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公开(公告)号：US20220094330A1
公开(公告)日：2022-03-24
申请号：US17462543
申请日：2021-08-31
发明人： Shinji YAMAMOTO , Michio MIURA
摘要： An acoustic wave device includes a support substrate having an uneven surface, a piezoelectric layer provided on the uneven surface of the support substrate, an electrode that excites an acoustic wave in the piezoelectric layer, and an insulating layer that is provided between the uneven surface of the support substrate and the piezoelectric layer, and has an air gap located in a recess part of the uneven surface.
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公开(公告)号：US20220037088A1
公开(公告)日：2022-02-03
申请号：US17501817
申请日：2021-10-14
发明人： Chie KAWAMURA , Kazumichi HIROI , Osamu HATTORI
IPC分类号： H01G4/30 , H01G4/12 , C04B35/468 , B32B18/00 , C01G23/00 , C04B35/626
摘要： A manufacturing method of ceramic powder includes mixing a barium carbonate having a specific surface are of 15 m2/g or more, a titanium dioxide having a specific surface area of 20 m2/g or more, a first compound of a donor element having a larger valence than Ti, and a second compound of an acceptor element having a smaller valence than Ti and having a larger ion radium than Ti and the donor element, and synthesizing barium titanate powder by calcining the barium carbonate, the titanium dioxide, the first compound and the second compound until a specific surface area of the barium titanate powder becomes 4 m2/g or more and 25 m2/g or less.
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123.发明申请公开(公告)号：US20220037067A1
公开(公告)日：2022-02-03
申请号：US17370800
申请日：2021-07-08
发明人： Yoko ORIMO , Tomoo KASHIWA
摘要： A metal magnetic powder is constituted by metal magnetic grains that each include: a metal phase where the mass percentage of Fe at its center part is lower than that at its contour part; and an oxide film covering the metal phase so as to allow the magnetic body resistant to magnetic saturation and low in iron loss.
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公开(公告)号：US20220020534A1
公开(公告)日：2022-01-20
申请号：US17370988
申请日：2021-07-08
发明人： Shunya FUKUDA , Fukio KINOSHITA , Daisuke IWAI
摘要： A ceramic electronic component includes a multilayer chip including a multilayer structure having ceramic dielectric layers and internal electrode layers alternately stacked, and cover layers respectively disposed on top and bottom faces of the multilayer structure in a first direction in which the dielectric layers and the internal electrode layers are stacked, and a pair of external electrodes formed from respective edge faces to at least one side face of the multilayer chip, wherein a ratio of a thickness of the multilayer chip in the first direction to a width of the multilayer chip in a shorter side direction is 0.7 or less, wherein a thickness of a capacitance section where adjacent internal electrode layers connected to different external electrodes are opposite to each other in the first direction is equal to or greater than 2.2 times at least one of thicknesses of the cover layers in the first direction.
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公开(公告)号：US11228299B2
公开(公告)日：2022-01-18
申请号：US15877070
申请日：2018-01-22
摘要： A piezoelectric thin film resonator includes: a substrate; a piezoelectric film located on the substrate; a lower electrode and an upper electrode facing each other across at least a part of the piezoelectric film; and an insertion film that is inserted between the lower electrode and the upper electrode, is located in an outer peripheral region within a resonance region where the lower electrode and the upper electrode face each other across the piezoelectric film, is located in a region that is located outside the resonance region and surrounds the resonance region, is not located in a center region of the resonance region, and includes a first part, which is located in the resonance region and has a first film thickness, and a second part, which is located outside the resonance region and has a second film thickness, the first film thickness being less than the second film thickness.
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公开(公告)号：US11217384B2
公开(公告)日：2022-01-04
申请号：US16141122
申请日：2018-09-25
摘要： A coil component according to one embodiment of the present invention includes: a first insulator body containing first filler particles at least partially having electrical conductivity; a second insulator body containing second filler particles at least partially having electrical conductivity; a first coil conductor provided in the first insulator body and wound around a coil axis for N1 turns such that intervals between adjacent turns are g1; and a second coil conductor provided in the second insulator body and wound around the coil axis for N2 turns such that intervals between adjacent turns are g2. In the embodiment, a first coil surface of the first coil conductor faces a second coil surface of the second coil conductor, and a distance T between the first coil surface and the second coil surface satisfies a relationship T≥g1×N1+g2×N2.
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公开(公告)号：US20210399709A1
公开(公告)日：2021-12-23
申请号：US17323598
申请日：2021-05-18
发明人： Shinji YAMAMOTO , Toshio NISHIZAWA , Naoki KAKITA
摘要： An acoustic wave device including a support substrate, a piezoelectric layer provided over the support substrate, at least one pair of comb-shaped electrodes disposed on the piezoelectric layer, each of the at least one pair of comb-shaped electrodes including electrode fingers, a temperature compensation film interposed between the support substrate and the piezoelectric layer, the temperature compensation film having a temperature coefficient of elastic constant opposite in sign to a temperature coefficient of elastic constant of the piezoelectric layer; and an insulating layer interposed between the support substrate and the temperature compensation film, a first surface of the insulating layer having first protruding portions and/or first recessed portions, a second surface of the insulating layer having second protruding portions and/or second recessed portions, the first surface being closer to the support substrate, the second surface being closer to the temperature compensation film.
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公开(公告)号：US20210375528A1
公开(公告)日：2021-12-02
申请号：US17330014
申请日：2021-05-25
发明人： Hideaki HOSHINO , Kenji OKABE , Kozue IMAIZUMI
摘要： A coil component according to one or more embodiments of the present invention includes: an insulating base body having a bottom surface; a coil conductor disposed in the base body and having a coil surface opposed to the bottom surface; and a reinforcement portion disposed in the base body. The reinforcement portion is disposed at a position closer to the bottom surface than is a middle point between the bottom surface and the coil surface.
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公开(公告)号：US11153972B2
公开(公告)日：2021-10-19
申请号：US16791863
申请日：2020-02-14
发明人： Osamu Takahashi
摘要： In an exemplary embodiment, a passive component, which is a surface mounting component, includes: a substrate body having insulating property; an internal conductor built into the substrate body; and an external electrode provided on a mounting face of the substrate body and electrically connected to the internal conductor; wherein the external electrode has a face parallel with the mounting face of the substrate body, and a concaved part which is concaved with reference to the parallel face toward the mounting face side of the substrate body and whose shape at the parallel face is circular or oval. The passive component can prevent its joining strength with a circuit board from decreasing, while preventing the component size from increasing.
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公开(公告)号：US20210319954A1
公开(公告)日：2021-10-14
申请号：US17359238
申请日：2021-06-25
发明人： Tomoaki NAKAMURA , Mikio TAHARA , Masako KANOU , Fusao SATO
摘要： A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces of the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces to at least one side face of side faces, wherein each external electrode includes a metal layer formed from the end face to the at least one side face and mainly composed of copper, and an oxide layer covering at least a part of the metal layer, mainly composed of copper oxide, and having a maximum thickness of 0.5 μm or greater, wherein a first surface, which is in contact with the plated layer, of the oxide layer has Cu particles formed thereon.
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