A CCD and CMOS image pickup module including a circuit main board on which an image sensor (CMOS, CCD) and relevant electronic elements are laid. A lens seat is disposed on an upper edge of a package of the image sensor. The lens seat has an image pickup cylinder correspondingly positioned above a coupling transistor of the image sensor. The lens seat covers and encloses the image sensor with the connecting section of the bottom of the image pickup cylinder sealedly attaching to the periphery of the top face of the package of the image sensor. With the profile of the outer periphery of the package of the image sensor serving as a normal standard for the axis of the lens, the axis of the lens being projected onto the sensor center of the coupling transistor.