摘要:
A relative pressure sensor includes: a pressure measuring transducer having a measuring membrane of a semiconductor chip and a platform, wherein, between both of these, a reference pressure chamber is formed; a support body, connected with the platform by means of a pressure-bearing adhesion, wherein a reference pressure path extends through the two former elements into the reference pressure chamber; and a sensor outer body, in which a transducer chamber with a first opening and a second opening is formed. The pressure measuring transducer is brought into the transducer chamber through the first opening, and is held therein by means of the support body. The support body pressure-tightly seals the first opening, and a side of the measuring membrane facing away from the reference pressure chamber is contactable with the media pressure through the second opening. The reference pressure path has a gas-filled, sealed section, which extends from the reference pressure chamber at least through the pressure bearing adhesion, and wherein the sealed section is gas-tightly sealed by means of a flexible, metallized plastic foil.
摘要:
A piezoresistive sensor assembly is provided that has a flex circuit having at least one air flow aperture formed therein. A sensor die is coupled to an absolute support and the flex circuit. The sensor die has a diaphragm that deflects in response to air flow that flows through the air flow aperture and is incident on the diaphragm. The sensor die includes one or more gages positioned on or in the diaphragm.
摘要:
The present disclosure relates to sensors including pressure sensors, humidity sensors, flow sensors, etc. In some cases, a cover for use with a sensor assembly may include an electrically insulating body having perimeter features extending a majority of the way around perimeters of upper and lower printed circuit boards that the cover may vertically separate. In one example, the body of the cover may include support features that extend from a lower side of the cover and those support features may contact the lower printed circuit board in at least two locations. The support features of the cover may be separated by a gap and a sensor connected to the lower printed circuit board may be situated within the gap.
摘要:
An aspect of a pressure sensor package is that a condensed droplet can be prevented from solidifying and blocking the hole of a pressure inlet pipe, without increasing the external dimensions of the package. Aspects of the invention include a groove in a wall surface of a hole of a pressure inlet pipe, a droplet condensed on the wall surface spreads along the groove by a capillary action, and it is possible to prevent the hole of the pressure inlet pipe being blocked by the droplet.
摘要:
A piezoresistive sensor assembly is provided that has a flex circuit having at least one air flow aperture formed therein. A sensor die is coupled to an absolute support and the flex circuit. The sensor die has a diaphragm that deflects in response to air flow that flows through the air flow aperture and is incident on the diaphragm. The sensor die includes one or more gages positioned on or in the diaphragm.
摘要:
A pressure-compensation unit, particularly for a tank-pressure sensor in a tank of a motor vehicle. The pressure-compensation unit includes a housing lid and a gas-permeable filter diaphragm, which covers an air hole. The pressure-compensation unit includes a cap-shaped cover element, which covers the filter diaphragm.
摘要:
A semiconductor pressure sensor is provided with a semiconductor pressure sensor part that converts a pressure to an electrical signal, a sensor module in which said semiconductor pressure sensor part and a terminal of which part is extended to the outside are insert-molded with a first resin, and an outer case in which said sensor module is contained, and said sensor module is further insert-molded with a second resin to form a connector portion, and the semiconductor pressure sensor is characterized in that the exposed portion of the sensor module from the second resin, and the boundary between the exposed portion of the sensor module and the second resin are covered with an adhesive.
摘要:
A pressure sensor for detecting a pressure of a pressure medium includes a casing having an element locating portion, a pressure detection element located in the element locating portion of the casing, and a gel member filled in the element locating portion to seal the pressure detection element. In the pressure sensor, the gel member is exposed from an opening portion of the element locating portion in the casing such that the pressure of the pressure medium is applied to the pressure detection element through the gel material, and the gel member protrudes from a surface of a circumference portion of the opening portion in the casing. Accordingly, it can prevent water from staying on the gel member.
摘要:
A pressure sensor comprises a housing having a pressure introduction hole, a pressure detecting element formed of a semiconductor device having the piezoelectric resistance effect, a holder for fixing the pressure detecting element, and a connector case. The pressure detecting element and the holder are airtightly joined to form a pressure sensor body in which an interior space is defined. A circuit board having an electrode pad is provided on the holder of the pressure sensor body, and a connector in the connector case and the electrode pad are connected by means of an electrically conductive spring body having elasticity. The holder is supported in the housing by means of a guide frame and an O-ring.
摘要:
A silicon-based hydrogen pressure sensor module incorporates a low temperature cofired ceramic (LTCC) substrate that shields the cavity formed by the silicon membrane and cell body from hydrogen permeation. A bossed container filled with an oil material is mounted on the substrate and houses a sensor cell. The oil material may be impregnated with a hydrogen getter material.