Organic light emitting display substrate and manufacturing method thereof

    公开(公告)号:US10797124B2

    公开(公告)日:2020-10-06

    申请号:US16457139

    申请日:2019-06-28

    Abstract: The present application provides an organic light emitting display substrate and a method of fabricating the same. The organic light emitting display substrate includes: a base substrate; and a driving transistor provided on the base substrate, wherein the driving transistor includes: an active layer; a first insulating layer having at least one sub-layer covering the active layer and having a first via hole therein; and a source electrode and a drain electrode disposed on a side of the first insulating layer distal to the base substrate, and connected to the active layer through the first via hole in the first insulating layer.

    Display substrate and method for preparing the same, and display device

    公开(公告)号:US10770532B2

    公开(公告)日:2020-09-08

    申请号:US16515781

    申请日:2019-07-18

    Abstract: A display substrate according to an embodiment of the present disclosure comprises a substrate and a plurality of pixel units on the substrate, at least one of the plurality of pixel units comprising a light-emitting unit, a photosensitive unit for detecting light emitted by the light-emitting unit, and an interlayer insulating layer between the photosensitive unit and the light-emitting unit, wherein the interlayer insulating layer comprises a groove, an orthogonal projection of which on the substrate does not coincide with an orthogonal projection of the photosensitive unit on the substrate, and the light-emitting unit covers the groove.

    Package substrate, method of manufacturing the same, display panel and display device

    公开(公告)号:US10658449B2

    公开(公告)日:2020-05-19

    申请号:US15967860

    申请日:2018-05-01

    Abstract: A package substrate includes a base substrate having a light-transmitting region and a non-light-transmitting region, wherein metal electrodes and a spacer located on at least a part of a surface of the metal electrodes away from the base substrate are provided on the base substrate, an orthogonal projection of the spacer on the base substrate is within an orthogonal projection of the metal electrodes on the base substrate, and an orthogonal projection of the metal electrode on the base substrate is within the non-light-transmitting region of the base substrate, and an interval exists between the spacer and the metal electrodes. A method of manufacturing the package substrate is used for manufacturing the above package substrate. The package substrate provided by the present disclosure is used in a display device.

    Method of fabricating thin film transistor, thin film transistor, and display apparatus

    公开(公告)号:US10431668B2

    公开(公告)日:2019-10-01

    申请号:US15741741

    申请日:2017-06-30

    Abstract: The present application discloses a method of fabricating a thin film transistor. The method includes forming an active layer having a channel region, a source electrode contact region, and a drain electrode contact region, on a base substrate; forming a first photoresist layer on a side of the active layer distal to the base substrate, the first photoresist layer is formed in a region outside that corresponding to the channel region; forming an insulating material layer on a side of the first photoresist layer distal to the base substrate; forming a first conductive metal material layer on a side of the insulating material layer distal to the first photoresist layer; and removing the first photoresist layer, the insulating material layer, the first conductive metal material layer, in the region outside that corresponding to the channel region by a lift-off method.

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