公开(公告)号：US20250140624A1

公开(公告)日：2025-05-01

申请号：US18496667

申请日：2023-10-27

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Hau NGUYEN ,  Vivek ARORA ,  Patrick Francis THOMPSON ,  Masamitsu MATSUURA ,  Daiki KOMATSU

IPC: H01L23/31 ,  H01L21/56 ,  H01L21/78 ,  H01L23/00 ,  H01L23/29 ,  H01L25/065

Abstract: A wafer chip scale package (WCSP) comprises first and second dies in differing voltage domains and an isolation material between the first and second dies and contacting multiple surfaces of each of the first and second dies. The package also comprises a first resin material contacting multiple surfaces of the isolation material, with the isolation material between the resin material and the first and second dies. The package also comprises a fiberglass material contacting a surface of the resin material and a second resin material contacting a surface of the fiberglass material. The package also comprises first and second conductive structures coupled to the first and second dies, respectively. The package also includes a passivation material contacting the first and second dies and the first and second conductive structures.

公开(公告)号：US20240145419A1

公开(公告)日：2024-05-02

申请号：US17977610

申请日：2022-10-31

Applicant: TEXAS INSTRUMENTS INCORPORATED

Inventor： Daiki KOMATSU ,  Kashyap MOHAN

IPC: H01L23/00 ,  H01L21/56 ,  H01L21/67 ,  H01L23/31

CPC classification number: H01L24/16 ,  H01L21/563 ,  H01L21/67144 ,  H01L23/3121 ,  H01L24/13 ,  H01L24/75 ,  H01L24/81 ,  H01L2224/13147 ,  H01L2224/16258 ,  H01L2224/75262 ,  H01L2224/81224 ,  H01L2224/81447 ,  H01L2224/8183

Abstract: An example method includes placing a semiconductor die on a bonding surface of metal substrate. The die includes metal pillars extending from a surface of the die aligned with respective bonding locations on the bonding surface of the substrate. The pillars and the substrate can be formed of a common type of metal. The method also includes controlling a laser to emit laser light to heat the substrate at respective bonding locations to bond the metal pillars with the substrate at the respective bonding locations.