Polyimide silicone resin, its solution composition, and polyimide silicone resin film
    92.
    发明授权
    Polyimide silicone resin, its solution composition, and polyimide silicone resin film 有权
    聚酰亚胺硅树脂,其溶液组成和聚酰亚胺硅树脂薄膜

    公开(公告)号:US06703133B2

    公开(公告)日:2004-03-09

    申请号:US09892445

    申请日:2001-06-28

    CPC classification number: C08G77/455 C08L83/10 H05K3/285 Y10T428/31663

    Abstract: A polyimide silicone resin which is obtained from a diamine containing an acid dianhydride and a diaminopolysiloxane, contains 50% by weight or more of a siloxane residual group and has an elongation at rupture of 400% or higher and a modulus of elasticity of 500 N/mm2 or lower. Also disclosed are a polyimide silicone resin solution composition comprising this polyimide silicone resin and a ketone solvent having a boiling point of 130° C. or below, and a polyimide silicone resin film comprising this polyimide silicone resin and formed on a substrate. The polyimide silicone resin can form films at relatively low temperature, has superior adhesiveness to substrates and durability under conditions of high humidity and also has low stress and high elongation.

    Abstract translation: 由含有酸二酐和二氨基聚硅氧烷的二胺获得的聚酰亚胺硅树脂含有50重量%以上的硅氧烷残基,断裂伸长率在400%以上,弹性模量为500N / mm 2以下。 还公开了包含该聚酰亚胺硅树脂和沸点为130℃以下的酮溶剂的聚酰亚胺硅树脂溶液组合物和形成在基材上的聚酰亚胺硅树脂薄膜。 聚酰亚胺硅树脂可以在较低温度下形成薄膜,在高湿度条件下具有优异的基材粘合性和耐久性,并且应力低和伸长率高。

    Resist composition and patterning process
    93.
    发明授权
    Resist composition and patterning process 有权
    抗蚀剂组成和图案化工艺

    公开(公告)号:US06635400B2

    公开(公告)日:2003-10-21

    申请号:US09835375

    申请日:2001-04-17

    CPC classification number: G03F7/168 G03F7/0233 G03F7/0392

    Abstract: A resist composition comprising (A) an alkali-insoluble or substantially insoluble polymer having acidic functional groups protected with acid labile groups, which polymer becomes alkali-soluble upon elimination of the acid labile groups, (B) a photoacid generator, and (C) a 1,2-naphthoquinonediazidosulfonyl group-bearing compound has a high resolution and sensitivity, and provides resist patterns of excellent plating resistance when used in UV lithography at an exposure light wavelength of at least 300 nm.

    Abstract translation: 一种抗蚀剂组合物,其包含(A)具有由酸不稳定基团保护的酸性官能团的碱不溶性或基本上不溶的聚合物,该聚合物在消除酸不稳定基团时变得碱溶性,(B)光酸产生剂,和(C) 具有1,2-萘醌二叠氮基磺酰基的化合物具有高分辨率和灵敏度,并且当在至少300nm的曝光光波长下用于UV光刻时,提供具有优异电镀电阻的抗蚀剂图案。

    Electrostatic capacity sensor
    94.
    发明授权
    Electrostatic capacity sensor 失效
    静电容量传感器

    公开(公告)号:US06476620B2

    公开(公告)日:2002-11-05

    申请号:US09948284

    申请日:2001-09-06

    CPC classification number: G01B7/14 G01B7/023 G01D5/2405

    Abstract: An electrostatic capacity sensor includes an electrostatic capacity type detection element in which a detection electrode, a ground electrode and a charge plate interposed between the detection electrode and the ground electrode are arranged in a state that they are isolated to each other; a detection circuit for detecting changes in capacitance of the detection electrode caused by an object to be detected; and a power supply for supplying electrical power to the detection circuit. Since the electrostatic capacity sensor is provided with the charge plate between the detection electrode and the charge plate, it is possible to improve the sensitivity of the detection element, so that it is possible to increase the detection distance. In addition, the variations in the capacitance of the detection element due to the changes in the ambient conditions can be reduced. In this way, the ratio of signal to noise (the ratio of S/N) can be increased, thereby enabling to improve the detection precision of the electrostatic capacity sensor.

    Abstract translation: 静电电容传感器包括静电电容型检测元件,其中检测电极,接地电极和插入在检测电极和接地电极之间的电荷板彼此隔离的状态布置; 用于检测由待检测物体引起的检测电极的电容变化的检测电路; 以及用于向检测电路提供电力的电源。 由于静电电容传感器在检测电极和充电板之间设置有充电板,因此可以提高检测元件的灵敏度,从而可以增加检测距离。 此外,可以减少由于环境条件的变化引起的检测元件的电容变化。 以这种方式,能够提高信号与噪声的比(S / N的比),能够提高静电容量传感器的检测精度。

    Polymers and positive resist compositions
    95.
    发明授权
    Polymers and positive resist compositions 失效
    聚合物和正性抗蚀剂组合物

    公开(公告)号:US06221989B1

    公开(公告)日:2001-04-24

    申请号:US09310756

    申请日:1999-05-13

    CPC classification number: C08G8/24 C08G8/28

    Abstract: A novel polymer is provided in the form of a novolac resin in which some of the hydrogen atoms of hydroxyl groups are replaced by 1,2-naphthoquinonediazidosulfonyl ester groups, triazinyl groups and optionally, substituted carbonyl or sulfonyl groups. A positive resist composition comprising the polymer has improved sensitivity, resolution and developability in microfabrication as well as improved heat resistance and low-temperature curability in forming interlayer insulating film.

    Abstract translation: 提供了一种酚醛清漆树脂形式的新型聚合物,其中羟基的一些氢原子被1,2-萘醌二叠氮磺酰酯基,三嗪基和任选取代的羰基或磺酰基代替。 包含该聚合物的正型抗蚀剂组合物在形成层间绝缘膜时具有提高的微细加工中的敏感性,分辨率和显影性,以及改善的耐热性和低温固化性。

    Positive resist composition suitable for lift-off technique and pattern forming method

    公开(公告)号:US06210855B1

    公开(公告)日:2001-04-03

    申请号:US09459876

    申请日:1999-12-14

    CPC classification number: G03F7/0226 G03F7/0233

    Abstract: A positive resist composition contains (A) a novolak resin having a weight average molecular weight calculated as polystyrene of 2,000-20,000 wherein 2.5-27 mol % of the hydrogen atom of a hydroxyl group is replaced by a 1,2-naphthoquinonediazidosulfonyl group and (B) a low molecular aromatic compound having phenolic hydroxyl groups and 2-20 benzene rings wherein the ratio of the number of phenolic hydroxyl groups to the number of benzene rings is between 0.5 and 2.5. By forming a resist layer on a substrate from the positive resist composition and baking the resist layer at 90-130° C., followed by exposure and development, there is formed a resist pattern having an undercut of desired configuration. Owing to high resolution and improved dimensional control, heat resistance and film retention, the resist pattern lends itself to a lift-off technique.

    Photosensitive resin composition and a process for forming a patterned
polyimide film using the same
    97.
    发明授权
    Photosensitive resin composition and a process for forming a patterned polyimide film using the same 失效
    感光树脂组合物和使用其形成图案化聚酰亚胺膜的方法

    公开(公告)号:US5616448A

    公开(公告)日:1997-04-01

    申请号:US592536

    申请日:1996-01-26

    Applicant: Hideto Kato

    Inventor: Hideto Kato

    CPC classification number: G03F7/0387

    Abstract: The composition comprises (A) a specified polyimide precursor and (B) at least one member selected from the group consisting of a sensitizer, a photopolymerization initiator and a combination thereof. The above process comprises applying a solution of the above photosensitive resin composition on a substrate, followed by drying to form a film; exposing the film to light, followed by developing with an aqueous alkaline solution to form a patterned film; and curing the patterned film. The composition has little ionic impurities mixed therein during the preparation of the composition; is excellent in storage stability in the state of a solution; can be developed with an aqueous alkaline solution, which does not cause the problems such as a problem to health and a problem to the treatment of waste liquids, within a short time; and exhibits a good sensitivity even when formed a thick film, thereby readily providing a patterned resinous film. Further, the cured product obtained by curing the patterned film has a superior heat resistance and excellent electrical and mechanical properties, which can be suitably used as a protective film for use in electronic parts.

    Abstract translation: 组合物包含(A)特定的聚酰亚胺前体和(B)选自敏化剂,光聚合引发剂及其组合中的至少一种。 上述方法包括将上述感光性树脂组合物的溶液涂布在基材上,然后干燥以形成膜; 将膜曝光,随后用碱性水溶液显影以形成图案化膜; 并固化图案化膜。 在组合物的制备期间,组合物中少量的离子杂质混入其中; 在溶液状态下的储存稳定性优异; 可以在短时间内用碱性水溶液显影,其不会引起诸如健康问题和废液处理问题; 并且即使形成厚膜也显示出良好的灵敏度,从而容易提供图案化的树脂膜。 此外,通过固化图案化膜获得的固化产物具有优异的耐热性和优异的电气和机械性能,其可以适合用作用于电子部件的保护膜。

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