公开(公告)号：US09823652B2

公开(公告)日：2017-11-21

申请号：US14380586

申请日：2013-02-12

Applicant: HITACHI KOKUSAI ELECTRIC INC.

Inventor： Kazuyoshi Yamamoto

IPC: G05B19/418 ,  H01L21/67 ,  H01J37/32 ,  H01L21/02 ,  G05B23/02

CPC classification number: G05B19/41875 ,  G05B23/0267 ,  G05B2219/24068 ,  G05B2219/2602 ,  H01J37/32082 ,  H01J37/32926 ,  H01L21/02 ,  H01L21/6719 ,  H01L21/67201 ,  H01L21/67288 ,  Y02P90/14

Abstract: A substrate processing system includes a substrate processing apparatus configured to process a substrate, and a management device configured to display specified information transmitted from the substrate processing apparatus on a display unit. The substrate processing apparatus includes a processing environment measuring unit configured to measure information on a substrate processing environment according to time and a trouble information notifying unit configured to notify information on a trouble of the substrate processing apparatus. The management device includes a storage unit configured to store measurement information measured by the processing environment measuring unit and notification information notified by the trouble information notifying unit. The display unit is configured to display the measurement information and the notification information which are stored in the storage unit and correlated with each other.

公开(公告)号：US20170329318A1

公开(公告)日：2017-11-16

申请号：US15666765

申请日：2017-08-02

Applicant: Tokyo Electron Limited

Inventor： Sanjeev Kaushal ,  Sukesh Janubhai Patel ,  Wolfgang Polak ,  Aaron Archer Waterman ,  Orion Wolfe

IPC: G05B19/418

CPC classification number: G05B19/41875 ,  G05B2219/32187 ,  G05B2219/45031 ,  G06N20/00 ,  Y02P90/22 ,  Y02P90/86

Abstract: A system and method autonomously determines the impact of respective tool parameters on tool performance in a semiconductor manufacturing system. A parameter impact identification system receives tool parameter and tool performance data for one or more process runs of the semiconductor fabrication system and generates a separate function for each tool parameter characterizing the behavior of a tool performance indicator in terms of a single one of the tool parameters. Each function is then scored according to how well the function predicts the actual behavior of the tool performance indicator, or based on a determined sensitivity of the tool performance indicator to changes in the single tool parameter. The tool parameters are then ranked based on these scores, and a reduced set of critical tool parameters is derived based on the ranking. The tool performance indicator can then be modeled based on this reduced set of tool parameters.

公开(公告)号：US20170318857A1

公开(公告)日：2017-11-09

申请号：US15660516

申请日：2017-07-26

Applicant: International Tobacco Machinery Poland Sp. z o. o.

Inventor： Leszek Sikora ,  Bartosz Cieslikowski

IPC: A24D3/02 ,  A24C5/345 ,  A24C5/34 ,  A24C5/32 ,  G05B19/418 ,  A24C5/28

CPC classification number: A24D3/0295 ,  A24C5/28 ,  A24C5/322 ,  A24C5/34 ,  A24C5/3412 ,  A24C5/345 ,  A24D3/0229 ,  A24D3/0287 ,  G05B19/41875 ,  Y02P90/22

Abstract: A method for manufacturing rod-like articles, comprising a machine for manufacturing the rod-like articles or a feeding device for delivering the rod-like articles, a first measuring unit for measuring at least one quality parameter of the manufactured rod-like articles, a device for dividing a stream of the rod-like articles into a first stream and into a second stream, a first transferring device, which receives the first stream of the rod-like articles and transfers this stream as an output stream of the rod-like articles manufacturing system, a second transferring device which transfers inspected rod-like article to the output stream of the rod-like articles on the first transferring device.

公开(公告)号：US09791855B2

公开(公告)日：2017-10-17

申请号：US14718116

申请日：2015-05-21

Applicant: Samsung Electronics Co., Ltd.

Inventor： Dong-hoon Han ,  Jai-hyung Won ,  Do-hyung Kim ,  Sung-hyup Kim ,  Ho-jun Kim

IPC: G05B19/401 ,  H01L21/67 ,  G05B19/418

CPC classification number: G05B19/41875 ,  G05B2219/31443 ,  G05B2219/45031 ,  G05B2219/50139 ,  Y02P90/20 ,  Y02P90/22

Abstract: A semiconductor process management system is provided. The semiconductor process management system includes a communicator that receives a process recipe from one or more process apparatuses and receives a measured value for each sampling point from one or more measuring apparatus, and a first determination unit that establishes a mutual influence model between the process recipe and the measured value for each sampling point based on the process recipe and the measured value for each sampling point.

公开(公告)号：US09791854B2

公开(公告)日：2017-10-17

申请号：US14695202

申请日：2015-04-24

Applicant: TOKYO ELECTRON LIMITED

Inventor： Takuo Yamamoto ,  Yuki Kataoka

IPC: G05B19/418 ,  G05B13/04 ,  G06N5/02 ,  F02D41/14 ,  C23C16/52 ,  F02D41/20 ,  H01L21/66

CPC classification number: G05B19/41875 ,  C23C16/52 ,  F02D41/1402 ,  F02D41/1441 ,  F02D2041/1412 ,  F02D2041/1416 ,  F02D2041/1426 ,  F02D2041/1433 ,  F02D2041/2058 ,  F02D2200/0402 ,  G05B13/041 ,  G05B13/042 ,  G05B2219/31103 ,  G05B2219/32018 ,  G05B2219/32187 ,  G06N5/022 ,  H01L22/20 ,  H01L2924/0002 ,  Y02P90/12 ,  Y02P90/22 ,  H01L2924/00

Abstract: A device for computing correction for control parameter in a manufacturing process executed on a manufacturing apparatus includes circuitry which acquires an index representing fluctuation in a manufacturing apparatus, acquires an apparatus model and a process model, acquires an output from a sensor in the manufacturing apparatus, transforms the output into first fluctuation for a process element, transforms the index into second fluctuation for the process element based on the apparatus model, computes fluctuation for performance indicator from the first and second fluctuation based on the process model, computes correction for the performance indicator from control range for the performance indicator and the fluctuation for the performance indicator, and converts the correction for the performance indicator into correction for each process element based on the process model such that correction for control parameter in process executed on the manufacturing apparatus is computed from the correction converted for each process element.

公开(公告)号：US20170285624A1

公开(公告)日：2017-10-05

申请号：US15087604

申请日：2016-03-31

Applicant: Sysmex Corporation

Inventor： Scott Lesher

IPC: G05B19/418

CPC classification number: G05B19/41875 ,  G01N35/00613 ,  G01N35/00871 ,  G01N2035/00653 ,  G01N2035/00881 ,  G05B2219/32368 ,  G05B2219/33326 ,  G16H40/40

Abstract: A method for performing quality control on a diagnostic analyzer includes receiving control measurement values from each of a plurality of diagnostic analyzers. A quality control measurement value is received from a target diagnostic analyzer. The quality control measurement value is compared with statistical criteria associated with the plurality of quality control measurement values received from the plurality of diagnostic analyzers. A comparison result is communicated to a user interface associated with the target diagnostic analyzer.

公开(公告)号：US20170248940A1

公开(公告)日：2017-08-31

申请号：US15513844

申请日：2015-09-21

Applicant: BOMBARDIER INC.

Inventor： Laurent REGNAULT

IPC: G05B19/418

CPC classification number: G05B19/41875 ,  G01B21/04 ,  G05B19/41805 ,  G05B2219/31064 ,  G05B2219/32212 ,  G05B2219/32213 ,  G05B2219/35226 ,  G05B2219/37079 ,  G07C3/14 ,  Y02P90/04 ,  Y02P90/22

Abstract: There is described herein an inspection tool for use during the inspection of components as manufactured. The inspection tool allows the comparison of measurement data with nominal data and provides complementary information with regards to at least one feature of the component.

公开(公告)号：US20170242415A1

公开(公告)日：2017-08-24

申请号：US15425320

申请日：2017-02-06

Applicant: ContMid Holdings, Inc.

Inventor： Phil C. Johnson ,  Darren DeMill

IPC: G05B19/048 ,  G01N21/95 ,  G05B19/18

CPC classification number: G05B19/048 ,  G01N21/95 ,  G05B19/186 ,  G05B19/41875 ,  G05B2219/24015 ,  G05B2219/32018 ,  G05B2219/32179 ,  G05B2219/42001 ,  G05B2219/49298 ,  G05B2219/50252 ,  Y02P90/22

Abstract: A production system and method may comprise a first production processing machine capable of processing a workpiece and a second production processing machine capable of processing the workpiece. The production system and method may also comprise a workpiece transfer device, the workpiece transfer device moving the workpiece from the first production processing machine to the second production processing machine, an inspection device identifying whether the workpiece meets at least one specification of the workpiece, and a computing device in communication with the inspection device notifying a user whether the workpiece is compliant with the at least one specification where the computing device is operative communication with either or both of the first production processing machine and the second production processing machine whereby the computing device alters operation of either or both of the first and second production processing machines.

公开(公告)号：US20170242070A1

公开(公告)日：2017-08-24

申请号：US15051537

申请日：2016-02-23

Applicant: QUALCOMM Incorporated

Inventor： Paul Giotta ,  Sachin Dasnurkar

IPC: G01R31/30 ,  G01R31/28

CPC classification number: G01R31/30 ,  G01R31/2831 ,  G01R31/2894 ,  G05B19/41875 ,  H01L22/14 ,  H01L22/20

Abstract: Embodiments described herein provide a method for identifying failure patterns in electronic devices. The method begins when a limit is determined for a parameter of interest. A series of the electronic devices is then tested using the limit of the parameter of interest. Failing devices are then identified and x and y coordinate values are plotted. Pattern recognition may be used to determine if the failures shown on the coordinate plot fit a failure pattern. The limit of the parameter of interest is then regressed in steps to the mean value of the failing devices and the electronic devices are retested. The failure pattern of the retested devices is examined to determine if the failure pattern fits a failure pattern. If the failure pattern fits a failure pattern then the parameter of interest may be found to affect the yield rate of production for the electronic devices.

公开(公告)号：US09733624B2

公开(公告)日：2017-08-15

申请号：US13981239

申请日：2012-02-23

Applicant: Marco Rosani ,  Gabriele Pastrello ,  Matteo Piantoni ,  Alberto Perego

Inventor： Marco Rosani ,  Gabriele Pastrello ,  Matteo Piantoni ,  Alberto Perego

IPC: G06F19/00 ,  G05B13/02 ,  A61F13/15 ,  G05B19/418 ,  B65H29/16 ,  B65H43/04 ,  G06T7/00

CPC classification number: G05B13/02 ,  A61F13/15772 ,  B65H29/16 ,  B65H43/04 ,  B65H2301/4451 ,  B65H2301/542 ,  B65H2553/42 ,  B65H2801/57 ,  G05B19/41875 ,  G05B2219/37544 ,  G06T7/001 ,  Y02P90/22

Abstract: A method for corrective action on the operation of a line for the production of absorbent sanitary articles, comprises capturing at least one image of each article being fed out of the line; using the image to define first parameters indicating the positioning and/or assembly and/or shape of at least one respective component; detecting a production defect if at least one of the first parameters is outside a respective acceptability range; identifying second, line operating parameters which are used to indicate if the first parameter is outside the respective acceptability range; comparing the line operating parameters with respective third, reference parameters indicating optimum line operation; using the comparison to derive a map of abnormal operating parameters; checking if each combination of abnormal operating parameters indicates a respective cause of malfunction of the line; defining a respective corrective action.