公开(公告)号：US20240211755A1

公开(公告)日：2024-06-27

申请号：US18453651

申请日：2023-08-22

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sunghee LEE ,  QHwan KIM ,  Minkyu KIM ,  Bongseok KIM ,  Youngseok KIM ,  Ami MA ,  Jinkook PARK ,  Kyubaik CHANG ,  Jaehoon JEONG

IPC: G06N3/08

CPC classification number: G06N3/08

Abstract: Provided are a method of providing an artificial intelligence (AI) algorithm, an operation method of an AI algorithm, an electronic device, a recording medium, and a computer program. The method of providing the AI algorithm includes loading data sets with respect to a spectrum of a semiconductor and a structure of the semiconductor, calculating an out of distribution (OOD) index with respect to the spectrum of the semiconductor, performing data split by clustering sampling the data sets into at least one learning data set with respect to OOD indexes according to semiconductors, and providing an optimal AI algorithm from among a plurality of AI algorithms that have learned the at least one learning data set.

公开(公告)号：US20160365279A1

公开(公告)日：2016-12-15

申请号：US15060641

申请日：2016-03-04

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jamin KOO ,  Youngseok KIM ,  Kongsoo LEE ,  Goeun BAE

IPC: H01L21/768 ,  H01L21/285

CPC classification number: H01L21/76895 ,  H01L21/28035 ,  H01L21/288 ,  H01L21/76831 ,  H01L21/76877 ,  H01L21/76897 ,  H01L23/53271 ,  H01L27/10888

Abstract: Provided is a method of fabricating a semiconductor device, the method including forming interconnection structures extending parallel to each other on a substrate; performing a coating process and forming a liquid state silicon source material layer filling an area between the interconnection structures; performing a first annealing process, curing the liquid state silicon source material layer, and forming an amorphous silicon layer; and crystallizing the amorphous silicon layer and forming contact plugs.

Abstract translation: 提供一种制造半导体器件的方法，该方法包括在衬底上形成彼此平行延伸的互连结构; 执行涂覆工艺并形成填充所述互连结构之间的区域的液态硅源材料层; 进行第一退火处理，固化液态硅源材料层，形成非晶硅层; 并使非晶硅层结晶并形成接触塞。

公开(公告)号：US20240172416A1

公开(公告)日：2024-05-23

申请号：US18240512

申请日：2023-08-31

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Jonghyeok KIM ,  Kang In KIM ,  Kyuwan KIM ,  Min-Cheol KIM ,  Youngseok KIM ,  Taewoong OH

IPC: H10B12/00

CPC classification number: H10B12/315 ,  H10B12/482 ,  H10B12/485 ,  H10B12/488

Abstract: A semiconductor device includes a substrate having a substrate groove extending in a first direction, a gate insulating layer conformally covering an inner wall of the substrate groove, a metal-containing pattern on the gate insulating layer and filling a lower portion of the substrate groove, a silicon pattern on the metal-containing pattern in the substrate groove, and a word line capping pattern on the silicon pattern in the substrate groove, wherein the silicon pattern includes a first silicon pattern covering an upper surface of the metal-containing pattern and a sidewall of the gate insulating layer and having a pattern groove formed thereon and a second silicon pattern filling the pattern groove, the first silicon pattern having a first impurity concentration, and the second silicon pattern having a second impurity concentration less than the first impurity concentration.

公开(公告)号：US20230385203A1

公开(公告)日：2023-11-30

申请号：US18101352

申请日：2023-01-25

Applicant: SAMSUNG ELECTRONICS CO., LTD.

Inventor： Youngseok KIM ,  Junbeom JANG ,  Seongmin JO

IPC: G06F12/1027 ,  G06F12/1009

CPC classification number: G06F12/1027 ,  G06F12/1009

Abstract: Disclosed is an input output memory management unit (IOMMU) including a first memory device including a translation lookaside buffer (TLB), a second memory device including a translation group table, a plurality of translation request controllers, each of which is configured to perform an address translation operation, and an allocation controller. The allocation controller may be configured to receive a first request including a first page table identifier (ID), a first virtual page number, and a first page offset, looks up the TLB by using the first page table ID and the first virtual page number, look up the translation group table by using the first page table ID and the first virtual page number when a TLB miss for the first request occurs, and allocate a first translation request controller among the plurality of translation request controllers based on a translation group table miss for the first request.

公开(公告)号：US20220179793A1

公开(公告)日：2022-06-09

申请号：US17374076

申请日：2021-07-13

Applicant: Samsung Electronics Co., Ltd.

Inventor： Seongmin JO ,  Youngseok KIM ,  Chunghwan YOU ,  Wooil KIM

IPC: G06F12/0862 ,  G06F12/10

Abstract: An operating method of a system-on-chip includes outputting a prefetch command in response to an update of mapping information on a first read target address, the update occurring in a first translation lookaside buffer storing first mapping information of a second address with respect to a first address, and storing, in response to the prefetch command, in a second translation lookaside buffer, second mapping information of a third address with respect to at least some second addresses of an address block including a second read target address.

公开(公告)号：US20210203382A1

公开(公告)日：2021-07-01

申请号：US16991666

申请日：2020-08-12

Applicant: Samsung Electronics Co., Ltd.

Inventor： Youngseok KIM ,  Sanghyo LEE

IPC: H04B5/00

Abstract: A near field communication (NFC) device includes a resonator including an antenna and a matching circuit, a transmitter and a frequency detector. The transmitter generates a sensing voltage signal at the resonator. With respect to a plurality of measurement periods where each measurement period includes a turn-on period and a turn-off period, the transmitter is enabled to output a radio frequency (RF) signal to the resonator during the turn-on period and disabled during the turn-off period. The frequency detector detects a resonance frequency of the resonator based on the sensing voltage signal. The resonance frequency is accurately detected by measuring the resonance frequency during the plurality of measurement periods. In addition, the resonance frequency is efficiently detected by generating the sensing voltage signal using the transmitter established in the NFC device.

公开(公告)号：US20190208638A1

公开(公告)日：2019-07-04

申请号：US16206029

申请日：2018-11-30

Applicant: Samsung Electronics Co., Ltd.

Inventor： Hwajoong JUNG ,  Manho KIM ,  Youngseok KIM ,  Hyungjin RHO ,  Chiyoung PARK ,  Taeyun KIM ,  Yonghwan CHOI ,  Kihuk LEE

IPC: H05K1/18 ,  H05K1/11 ,  G02B7/02

CPC classification number: H05K1/181 ,  G02B7/021 ,  G02B7/09 ,  G02B27/646 ,  G03B5/00 ,  G03B13/36 ,  G03B2205/0007 ,  H05K1/111 ,  H05K2201/0314 ,  H05K2201/10121 ,  H05K2201/10151

Abstract: A camera module is provided. The camera includes a circuit board to which an image sensor disposed is disposed, one or more first conductive portions at one or more regions of the circuit board, one or more elastic connectors, including an elastic member and a metal film surrounding at least part of an outer portion of the elastic member, the elastic connector is disposed on the first conductive region, a lens device including one or more lenses and a driver capable of moving the lens device, a housing which accommodates the lens device, and a second conductive portion in one or more regions of the housing. The housing may be disposed above the elastic connector such that the second conductive portion is electrically coupled to the first conductive portion due to a contact with the elastic connector.

公开(公告)号：US20160242289A1

公开(公告)日：2016-08-18

申请号：US15016945

申请日：2016-02-05

Applicant: Samsung Electronics Co., Ltd.

Inventor： Manho KIM ,  Hwajoong JUNG ,  Youngseok KIM ,  Youngkwon YOON ,  Kihuk LEE ,  Yonghwan CHOI ,  Sunhyoung PYO

IPC: H05K1/18 ,  H05K3/34

CPC classification number: H04M1/0277 ,  H04M1/0202 ,  H05K1/0271 ,  H05K1/0274 ,  H05K1/182 ,  H05K1/183 ,  H05K3/301 ,  H05K3/341 ,  H05K2201/1028 ,  H05K2201/2009 ,  H05K2203/0465

Abstract: An electronic device that includes a circuit board which is arranged between a front cover and a back cover, and includes a conductive pattern inserted into the circuit board. A signal generation or power supply element is electrically connected with the conductive pattern. An adhesion layer is attached onto the circuit board and overlaps at least part of the conductive pattern when viewed from above the circuit board. A first structure is arranged on the adhesion layer and overlaps at least part of the adhesion layer when viewed from above the circuit board. A second structure is arranged on a top of the first structure, overlaps at least part of the first structure when viewed from above the circuit board, and the second structure includes a bottom surface including metal. A metal layer is inserted between the first structure and the bottom surface of the second structure to attach the second structure to the first structure.

Abstract translation: 一种电子设备，包括布置在前盖和后盖之间的电路板，并且包括插入到电路板中的导电图案。 信号产生或电源元件与导电图案电连接。 当从电路板上方观察时，粘合层附着在电路板上并与导电图案的至少一部分重叠。 当从电路板上方观察时，第一结构布置在粘合层上并与粘合层的至少一部分重叠。 第二结构设置在第一结构的顶部，当从电路板上方观察时，与第一结构的至少一部分重叠，并且第二结构包括包括金属的底表面。 金属层插入在第一结构和第二结构的底表面之间，以将第二结构附接到第一结构。