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    Semiconductor package including dam structure surrounding semiconductor chip and method of manufacturing the same
    94.
    发明授权
    Semiconductor package including dam structure surrounding semiconductor chip and method of manufacturing the same 有权

    公开(公告)号：US11289454B2

    公开(公告)日：2022-03-29

    申请号：US16886141

    申请日：2020-05-28

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Minsoo Kim

    IPC: H01L25/065 ,  H01L25/18 ,  H01L23/31

    Abstract: A semiconductor package includes a base substrate, a first semiconductor chip on the base substrate, a dam structure on the base substrate and surrounding the first semiconductor chip, a second semiconductor chip on the first semiconductor chip, a non-conductive film, and a molding member. The non-conductive film may be between the base substrate, the first semiconductor chip, and the second semiconductor chip. The molding member may cover the base substrate, the first semiconductor chip, and the second semiconductor chip. A level of an upper surface of the first semiconductor chip and a level of an upper surface of the dam structure may be at a same level.

    Foldable electronic device
    96.
    发明授权
    Foldable electronic device 有权

    公开(公告)号：US11132020B2

    公开(公告)日：2021-09-28

    申请号：US16850240

    申请日：2020-04-16

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Minsoo Kim ,  Bongsub Kim ,  Taewon Kim ,  Sangmin Lee ,  Jongheon Lee ,  Jiwoo Lee

    IPC: G06F1/16

    Abstract: Disclosed is a foldable electronic device including a flexible display, a sensor panel, a sensor circuitry, a first housing, a second housing, and a folding structure configured to rotate the first housing or the second housing. The sensor panel includes a plurality of loop coils. The sensor circuitry transmits or receives a first resonance signal to recognize an operation of an electronic pen through the plurality of loop coils, outputs a second resonance signal through a first loop coil included in one panel part of the first panel part or the second panel part, receives the second resonance signal through a second loop coil included in a remaining one panel part of the first panel part or the second panel part, and determines an angle between the first housing and the second housing, based on the received second resonance signal.

    Ice maker
    97.
    发明授权
    Ice maker 有权

    公开(公告)号：US10969152B2

    公开(公告)日：2021-04-06

    申请号：US16245891

    申请日：2019-01-11

    Applicant: Samsung Electronics Co., Ltd.

    Inventor： Jinkook Yoon ,  Jinseung Choi ,  Myungseob Song ,  Minsoo Kim

    IPC: F25C5/08 ,  F25C1/04 ,  F25C1/18 ,  F25C5/20 ,  F25C1/24 ,  F25D11/02 ,  F25D17/06

    Abstract: Disclosed are an ice maker, which can make ice with high transparency. The ice maker includes an ice making container configured to be filled with ice-making water; a heating ice-separator comprising a heating rod extended from above a water surface of the ice-making water into the ice making container so as to be immersed in the ice-making water and configured to transfer heat to the ice-making water, and a rotary shaft connecting with the heating rod, extended to traverse an upper portion of the ice making container, and configured to rotate the heating rod to be separated from the ice making container; and a heater configured to supply heat to the heating rod. By using the heater, the ice maker can not only make the ice with the high transparency, but also make ice-separation structure be simplified.

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