L2924/01013 ,  H01L2924/01024 ,  H01L2924/01029 ,  H01L2924/0103 ,  H01L2924/01033 ,  H01L2924/0104 ,  H01L2924/01046 ,  H01L2924/01047 ,  H01L2924/0105 ,  H01L2924/01072 ,  H01L2924/01074 ,  H01L2924/01078 ,  H01L2924/01079 ,  H01L2924/01082 ,  H01L2924/014 ,  H01L2924/09701 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/19042 ,  H01L2924/3025 ,  H01L2924/01028 ,  H01L2221/68304 ,  H01L2924/0665 ,  H01L2924/06 ,  H01L2924/07025 ,  H01L2924/00 ,  H01L2224/48

Abstract: A method of connecting a conductive trace to a semiconductor chip includes providing a semiconductor chip that includes a conductive pad, providing a conductive trace, then disposing a conductive adhesive between the conductive trace and the chip, thereby mechanically attaching the conductive trace to the chip such that the conductive trace overlaps the pad and the conductive adhesive contacts and is sandwiched between and electrically connects the conductive trace and the pad, and then removing a portion of the conductive adhesive such that the conductive adhesive still contacts and is sandwiched between and electrically connects the conductive trace and the pad and the conductive adhesive no longer electrically connects the conductive trace to a conductor external to the chip.

Abstract translation: 将导电迹线连接到半导体芯片的方法包括提供包括导电焊盘的半导体芯片，提供导电迹线，然后在导电迹线和芯片之间布置导电粘合剂，从而将导电迹线机械地附接到芯片 导电迹线与焊盘和导电粘合剂接触并且夹在导电迹线和焊盘之间并电连接导电迹线和焊盘，然后去除导电粘合剂的一部分，使得导电粘合剂仍然接触并夹在其中并电连接 导电迹线和焊盘和导电粘合剂不再将导电迹线电连接到芯片外部的导体。