公开(公告)号：US08921160B2

公开(公告)日：2014-12-30

申请号：US13945169

申请日：2013-07-18

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ping-Lin Yang ,  Sa-Lly Liu ,  Chien-Min Lin

IPC: H01L21/00 ,  H01L23/48 ,  H01L23/00 ,  H01L25/065 ,  H01L23/367 ,  H01L23/522

CPC classification number: H01L24/82 ,  H01L23/3677 ,  H01L23/48 ,  H01L23/5227 ,  H01L24/16 ,  H01L25/0657 ,  H01L2224/05571 ,  H01L2224/05573 ,  H01L2224/16225 ,  H01L2224/16227 ,  H01L2224/32225 ,  H01L2224/73253 ,  H01L2225/06517 ,  H01L2225/06531 ,  H01L2225/06551 ,  H01L2225/06572 ,  H01L2225/06589 ,  H01L2924/15788 ,  H01L2924/00 ,  H01L2224/05647 ,  H01L2924/00014

Abstract: A package comprises a die stack having at least two stacked dies coupled for contactless communications with each other. At least one of the stacked dies has a substrate joined to its major face. The substrate has a plurality of conductive traces in or on the substrate for conducting power to the dies and for conducting heat from the dies. At least one conductive pillar is joined to at least one of the conductive traces on at least a first edge of the substrate, for conducting power to the at least one die and for conducting heat from the at least one die.

Abstract translation: 封装包括具有至少两个堆叠管芯的管芯堆叠，用于彼此进行非接触式通信。 堆叠的模具中的至少一个具有连接到其主面的衬底。 衬底在衬底中或衬底上具有多个导电迹线，用于向裸片传导功率并且用于从模具传导热量。 至少一个导电柱与基板的至少第一边缘上的导电迹线中的至少一个接合，用于将功率传导到至少一个管芯并且用于从至少一个管芯传导热量。

公开(公告)号：US09412721B2

公开(公告)日：2016-08-09

申请号：US14280732

申请日：2014-05-19

Applicant: Taiwan Semiconductor Manufacturing Co., Ltd.

Inventor： Ping-Lin Yang ,  Jun-De Jin ,  Fu-Lung Hsueh ,  Sa-Lly Liu ,  Tong-Chern Ong ,  Chun-Jung Lin ,  Ya-Chen Kao

IPC: H01F5/00 ,  H01L25/065 ,  H01F27/28 ,  H01F41/04 ,  H01L23/522 ,  H01L23/48

CPC classification number: H01L25/0657 ,  H01F5/00 ,  H01F27/2804 ,  H01F41/046 ,  H01F2027/2809 ,  H01L23/48 ,  H01L23/5227 ,  H01L2225/06531 ,  H01L2924/0002 ,  Y10T29/4902 ,  H01L2924/00

Abstract: A communications structure comprises a first semiconductor substrate having a first coil, and a second semiconductor substrate having a second coil above the first semiconductor substrate. Inner edges of the first and second coils define a boundary of a volume that extends below the first coil and above the second coil. A ferromagnetic core is positioned at least partially within the boundary, such that a mutual inductance is provided between the first and second coils for wireless transmission of signals or power between the first and second coils.

Abstract translation: 通信结构包括具有第一线圈的第一半导体衬底和在第一半导体衬底上方具有第二线圈的第二半导体衬底。 第一和第二线圈的内边缘限定在第一线圈下方延伸并在第二线圈之上的体积的边界。 铁磁芯至少部分地位于边界内，使得在第一和第二线圈之间提供互感以在第一和第二线圈之间无线地传输信号或电力。

公开(公告)号：US09362899B2

公开(公告)日：2016-06-07

申请号：US14106469

申请日：2013-12-13

Applicant: TAIWAN SEMICONDUCTOR MANUFACTURING CO., LTD.

Inventor： Ming-Zhang Kuo ,  Ping-Lin Yang ,  Cheng-Chung Lin ,  Osamu Takahashi ,  Sang Hoo Dhong

IPC: H03K5/01 ,  H03K5/135

CPC classification number: H03K5/135

Abstract: A clock regenerator includes a pulse generating module, a control logic module, a gating module and an output module. The pulse generating module is configured to receive a global clock signal and produce a periodic pulse signal triggered by a rising edge of the global clock signal. The control logic module is configured to receive a plurality of control signals and produce a pulse-type setting signal and a gating signal according to the periodic pulse signal and the control signals. The gating module is configured to produce an intermediate clock signal according to the pulse-type setting signal and the gating signal. The output module is configured to provide a local clock signal according to the intermediate clock signal.

Abstract translation: 时钟再生器包括脉冲发生模块，控制逻辑模块，门控模块和输出模块。 脉冲发生模块被配置为接收全局时钟信号并产生由全局时钟信号的上升沿触发的周期性脉冲信号。 控制逻辑模块被配置为接收多个控制信号，并根据周期脉冲信号和控制信号产生脉冲型设置信号和选通信号。 门控模块被配置为根据脉冲类型设置信号和门控信号产生中间时钟信号。 输出模块被配置为根据中间时钟信号提供本地时钟信号。