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公开(公告)号：US20210319954A1
公开(公告)日：2021-10-14
申请号：US17359238
申请日：2021-06-25
发明人： Tomoaki NAKAMURA , Mikio TAHARA , Masako KANOU , Fusao SATO
摘要： A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces of the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces to at least one side face of side faces, wherein each external electrode includes a metal layer formed from the end face to the at least one side face and mainly composed of copper, and an oxide layer covering at least a part of the metal layer, mainly composed of copper oxide, and having a maximum thickness of 0.5 μm or greater, wherein a first surface, which is in contact with the plated layer, of the oxide layer has Cu particles formed thereon.
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公开(公告)号：US20210035743A1
公开(公告)日：2021-02-04
申请号：US16945260
申请日：2020-07-31
摘要： A multilayer ceramic electronic device includes a ceramic main body and a pair of external electrodes respectively covering a pair of end surfaces of the ceramic main body, wherein the ceramic main body includes a laminated body including a plurality of internal electrodes laminated vertically therein, and a pair of side margin parts respectively covering a pair of side surfaces of the laminated body, and wherein a distance between a bottom surface of the ceramic main body and the bottommost internal electrode is greater than a distance between the top surface of the ceramic main body and the topmost internal electrode.
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公开(公告)号：US20190148075A1
公开(公告)日：2019-05-16
申请号：US16178314
申请日：2018-11-01
摘要： A ceramic electronic device includes: a ceramic main body that has internal electrode layers inside thereof and has a parallelepiped shape in which a part of one of the internal electrode layers is extracted to a first edge face of the parallelepiped shape and a part of another internal electrode layer is extracted to a second edge face of the parallelepiped shape facing the first edge face; external electrodes that are respectively formed on the first edge face and the second edge face and extend to at least one of side faces of the ceramic main body, wherein an interval between side edge portions of the external electrodes on the at least one of side faces is shorter than center portions of the external electrodes on the at least one of side faces.
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公开(公告)号：US20180061576A1
公开(公告)日：2018-03-01
申请号：US15679063
申请日：2017-08-16
发明人： Tomoaki NAKAMURA , Mikio TAHARA
CPC分类号： H01G4/30 , H01G4/008 , H01G4/12 , H01G4/1227 , H01G4/2325 , H01G4/248
摘要： A multilayer ceramic capacitor includes: a multilayer chip having a parallelepiped shape in which each of a plurality of ceramic dielectric layers and each of a plurality of internal electrode layers are alternately stacked and are alternately exposed to two edge faces of the multilayer chip; and a pair of external electrodes that are formed from the two edge faces to at least one of side faces of the multilayer chip; wherein in the external electrodes, a first metal layer whose ceramic amount is 5 wt % or more contacts with the two edge faces, and a second metal layer whose ceramic amount is less than 5 wt % contacts with the at least one of the side faces.
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公开(公告)号：US20190096577A1
公开(公告)日：2019-03-28
申请号：US16138148
申请日：2018-09-21
摘要： A ceramic electronic device includes: a ceramic main body having at least two edge faces facing each other; and external electrodes formed on the two edge faces, wherein: the external electrodes have a structure in which a plated layer is formed on a ground layer having ceramic; a main component of the ground layer is a metal; the external electrodes have an extension region that extends to at least one of four side faces from the two edge faces of the ceramic main body; a part of the extension region corresponding to a corner portion of the ceramic main body has a first portion having a maximum spaced distance of 10 μm or less in a face direction of the ground layer; and the plated layer has an average thickness that is 30% or more with respect to the maximum spaced distance, and covers the first portion.
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公开(公告)号：US20160172109A1
公开(公告)日：2016-06-16
申请号：US14903980
申请日：2014-07-08
申请人： TAIYO YUDEN CO., LTD
摘要： In an embodiment, a capacitor body 11 of the multilayer ceramic capacitor 10 has protective parts 11a made of ceramics, capacitance-forming parts 11b comprising multiple internal electrode layers 11b1 stacked together with ceramic layers 11b2 placed in between, and a non-capacitance-forming part 11c made of ceramics, in the order of “protective part 11a—capacitance-forming part 11b—non-capacitance-forming part 11c—capacitance-forming part 11b—protective part 11a” from one side to the other side along the laminating direction, and T2 representing the thickness of each protective part 11a in the laminating direction, T3 representing the thickness of each capacitance-forming part 11b in the laminating direction, and T4 representing the thickness of the non-capacitance-forming part 11c in the laminating direction, satisfy the relationship of “T2
摘要翻译： 在一个实施例中，多层陶瓷电容器10的电容器主体11具有由陶瓷制成的保护部分11a，电容形成部分11b包括多个内部电极层11b1，堆叠在一起的陶瓷层11b2与非电容成形 从层叠方向的一侧到另一侧的“保护部11a电容形成部11b-非电容形成部11c电容形成部11b保护部11a”的顺序为陶瓷制的部件11c ，T2表示层叠方向上的各保护部11a的厚度，T3表示层叠方向上的各电容形成部11b的厚度，T4表示层叠方向上的非电容形成部11c的厚度 ，满足“T2
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公开(公告)号：US20210210284A1
公开(公告)日：2021-07-08
申请号：US17209025
申请日：2021-03-22
摘要： A ceramic electronic device includes: a ceramic main body of a parallelepiped shape having at least two edge faces facing each other, and having an internal electrode layer inside; and external electrodes formed on the two edge faces and having a structure in which a plated layer is formed on a ground layer having a metal, as a main component, and ceramic; the external electrodes have an extension region which extends to at least one of four side faces from the two edge faces, and a part of which corresponds to a corner portion of the ceramic main body and includes a portion with the ground layer and a first portion, without the ground layer, arranged at a position where one of the two end faces and one of the four side faces are connected; and the plated layer covers the ground layer and the first portion.
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公开(公告)号：US20210151255A1
公开(公告)日：2021-05-20
申请号：US17089559
申请日：2020-11-04
发明人： Mikio TAHARA , Tomoaki NAKAMURA
摘要： A ceramic electronic component includes a multilayer chip including a multilayer structure and cover layers disposed on top and bottom faces in a stack direction of the multilayer structure, and a pair of external electrodes respectively formed on two edge faces of the multilayer structure and extending to four side faces of the multilayer chip, wherein each external electrode has a recessed portion on at least one of two side faces facing each other in the stack direction or at least one of remaining two side faces, and wherein each external electrode has no recessed portion on the two side faces when each external electrode has the recessed portion on at least one of the remaining two side faces, and has no recessed portion on the remaining two side faces when each external electrode has the recessed portion on at least one of the two side faces.
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公开(公告)号：US20190355520A1
公开(公告)日：2019-11-21
申请号：US16410914
申请日：2019-05-13
发明人： Tomoaki NAKAMURA , Mikio TAHARA , Masako KANOU , Fusao SATO
摘要： A multilayer ceramic capacitor includes: a multilayer chip in which dielectric layers mainly composed of ceramic and internal electrode layers are alternately stacked so that the internal electrode layers are alternately exposed to two end faces, which face each other, of the multilayer chip, the multilayer chip having a substantially rectangular parallelepiped shape; and a pair of external electrodes formed from the two end faces of the multilayer chip to at least one side face of side faces of the multilayer chip, wherein each of the pair of external electrodes includes a metal layer and an oxide layer, the metal layer being formed from the end face to the at least one side face and being mainly composed of copper, the oxide layer covering at least a part of the metal layer, being mainly composed of copper oxide, and having a maximum thickness of 0.5 μm or greater.
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10.发明申请公开(公告)号：US20180090272A1
公开(公告)日：2018-03-29
申请号：US15705044
申请日：2017-09-14
CPC分类号： H01G4/1227 , H01G4/0085 , H01G4/012 , H01G4/1209 , H01G4/232 , H01G4/248 , H01G4/30 , H01G4/33
摘要： A multilayer ceramic capacitor includes: a first and a second external electrodes; internal electrode layers that are alternately connected to the first and the second external electrodes; and dielectric layers including a ceramic material as a main component, wherein a D20% diameter of the ceramic material of an end margin region, in which internal electrode layers connected to one of the first external electrode and the second external electrode face with each other and does not face with internal electrode layers connected to the other, is smaller than that of a capacity region in which internal electrode layers connected to different external electrodes face with each other and a D80% diameter of the ceramic material of the end margin region is larger than that of the capacity region, or 1/(log D80−log D20) of the ceramic material of the capacity region is larger than that of the end margin region.
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