Low temperature carbon/bn/aluminum oxide coating

    公开(公告)号:US11634365B2

    公开(公告)日:2023-04-25

    申请号:US17121917

    申请日:2020-12-15

    摘要: A method of forming an activated coating composition is disclosed. The method includes providing (a) boron nitride, (b) carbon, (c) aluminum oxide and (d) a liquid carrier. Each of the boron nitride, carbon and aluminum oxide are in particulate form. The coating composition is activated to form an activated coating composition. The activated coating composition includes active components having from about 60.0 wt % to about 90.0 wt % boron nitride, from about 16 wt % to about 24 wt % carbon and from about 4 wt % to about 6 wt % aluminum oxide. A coating method, coated substrate and activated coating composition are also disclosed.

    CERAMIC COMPOSITE HEATERS COMPRISING BORON NITRIDE AND TITANIUM DIBORIDE

    公开(公告)号:US20220098116A1

    公开(公告)日:2022-03-31

    申请号:US17417876

    申请日:2019-12-18

    IPC分类号: C04B35/583 C04B35/58 H05B3/14

    摘要: Provided is a ceramic composite including boron nitride (BN) and titanium diboride (TiB2) for use in 2-D and 3-D heating element applications. The ceramic composite can be used in heater applications without a protective coating. The ceramic composite may be corrosion resistant against oxygen and moisture up to, for example, a temperature of 900° C., and may offer increased corrosion resistance against molten or vapor metal, including aluminum. The ceramic composite may be sufficiently rigid and may not require additional dielectric structural support. The ceramic composite may be sufficiently fracture resistant to enable machining of intricate and complex patterns and designs with a high aspect ratio of the coil length to width or thickness. The ceramic composite may be used with any heater shape, orientation, and size.

    High-Strength Refractory Fibrous Materials

    公开(公告)号:US20220033999A1

    公开(公告)日:2022-02-03

    申请号:US17504647

    申请日:2021-10-19

    申请人: Dynetics, Inc.

    摘要: The disclosed materials, methods, and apparatus, provide novel ultra-high temperature materials (UHTM) in fibrous forms/structures; such “fibrous materials” can take various forms, such as individual filaments, short-shaped fiber, tows, ropes, wools, textiles, lattices, nano/microstructures, mesostructured materials, and sponge-like materials. At least four important classes of UHTM materials are disclosed in this invention: (1) carbon, doped-carbon and carbon alloy materials, (2) materials within the boron-carbon-nitride-X system, (3) materials within the silicon-carbon-nitride-X system, and (4) highly-refractory materials within the tantalum-hafnium-carbon-nitride-X and tantalum-hafnium-carbon-boron-nitride-X system. All of these material classes offer compounds/mixtures that melt or sublime at temperatures above 1800° C.—and in some cases are among the highest melting point materials known (exceeding 3000° C.). In many embodiments, the synthesis/fabrication is from gaseous, solid, semi-solid, liquid, critical, and supercritical precursor mixtures using one or more low molar mass precursor(s), in combination with one or more high molar mass precursor(s). Methods for controlling the growth, composition, and structures of UHTM materials through control of the thermal diffusion region are disclosed.

    BORON NITRIDE AGGLOMERATE, THERMOSETTING RESIN COMPOSITION CONTAINING SAME, AND USE THEREOF

    公开(公告)号:US20210221743A1

    公开(公告)日:2021-07-22

    申请号:US16770004

    申请日:2018-03-23

    发明人: Zengbiao HUANG

    摘要: Provided is a boron nitride agglomerate. The boron nitride agglomerate is of a multi-stage structure formed by arranging flaky hexagonal boron nitride primary particles in three-dimensional directions through adhesion of an inorganic binder. Further provided is a method for preparing the boron nitride agglomerate. The method comprises: mixing flaky hexagonal boron nitride primary particles with an inorganic binder, and controlling the mass of the inorganic binder to account for 0.02-20% of the mass of the flaky hexagonal boron nitride primary particles, so as to obtain the boron nitride agglomerate. The boron nitride agglomerate provided can be added to thermosetting resin compositions, and resin sheets, resin composite metal foil, prepregs, laminates, metal foil-covered laminates, and printed wiring boards prepared using the same have higher boron nitride addition, high thermal conductivity, and high peel strength.