公开(公告)号：US07141782B2

公开(公告)日：2006-11-28

申请号：US10851121

申请日：2004-05-24

Applicant: Wen-Ching Chen

Inventor： Wen-Ching Chen

IPC: H01J5/02 ,  H01J40/14

CPC classification number: H01L27/14618 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An image sensor with a protective package structure for the sensing area is provided. The image sensor includes a transparent substrate and a semiconductor image-sensing chip. A conductive interconnection circuit is formed on at least the lower surface of the transparent substrate. The semiconductor image-sensing chip is electrically connected with the electric interconnection circuit of the substrate. A perimeter of the chip is underfilled with gum material. A dike is formed around the image-sensing area of the semiconductor image-sensing chip. The electric contact of the semiconductor image-sensing chip is positioned on outer side of the dike.

Abstract translation: 提供了一种具有用于感测区域的保护封装结构的图像传感器。 图像传感器包括透明基板和半导体图像感测芯片。 在透明基板的至少下表面上形成导电互连电路。 半导体图像感测芯片与衬底的电互连电路电连接。 芯片的周边底部填充有胶质材料。 在半导体图像感测芯片的图像感测区域周围形成堤坝。 半导体图像感测芯片的电接触位于堤防的外侧。

公开(公告)号：US20050258336A1

公开(公告)日：2005-11-24

申请号：US10851121

申请日：2004-05-24

Applicant: Wen-Ching Chen

Inventor： Wen-Ching Chen

IPC: H01L27/00 ,  H01L27/146 ,  H01L31/0203

CPC classification number: H01L27/14618 ,  H01L31/0203 ,  H01L2924/0002 ,  H01L2924/00

Abstract: An image sensor with protective package structure for sensing area. The image sensor includes a transparent substrate and a semiconductor image-sensing chip. A conductive interconnection circuit is formed on at least the lower surface of the transparent substrate. The semiconductor image-sensing chip is electrically connected with the electric interconnection circuit of the substrate. A circumference of the crystal grain is underfilled with gum material. A dike is formed around the image-sensing area of the semiconductor image-sensing chip. The electric contact of the semiconductor image-sensing chip is positioned on outer side of the dike.

Abstract translation: 一种具有保护封装结构的图像传感器，用于感测区域。 图像传感器包括透明基板和半导体图像感测芯片。 在透明基板的至少下表面上形成导电互连电路。 半导体图像感测芯片与衬底的电互连电路电连接。 晶粒周围用胶体材料填充。 在半导体图像感测芯片的图像感测区域周围形成堤坝。 半导体图像感测芯片的电接触位于堤防的外侧。

公开(公告)号：US07619840B2

公开(公告)日：2009-11-17

申请号：US11892159

申请日：2007-08-20

Applicant: Wen-Ching Chen

Inventor： Wen-Ching Chen

IPC: G02B7/02

CPC classification number: H04N5/2624 ,  B60R1/00 ,  B60R2300/105 ,  B60R2300/303 ,  G02B13/06 ,  H04N5/2251 ,  H04N5/2253

Abstract: A multi-image retrieving system includes lenses of multiple image retrieving units arranged close to one another with a virtual boundary of filed field keeping a given spacing in parallel with that of an abutted lens without overlapping from each other to combine into a large scope of filed angle of photography and an image retrieved by an individual lens being processed using an image processor to display an image picture achieves the purpose of minimizing blind spots on both sides, expanding filed angle and image retrieving scope, and maintaining normal reproduction of the image retrieved.

Abstract translation: 多图像检索系统包括多个图像检索单元的透镜，所述多个图像检索单元彼此靠近设置，并且具有与被抵接的透镜的虚拟边界保持给定间隔的虚拟边界，而不会彼此重叠以组合成大范围的归档 通过使用图像处理器处理以显示图像图像的单个透镜检索的图像的角度实现了使两侧的盲点最小化，扩大场角和图像检索范围以及保持所检索的图像的正常再现的目的。

公开(公告)号：US08836855B2

公开(公告)日：2014-09-16

申请号：US13211005

申请日：2011-08-16

Applicant: Shu-Tze Chen ,  Wen-Ching Chen

Inventor： Shu-Tze Chen ,  Wen-Ching Chen

IPC: H04N5/225

CPC classification number: H04N5/2251

Abstract: A thin image capturing apparatus includes a circuit substrate having at least one electronic component, a light sensing element packaged onto the circuit substrate, and a camera lens installed onto the light sensing element for capturing images.

Abstract translation: 薄型摄像装置包括具有至少一个电子部件的电路基板，封装在电路基板上的感光元件，以及安装在感光元件上用于拍摄图像的相机透镜。

公开(公告)号：US20070040932A1

公开(公告)日：2007-02-22

申请号：US11206845

申请日：2005-08-19

Applicant: Wen-Ching Chen

Inventor： Wen-Ching Chen

IPC: H04N5/225

CPC classification number: H04N5/2254

Abstract: An image pickup module with an image sensor packaged by way of flip chip, including: a base seat formed with a cavity and having a lead frame embedded in the base seat, the lead frame having multiple outer leads for connecting with a circuit board and multiple inner leads extending from the outer leads into the cavity of the base seat; an image sensor inlaid in the cavity of the base seat, the image sensor being composed of a glass substrate and an image sensing chip bonded with a surface of the glass substrate by way of flip chip, multiple circuits being laid on the surface of the glass substrate for electrically connecting with the image sensing chip and the inner leads; and a soft pad abutting against lower sides of the inner leads.

Abstract translation: 一种具有通过倒装芯片封装的图像传感器的图像拾取模块，包括：形成有空腔并具有嵌入在基座中的引线框架的基座，引线框架具有多个用于与电路板连接的外引线和多个 内引线从外引线延伸到基座的空腔中; 镶嵌在基座的空腔中的图像传感器，图像传感器由玻璃基板和通过倒装芯片与玻璃基板的表面接合的图像感测芯片组成，多个电路放置在玻璃的表面上 用于与图像感测芯片和内部引线电连接的基板; 以及抵靠内引线的下侧的软垫。

公开(公告)号：US20050056769A1

公开(公告)日：2005-03-17

申请号：US10662433

申请日：2003-09-16

Applicant: Wen-Ching Chen

Inventor： Wen-Ching Chen

IPC: H01J5/02 ,  H01L27/00 ,  H01L31/0203 ,  H01L31/0232

CPC classification number: H04N5/2254 ,  H01L27/14618 ,  H01L27/14625 ,  H01L31/0203 ,  H01L31/02325 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16 ,  H01L2924/00014 ,  H04N5/2253 ,  H04N5/2257 ,  H01L2224/05599

Abstract: A chip scale package (CSP) structure for an image sensor includes a semi-conductor image sense chip and multiple bonding pads formed on a top face of the semi-conductor image sense chip. A conducting wire extends from each of the multiple bonding pads by wire-bonding. Liquefied jelly-like material is covered with the top face of the semi-conductor image sense chip and forming a transparent layer on the top face of the semi-conductor image sense chip after drying up. The transparent layer has a thickness being equal to a height of each of the conduct wire relative to the top face of the semi-conductor image sense chip.

Abstract translation: 用于图像传感器的芯片级封装（CSP）结构包括半导体图像感测芯片和形成在半导体图像感测芯片的顶面上的多个焊盘。 导线通过引线接合从多个接合焊盘中的每一个延伸。 液体果冻状材料被半导体图像感测芯片的顶面覆盖，并且在干燥后在半导体图像感测芯片的顶面上形成透明层。 透明层的厚度等于导体线相对于半导体图像感测芯片的顶面的高度。

公开(公告)号：US06803608B1

公开(公告)日：2004-10-12

申请号：US10457317

申请日：2003-06-10

Applicant: Wen-Ching Chen

Inventor： Wen-Ching Chen

IPC: H01L2922

CPC classification number: H01L33/62 ,  H01L33/54 ,  H01L2224/48091 ,  H01L2224/48247 ,  H01L2924/00014

Abstract: An LED is used as an illuminant of an image sensor and includes a fabricated block, a first electrode and a second electrode contained in the fabricated block for transmitting an electric current to a PN surface of a semiconductor that is contained in the fabricated block and secured in a top portion of the first electrode. The semiconductor has a light-projecting axis forming an acute angle with an elongate line of a bottom of the fabricated block.

Abstract translation: LED用作图像传感器的光源，并且包括制造的块，第一电极和包含在所制造的块中的第二电极，用于将电流传输到包含在所制造的块中的半导体的PN表面并且被固定 在第一电极的顶部。 半导体具有与制造的块的底部的细长线形成锐角的光投射轴。

公开(公告)号：US20120044414A1

公开(公告)日：2012-02-23

申请号：US13211005

申请日：2011-08-16

Applicant: Shu-Tze Chen ,  Wen-Ching Chen

Inventor： Shu-Tze Chen ,  Wen-Ching Chen

IPC: H04N5/225 ,  H01J40/14

CPC classification number: H04N5/2251

Abstract: A thin image capturing apparatus includes a circuit substrate having at least one electronic component, a light sensing element packaged onto the circuit substrate, and a camera lens installed onto the light sensing element for capturing images.

Abstract translation: 薄型摄像装置包括具有至少一个电子部件的电路基板，封装在电路基板上的感光元件，以及安装在感光元件上用于拍摄图像的相机透镜。

公开(公告)号：US20090052065A1

公开(公告)日：2009-02-26

申请号：US11892159

申请日：2007-08-20

Applicant: Wen-Ching Chen

Inventor： Wen-Ching Chen

IPC: G02B7/02

CPC classification number: H04N5/2624 ,  B60R1/00 ,  B60R2300/105 ,  B60R2300/303 ,  G02B13/06 ,  H04N5/2251 ,  H04N5/2253

Abstract: A multi-image retrieving system includes lenses of multiple image retrieving units arranged close to one another with a virtual boundary of filed field keeping a given spacing in parallel with that of an abutted lens without overlapping from each other to combine into a large scope of filed angle of photography and an image retrieved by an individual lens being processed using an image processor to display an image picture achieves the purpose of minimizing blind spots on both sides, expanding filed angle and image retrieving scope, and maintaining normal reproduction of the image retrieved.

Abstract translation: 多图像检索系统包括多个图像检索单元的透镜，所述多个图像检索单元彼此靠近设置，并且具有与被抵接的透镜的虚拟边界保持给定间隔的虚拟边界，而不会彼此重叠以组合成大范围的归档 通过使用图像处理器处理以显示图像图像的单个透镜检索的图像的角度实现了使两侧的盲点最小化，扩大场角和图像检索范围以及保持所检索的图像的正常再现的目的。

公开(公告)号：US06900913B2

公开(公告)日：2005-05-31

申请号：US09766623

申请日：2001-01-23

Applicant: Wen-Ching Chen

Inventor： Wen-Ching Chen

IPC: G02B7/02 ,  H01L27/146 ,  H04N1/028 ,  H04N5/225 ,  H04N1/04

CPC classification number: H01L27/14618 ,  G02B7/02 ,  H01L2924/0002 ,  H04N1/028 ,  H04N1/02805 ,  H04N5/2254 ,  H04N2201/02458 ,  H04N2201/02466 ,  H04N2201/02481 ,  H04N2201/02487 ,  H01L2924/00

Abstract: A CCD and CMOS image pickup module including a circuit main board on which an image sensor (CMOS, CCD) and relevant electronic elements are laid. A lens seat is disposed on an upper edge of a package of the image sensor. The lens seat has an image pickup cylinder correspondingly positioned above a coupling transistor of the image sensor. The lens seat covers and encloses the image sensor with the connecting section of the bottom of the image pickup cylinder sealedly attaching to the periphery of the top face of the package of the image sensor. With the profile of the outer periphery of the package of the image sensor serving as a normal standard for the axis of the lens, the axis of the lens being projected onto the sensor center of the coupling transistor.

Abstract translation: 一种CCD和CMOS图像拾取模块，包括其上放置有图像传感器（CMOS，CCD）和相关电子元件的电路主板。 透镜座设置在图像传感器的封装的上边缘上。 透镜座具有相应地位于图像传感器的耦合晶体管上方的图像拾取筒。 透镜座覆盖并包围图像传感器，图像拾取器的底部的连接部密封地附接到图像传感器的封装的顶面的周边。 由于图像传感器的封装的外周的轮廓作为透镜的轴的正常标准，透镜的轴线被投影到耦合晶体管的传感器中心。