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公开(公告)号：US20070066201A1
公开(公告)日：2007-03-22
申请号：US11556011
申请日：2006-11-02
申请人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel Carl , Ralph Wadensweiler , Manoocher Birang , Paul Butterfield , Rashid Mavliev , Stan Tsai
发明人： Liang-Yuh Chen , Yuchun Wang , Yan Wang , Alain Duboust , Daniel Carl , Ralph Wadensweiler , Manoocher Birang , Paul Butterfield , Rashid Mavliev , Stan Tsai
IPC分类号： B23F21/03
CPC分类号： B82Y30/00 , B24B37/046 , B24B37/24 , B24B37/26 , B24D3/34
摘要： An article of manufacture and apparatus are provided for planarizing a substrate surface. In one aspect, an article of manufacture is provided for polishing a substrate including polishing article comprising a body having at least a partially conductive surface adapted to polish the substrate. A plurality of perforations may be formed in the polishing article for flow of material therethrough. An electrode is also exposed to the polishing surface by at least a portion of the plurality of perforations. The article of manufacture may also include a polishing surface having a plurality of grooves, wherein a portion of the plurality of grooves intersect with a portion of the plurality of perforations.
摘要翻译： 提供了一种用于平坦化基板表面的制造和设备。 在一个方面，提供了一种用于抛光衬底的制品，所述衬底包括抛光制品，所述抛光制品包括具有适于抛光所述衬底的至少部分导电表面的主体。 可以在抛光制品中形成多个穿孔，以使材料流过其中。 电极还通过多个穿孔的至少一部分暴露于抛光表面。 制品还可以包括具有多个凹槽的抛光表面，其中多个凹槽的一部分与多个穿孔的一部分相交。
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公开(公告)号：US07118457B2
公开(公告)日：2006-10-10
申请号：US11031440
申请日：2005-01-07
CPC分类号： B24B37/26 , B24B37/013 , B24B37/205 , B24B49/02 , B24B49/10 , B24B49/105 , B24B49/12 , B24D11/02 , G01B7/105
摘要： A method of forming a polishing pad with a polishing layer having a polishing surface and a back surface. A plurality of grooves are formed on the polishing surface, and an indentation is formed in the back surface of the polishing layer. A region on the polishing surface corresponding to the indentation in the back surface is free of grooves or has shallower grooves.
摘要翻译： 一种用具有研磨面和背面的研磨层形成研磨垫的方法。 在研磨面上形成有多个凹槽，在研磨层的背面形成有凹部。 与后表面的凹部对应的研磨面上的区域没有凹槽或具有较浅的凹槽。
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93.发明授权Polishing pad with window and method of fabricating a window in a polishing pad 有权具有窗口的抛光垫和在抛光垫中制造窗口的方法公开(公告)号：US07118450B2
公开(公告)日：2006-10-10
申请号：US11225838
申请日：2005-09-12
CPC分类号： B24B37/205 , B24B37/013 , B24B47/12 , B24B49/04 , B24B49/12 , B24B51/00 , B24D18/00 , G01B11/06 , G01B11/0683
摘要： The polishing pad for a chemical mechanical polishing apparatus, and a method of making the same. The polishing pad has a covering layer with a polishing surface and a backing layer which is adjacent to the platen. A first opening in the covering layer with a first cross-sectional area and a second opening in the backing layer with a second, different cross-sectional area form an aperture through the polishing pad. A substantially transparent polyurethane plug is positioned in the aperture, and an adhesive material fixes the plug in the aperture.
摘要翻译： 用于化学机械抛光装置的抛光垫及其制造方法。 抛光垫具有与抛光表面相邻的覆盖层和与压板相邻的背衬层。 具有第一横截面积的覆盖层中的第一开口和具有第二不同横截面积的背衬层中的第二开口形成穿过抛光垫的孔。 基本上透明的聚氨酯塞被定位在孔中，并且粘合剂材料将塞子固定在孔中。
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公开(公告)号：US07016795B2
公开(公告)日：2006-03-21
申请号：US10359107
申请日：2003-02-04
CPC分类号： B24B37/013 , B24B37/042 , B24B49/105 , G01N27/90 , H01L21/67253
摘要： Improved endpoint detection and/or thickness measurements may be obtained by correcting sensor data using calibration parameters and/or drift compensation parameters. Calibration parameters may include an offset and a slope, or other parameters. Drift compensation parameters may include off-wafer measurements.
摘要翻译： 可以通过使用校准参数和/或漂移补偿参数校正传感器数据来获得改进的端点检测和/或厚度测量。 校准参数可以包括偏移和斜率，或其他参数。 漂移补偿参数可能包括晶圆外测量。
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公开(公告)号：US07008875B2
公开(公告)日：2006-03-07
申请号：US10721769
申请日：2003-11-24
IPC分类号： H01L21/302 , H01L21/461
CPC分类号： B24B37/013 , B24B37/042 , B24B49/003 , B24B49/12
摘要： A CMP station can be closed loop controlled by using data obtained by an inline metrology station from a first polished wafer to affect the processing of subsequent polished wafers. The first wafer is polished and measured by the inline metrology station. The metrology station measures at various points the array dielectric thickness, field dielectric thickness, barrier residue thickness and metal residue thickness. The data is then inputted into an algorithm and polishing parameter outputs are calculated. The outputs are sent to the CMP station and used to supplement or replace the previous polishing parameters. Subsequent wafers are polished on the CMP station using the revised polishing parameters.
摘要翻译： CMP站可以通过使用由第一抛光晶片的在线计量站获得的数据来闭环控制，以影响后续抛光晶片的处理。 第一个晶片经过内联计量站的抛光和测量。 测量站在各点测量阵列电介质厚度，场介电厚度，阻挡残留厚度和金属残留厚度。 然后将数据输入算法，并计算抛光参数输出。 输出被发送到CMP站，用于补充或替换以前的抛光参数。 随后的晶片在CMP站上使用修改的抛光参数进行研磨。
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公开(公告)号：US07008296B2
公开(公告)日：2006-03-07
申请号：US10464673
申请日：2003-06-18
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B49/10
摘要： Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.
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公开(公告)号：US07001242B2
公开(公告)日：2006-02-21
申请号：US10124507
申请日：2002-04-16
IPC分类号： B24B1/00
CPC分类号： B24B49/10 , B24B37/013 , B24B37/205 , B24B49/105 , B24B49/12
摘要： A polishing system can have a rotatable platen, a polishing pad secured to the platen, a carrier head to hold a substrate against the polishing pad, and an eddy current monitoring system including a coil or ferromagnetic body that extends at least partially through the polishing pad. A polishing pad can have a polishing layer and a coil or ferromagnetic body secured to the polishing layer. Recesses can be formed in a transparent window in the polishing pad.
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公开(公告)号：US20060033678A1
公开(公告)日：2006-02-16
申请号：US11192993
申请日：2005-07-29
申请人： Dmitry Lubomirsky , Arulkumar Shanmugasundram , Allen D'Ambra , Timothy Weidman , Eugene Rabinovich , Svetlana Sherman , Manoocher Birang , Yaxin Wang , Michael Yang , Bradley Hansen
发明人： Dmitry Lubomirsky , Arulkumar Shanmugasundram , Allen D'Ambra , Timothy Weidman , Eugene Rabinovich , Svetlana Sherman , Manoocher Birang , Yaxin Wang , Michael Yang , Bradley Hansen
CPC分类号： H01L21/67167 , C23C16/06 , C23C16/34 , C23C16/4488 , C23C18/1632 , C23C18/1653 , H01L21/28556 , H01L21/288 , H01L21/6719 , H01L21/67207 , H01L21/6723 , H01L21/67742 , H01L21/67745 , H01L21/76843 , H01L21/76873 , H01L21/76877
摘要： Embodiments of the invention provide a cluster tool configured to deposit a material onto a substrate surface by using one or more electroless, electrochemical plating, CVD and/or ALD processing chambers. In one aspect, a ruthenium-containing catalytic layer is formed. Embodiments of the invention provide a hybrid deposition system configured to deposit a seed layer on a substrate with an electroless process and to subsequently fill interconnect features on the substrate with an ECP cell. Other aspects provide an electroless deposition system configured to deposit a seed layer on a substrate, fill interconnect features on a substrate, or sequentially deposit both a seed layer and fill interconnect features on the substrate. One embodiment provides an electroless deposition system configured to form a capping layer over substrate interconnects. The system includes a vapor dryer for pre- and post-deposition cleaning of substrates as well as a brush box chamber for post-deposition cleaning.
摘要翻译： 本发明的实施例提供了一种集群工具，其被配置为通过使用一个或多个化学镀，CVD和/或ALD处理室将材料沉积到衬底表面上。 一方面，形成含钌催化剂层。 本发明的实施例提供了一种混合沉积系统，其被配置为利用无电解方法将种子层沉积在衬底上，并随后用ECP单元填充衬底上的互连特征。 其它方面提供一种无电镀沉积系统，其被配置为将衬底层沉积在衬底上，填充衬底上的互连特征，或者顺序地沉积衬底上的晶种层和填充互连特征。 一个实施例提供了一种配置成在衬底互连上形成覆盖层的无电沉积系统。 该系统包括蒸发干燥器，用于底物的沉积前和沉积后清洁以及用于后沉积清洁的刷盒室。
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99.发明授权公开(公告)号：US06991516B1
公开(公告)日：2006-01-31
申请号：US10920726
申请日：2004-08-17
申请人： Jeffrey Drue David , Dirk De Roover , Jimin Zhang , Boguslaw A. Swedek , Doyle E. Bennett , Manoocher Birang
发明人： Jeffrey Drue David , Dirk De Roover , Jimin Zhang , Boguslaw A. Swedek , Doyle E. Bennett , Manoocher Birang
CPC分类号： B24B49/105 , B24B37/04 , B24B49/12
摘要： A plurality of portions of a substrate are monitored during polishing at a first polishing station with an in-situ monitoring system. A plurality of thicknesses are determined based on measurements by the in-situ monitoring system, and the plurality of pressures to apply to the plurality of regions of the substrate are calculated in a closed-loop control system. However, if a representative thickness of the layer is less than a threshold thickness, calculation of the plurality of pressures by the closed-loop control system is halted and a plurality of predetermined pressures are applied to the plurality of regions of the substrate.
摘要翻译： 在具有原位监测系统的第一抛光站的抛光期间，监测基板的多个部分。 基于通过原位监测系统的测量确定多个厚度，并且在闭环控制系统中计算应用于衬底的多个区域的多个压力。 然而，如果层的代表性厚度小于阈值厚度，则闭环控制系统的多个压力的计算被停止，并且多个预定压力施加到基板的多个区域。
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公开(公告)号：US20060009131A1
公开(公告)日：2006-01-12
申请号：US11222561
申请日：2005-09-08
IPC分类号： B24B49/00
CPC分类号： B24B37/013 , B24B49/10
摘要： Methods and apparatus to implement techniques for monitoring polishing a substrate. Two or more data points are acquired, where each data point has a value affected by features inside a sensing region of a sensor and corresponds to a relative position of the substrate and the sensor as the sensing region traverses through the substrate. A set of reference points is used to modify the acquired data points. The modification compensates for distortions in the acquired data points caused by the sensing region traversing through the substrate. Based on the modified data points, a local property of the substrate is evaluated to monitor polishing.
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