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公开(公告)号：USD996417S1
公开(公告)日：2023-08-22
申请号：US29850631
申请日：2022-08-22
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , James A. Bertin , Daniele De Iuliis , Markus Diebel , David J. Dunsmoor , M. Evans Hankey , Matthew David Hill , Julian Hoenig , Richard P. Howarth , Stoyan P. Hristov , Jonathan P. Ive , Julian Jaede , Duncan Robert Kerr , David A. Pakula , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Ian Spraggs , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Melissa A. Wah , Eugene Antony Whang , Rico Zörkendörfer
Abstract: FIG. 1 is a bottom front perspective view of a housing module for an electronic device showing the claimed design;
FIG. 2 is a top rear perspective view thereof;
FIG. 3 is a front view thereof;
FIG. 4 is a rear view thereof;
FIG. 5 is a left side view thereof;
FIG. 6 is a right side view thereof;
FIG. 7 is a top view thereof; and,
FIG. 8 is a bottom view thereof.
The broken lines in the figures show portions of the housing module for an electronic device that form no part of the claimed design.
The oblique shade lines in the figures show transparency or translucency.-
公开(公告)号：US11662772B2
公开(公告)日：2023-05-30
申请号：US17220592
申请日：2021-04-01
Applicant: Apple Inc.
Inventor： David A. Pakula , Daniel W. Jarvis , Shimon Elkayam , Brandon R. Garbus , Christopher S. Graham , Karl Ruben F. Larsson , Ashley E. Fletcher , Jared M. Kole , Eric S. Jol , Aaron A. Oro , Michael D. Quinones , Gregory N. Stephens , Ian A. Spraggs , James A. Bertin , Simon C. Helmore , Melissa A. Wah , Matthew D. Hill , Jon F. Housour , Douglas G. Fournier , Christopher S. Tomasetta
IPC: H04N5/225 , H04M1/02 , H02J50/70 , G06V40/16 , G06F1/16 , H02J50/10 , G06F1/26 , H04N23/45 , H04N23/51
CPC classification number: G06F1/1626 , G06F1/1658 , G06F1/1686 , G06F1/26 , H02J50/10 , H02J50/70 , H04M1/0202 , H04N23/45 , H04N23/51 , G06V40/172 , H04M1/0264 , H04M1/0277
Abstract: An electronic disclosed herein may include a band formed from metal that combines with a bottom wall formed from a non-metal to form an enclosure that carries internal components. The electronic device may include a transparent cover and a display assembly partially covered by a border having a uniform dimension. The electronic device may include a vision system designed for facial recognition of a user of the electronic device. A bracket assembly may hold the vision system. The bracket assembly may not be affixed to the enclosure and may move relative to the enclosure. The electronic device may include a battery assembly having multiple battery components coupled together. The electronic device may further include a receiver coil for wireless charging of the battery assembly. The electronic device may include a circuit board assembly having stacked circuit boards. The electronic device may further include a dual camera assembly.
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公开(公告)号：US20220091398A1
公开(公告)日：2022-03-24
申请号：US17481210
申请日：2021-09-21
Applicant: Apple Inc.
Inventor： Nicholas D. Smyth , Scott W. Miller , Douglas S. Brodie , Michael B. Wittenberg , James A. Bertin , David A. Pakula , Yoshikazu Shinohara
Abstract: A camera may include an image sensor and an optics assembly that may include a light folding element and a lens group having one or more lenses. The light folding element may be placed optically between the image sensor and the lens group, and may redirect light passing through the lens group to the image sensor. The optics assembly may be stationarily attached to a stationary base of the camera, which may be further attached to a stationary housing of the camera. The image sensor may be moved, e.g., using an actuator, in multiple axes relative to the optics assembly to implement autofocus (AF) and/or optical image stabilization (OIS) functions.
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公开(公告)号：USD945425S1
公开(公告)日：2022-03-08
申请号：US29648153
申请日：2018-05-18
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , James A. Bertin , Daniele De Iuliis , Markus Diebel , David J. Dunsmoor , M. Evans Hankey , Matthew David Hill , Julian Hoenig , Richard P. Howarth , Stoyan P. Hristov , Jonathan P. Ive , Julian Jaede , Duncan Robert Kerr , David A. Pakula , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Ian Spraggs , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Melissa A. Wah , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：US11073872B2
公开(公告)日：2021-07-27
申请号：US16818680
申请日：2020-03-13
Applicant: Apple Inc.
Inventor： Andrew U. Leopold , Owen D. Hale , Daniel W. Jarvis , David A. Pakula , James B. Smith , Ian A. Spraggs , Gregory N. Stephens
IPC: G06F1/16 , H05K7/02 , H01R12/52 , H05K9/00 , H05K1/18 , H02J50/10 , H04R1/02 , H04R3/00 , H02J7/02 , G08B7/06
Abstract: A distributed auxiliary hub for a portable electronic device is disclosed. The distributed auxiliary hub, located on a stacked circuit assembly, can distribute electrical signals to multiple different destinations. The distributed auxiliary hub is displaced and separate from a main logic board, and as a result, can provide supplemental functions. Although the distributed auxiliary hub is electrically coupled to the main logic board, the distributed auxiliary hub includes dedicated integrated circuits responsible for executing functions related to battery charging and powering of electronic components (e.g., haptic feedback module, speaker module, etc.). As a result, the distributed auxiliary hub, when executing these aforementioned functions, is not reliant upon the main logic board to transmit electrical current to the battery and/or electronic components. The distributed auxiliary hub, when electrically coupled to an external resource, is capable of directly transmitting electrical current to electronic components.
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Patent Agency Ranking
公开(公告)号：USD903643S1
公开(公告)日：2020-12-01
申请号：US29501776
申请日：2014-09-08
Applicant: Apple Inc.
Designer： Jody Akana , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Jeremy Bataillou , Daniel J. Coster , Daniele De Iuliis , M. Evans Hankey , Julian Hoenig , Richard P. Howarth , Jonathan P. Ive , Duncan Robert Kerr , Scott A. Myers , David A. Pakula , Rasamy Phouthavong , Matthew Dean Rohrbach , Peter Russell-Clarke , Benjamin Andrew Shaffer , Ashutosh Y. Shukla , Mikael Silvanto , Christopher J. Stringer , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：USD901510S1
公开(公告)日：2020-11-10
申请号：US29701142
申请日：2019-08-08
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Daniele De Iuliis , Markus Diebel , M. Evans Hankey , Julian Hoenig , Lee E. Hooton , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Robert F. Meyer , David A. Pakula , Michael D. Quinones , Marwan Rammah , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：US20200337184A1
公开(公告)日：2020-10-22
申请号：US16708159
申请日：2019-12-09
Applicant: Apple Inc.
Inventor： Robert F. Meyer , William A. Counts , Michael D. Quinones , Jason P. Shannon , David A. Pakula
Abstract: An electronic device can include a housing and a support component joined to the housing. The support component can include a thermal conduction layer defining a first surface and a second surface opposite the first surface. The support component can also include a first support layer overlying the first surface and a second support layer overlying the second surface. A ratio of the thickness of the thermal conduction layer to the combined thickness of the first support layer and the second support layer can be at least 1.5.
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公开(公告)号：USD895628S1
公开(公告)日：2020-09-08
申请号：US29691815
申请日：2019-05-20
Applicant: Apple Inc.
Designer： Jody Akana , Molly Anderson , Bartley K. Andre , Shota Aoyagi , Anthony Michael Ashcroft , Marine C. Bataille , Jeremy Bataillou , Daniele De Iuliis , Markus Diebel , M. Evans Hankey , Julian Hoenig , Lee E. Hooton , Richard P. Howarth , Jonathan P. Ive , Julian Jaede , Daniel W. Jarvis , Duncan Robert Kerr , Robert F. Meyer , David A. Pakula , Michael D. Quinones , Marwan Rammah , Peter Russell-Clarke , Benjamin Andrew Shaffer , Mikael Silvanto , Ian Spraggs , Christopher J. Stringer , Joe Sung Ho Tan , Tang Yew Tan , Clement Tissandier , Eugene Antony Whang , Rico Zörkendörfer
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公开(公告)号：US10754388B2
公开(公告)日：2020-08-25
申请号：US16405239
申请日：2019-05-07
Applicant: Apple Inc.
Inventor： Scott Myers , Matthew Theobald , Richard Heley , Adam Stagnaro , Richard Hung Minh Dinh , David A. Pakula , Tang Yew Tan
Abstract: This is directed to an electronic device enclosure. The enclosure includes an outer periphery member forming an outer surface of a device, and to which an internal platform is connected. Electronic device components can be assembled to one or both surfaces of the internal platform. The enclosure can include front and back cover assemblies assembled to the opposite surfaces of the outer periphery member to retain electronic device components. One or both of the cover assemblies can include a window through which display circuitry can provide content to a user of the device.
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