Relative pressure sensor
    91.
    发明授权
    Relative pressure sensor 有权
    相对压力传感器

    公开(公告)号:US08770032B2

    公开(公告)日:2014-07-08

    申请号:US13389855

    申请日:2010-07-21

    IPC分类号: G01L7/00 G01L19/06 G01L19/14

    摘要: A relative pressure sensor includes: a pressure measuring transducer having a measuring membrane of a semiconductor chip and a platform, wherein, between both of these, a reference pressure chamber is formed; a support body, connected with the platform by means of a pressure-bearing adhesion, wherein a reference pressure path extends through the two former elements into the reference pressure chamber; and a sensor outer body, in which a transducer chamber with a first opening and a second opening is formed. The pressure measuring transducer is brought into the transducer chamber through the first opening, and is held therein by means of the support body. The support body pressure-tightly seals the first opening, and a side of the measuring membrane facing away from the reference pressure chamber is contactable with the media pressure through the second opening. The reference pressure path has a gas-filled, sealed section, which extends from the reference pressure chamber at least through the pressure bearing adhesion, and wherein the sealed section is gas-tightly sealed by means of a flexible, metallized plastic foil.

    摘要翻译: 相对压力传感器包括:具有半导体芯片的测量膜和平台的压力测量传感器,其中,在这两者之间形成基准压力室; 支撑体,其通过承压粘合与平台连接,其中参考压力路径延伸穿过两个前述元件进入参考压力室; 以及传感器外壳,其中形成有具有第一开口和第二开口的换能器室。 压力测量传感器通过第一开口进入传感器室,并通过支撑体保持在其中。 支撑体对第一开口进行压力密封,并且测量膜的背离参考压力室的一侧可通过第二开口与介质压力相接触。 参考压力路径具有气体填充的密封部分,其从参考压力室至少通过压力承载粘合力延伸,并且其中密封部分通过柔性金属化塑料箔气密密封。

    Weatherized direct-mount absolute pressure sensor
    92.
    发明授权
    Weatherized direct-mount absolute pressure sensor 有权
    减压直接安装绝对压力传感器

    公开(公告)号:US08371160B2

    公开(公告)日:2013-02-12

    申请号:US12639665

    申请日:2009-12-16

    IPC分类号: G01M9/00

    摘要: A piezoresistive sensor assembly is provided that has a flex circuit having at least one air flow aperture formed therein. A sensor die is coupled to an absolute support and the flex circuit. The sensor die has a diaphragm that deflects in response to air flow that flows through the air flow aperture and is incident on the diaphragm. The sensor die includes one or more gages positioned on or in the diaphragm.

    摘要翻译: 提供一种压阻传感器组件,其具有形成在其中的至少一个气流孔的柔性电路。 传感器管芯耦合到绝对支架和柔性电路。 传感器模具具有响应于流过空气流通孔并入射在隔膜上的空气流而偏转的隔膜。 传感器模具包括位于隔膜上或隔膜中的一个或多个计量器。

    PROTECTIVE COVER FOR PRESSURE SENSOR ASSEMBLIES
    93.
    发明申请
    PROTECTIVE COVER FOR PRESSURE SENSOR ASSEMBLIES 有权
    压力传感器总成保护罩

    公开(公告)号:US20130033841A1

    公开(公告)日:2013-02-07

    申请号:US13195806

    申请日:2011-08-01

    IPC分类号: H05K1/14 H05K1/11

    摘要: The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the cover may include support features that extend from a lower side of the cover and those support features may contact the lower printed circuit board in at least two locations. The support features of the cover may be separated by a gap and a sensor connected to the lower printed circuit board may be situated within the gap.

    摘要翻译: 本公开涉及包括压力传感器,湿度传感器,流量传感器等的传感器。在一些情况下,与传感器组件一起使用的盖可以包括电绝缘体,其具有沿着上部和/ 较低的印刷电路板,盖可以垂直分隔。 在一个示例中,盖的主体可以包括从盖的下侧延伸的支撑特征,并且这些支撑特征可以在至少两个位置接触下部印刷电路板。 盖的支撑特征可以由间隙分开,并且连接到下印刷电路板的传感器可以位于间隙内。

    PRESSURE SENSOR PACKAGE
    94.
    发明申请
    PRESSURE SENSOR PACKAGE 失效
    压力传感器包装

    公开(公告)号:US20120073381A1

    公开(公告)日:2012-03-29

    申请号:US13243176

    申请日:2011-09-23

    申请人: Kimihiro ASHINO

    发明人: Kimihiro ASHINO

    IPC分类号: G01L9/00

    CPC分类号: G01L19/0654

    摘要: An aspect of a pressure sensor package is that a condensed droplet can be prevented from solidifying and blocking the hole of a pressure inlet pipe, without increasing the external dimensions of the package. Aspects of the invention include a groove in a wall surface of a hole of a pressure inlet pipe, a droplet condensed on the wall surface spreads along the groove by a capillary action, and it is possible to prevent the hole of the pressure inlet pipe being blocked by the droplet.

    摘要翻译: 压力传感器封装的一个方面是可以防止冷凝的液滴固化和阻塞压力入口管的孔,而不增加包装的外部尺寸。 本发明的方面包括在压力入口管的孔的壁表面中的凹槽,凝结在壁表面上的液滴通过毛细管作用沿着凹槽扩散,并且可以防止压力入口管的孔为 被液滴阻挡

    Weatherized direct-mount absolute pressure sensor
    95.
    发明申请
    Weatherized direct-mount absolute pressure sensor 有权
    减压直接安装绝对压力传感器

    公开(公告)号:US20110138900A1

    公开(公告)日:2011-06-16

    申请号:US12639665

    申请日:2009-12-16

    IPC分类号: G01M9/06

    摘要: A piezoresistive sensor assembly is provided that has a flex circuit having at least one air flow aperture formed therein. A sensor die is coupled to an absolute support and the flex circuit. The sensor die has a diaphragm that deflects in response to air flow that flows through the air flow aperture and is incident on the diaphragm. The sensor die includes one or more gages positioned on or in the diaphragm.

    摘要翻译: 提供一种压阻传感器组件,其具有形成在其中的至少一个气流孔的柔性电路。 传感器管芯耦合到绝对支架和柔性电路。 传感器模具具有响应于流过空气流通孔并入射在隔膜上的空气流而偏转的隔膜。 传感器模具包括位于隔膜上或隔膜中的一个或多个计量器。

    Semiconductor pressure sensor and die for molding a semiconductor pressure sensor
    97.
    发明授权
    Semiconductor pressure sensor and die for molding a semiconductor pressure sensor 有权
    用于模制半导体压力传感器的半导体压力传感器和模具

    公开(公告)号:US07412895B2

    公开(公告)日:2008-08-19

    申请号:US11507461

    申请日:2006-09-22

    IPC分类号: G01L9/00

    摘要: A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.

    摘要翻译: 半导体压力传感器设置有将压力转换为电信号的半导体压力传感器部件,其中将所述半导体压力传感器部分和其部分的端部延伸到外部的传感器模块用第一树脂 以及其中容纳所述传感器模块的外壳,并且所述传感器模块进一步用第二树脂嵌入成型以形成连接器部分,并且所述半导体压力传感器的特征在于,所述传感器模块的暴露部分 第二树脂,并且传感器模块的暴露部分和第二树脂之间的边界用粘合剂覆盖。

    Pressure sensor
    98.
    发明授权
    Pressure sensor 有权
    压力传感器

    公开(公告)号:US07284435B2

    公开(公告)日:2007-10-23

    申请号:US11194648

    申请日:2005-08-02

    申请人: Masato Ueno

    发明人: Masato Ueno

    IPC分类号: G01L7/00

    CPC分类号: G01L19/0627 G01L19/0654

    摘要: A pressure sensor for detecting a pressure of a pressure medium includes a casing having an element locating portion, a pressure detection element located in the element locating portion of the casing, and a gel member filled in the element locating portion to seal the pressure detection element. In the pressure sensor, the gel member is exposed from an opening portion of the element locating portion in the casing such that the pressure of the pressure medium is applied to the pressure detection element through the gel material, and the gel member protrudes from a surface of a circumference portion of the opening portion in the casing. Accordingly, it can prevent water from staying on the gel member.

    摘要翻译: 用于检测压力介质的压力的压力传感器包括具有元件定位部分的壳体,位于壳体的元件定位部分中的压力检测元件和填充在元件定位部分中以将压力检测元件 。 在压力传感器中,凝胶构件从壳体中的元件定位部的开口部露出,使得压力介质的压力通过凝胶材料施加到压力检测元件,并且凝胶构件从表面突出 位于壳体内的开口部的圆周部。 因此,能够防止水滞留在凝胶体上。

    Pressure sensor
    99.
    发明授权
    Pressure sensor 失效
    压力传感器

    公开(公告)号:US07143651B2

    公开(公告)日:2006-12-05

    申请号:US10910600

    申请日:2004-08-04

    IPC分类号: G01L9/06 G01L7/00

    摘要: A pressure sensor comprises a housing having a pressure introduction hole, a pressure detecting element formed of a semiconductor device having the piezoelectric resistance effect, a holder for fixing the pressure detecting element, and a connector case. The pressure detecting element and the holder are airtightly joined to form a pressure sensor body in which an interior space is defined. A circuit board having an electrode pad is provided on the holder of the pressure sensor body, and a connector in the connector case and the electrode pad are connected by means of an electrically conductive spring body having elasticity. The holder is supported in the housing by means of a guide frame and an O-ring.

    摘要翻译: 压力传感器包括具有压力引入孔的壳体,由具有压电电阻效应的半导体器件形成的压力检测元件,用于固定压力检测元件的保持器和连接器壳体。 压力检测元件和保持器被气密地接合,以形成其中限定了内部空间的压力传感器主体。 具有电极焊盘的电路板设置在压力传感器主体的保持器上,并且连接器壳体中的连接器和电极焊盘通过具有弹性的导电弹簧体连接。 支架通过导向架和O形圈支撑在外壳中。

    Pressure transducer for gaseous hydrogen environment
    100.
    发明申请
    Pressure transducer for gaseous hydrogen environment 有权
    用于气态氢气环境的压力传感器

    公开(公告)号:US20060248958A1

    公开(公告)日:2006-11-09

    申请号:US11125062

    申请日:2005-05-09

    申请人: Timothy Betzner

    发明人: Timothy Betzner

    IPC分类号: G01L9/00

    摘要: A silicon-based hydrogen pressure sensor module incorporates a low temperature cofired ceramic (LTCC) substrate that shields the cavity formed by the silicon membrane and cell body from hydrogen permeation. A bossed container filled with an oil material is mounted on the substrate and houses a sensor cell. The oil material may be impregnated with a hydrogen getter material.

    摘要翻译: 硅基氢压力传感器模块结合了低温共烧陶瓷(LTCC)基板,其屏蔽由硅膜和电池体形成的空腔不受氢气渗透。 填充有油料的凸起的容器安装在基板上并容纳传感器单元。 油料可以用吸气剂材料浸渍。