公开(公告)号：US20140051243A1

公开(公告)日：2014-02-20

申请号：US14064467

申请日：2013-10-28

Applicant: Samsung Electronics Co., Ltd.

Inventor： Han-shin YOUN ,  Yonghwan KWON ,  YoungHoon RO ,  Woojae KIM ,  Sungwoo PARK

IPC: H01L23/00

CPC classification number: H01L24/03 ,  H01L21/563 ,  H01L23/49816 ,  H01L23/49838 ,  H01L24/16 ,  H01L24/48 ,  H01L25/105 ,  H01L25/16 ,  H01L2224/0401 ,  H01L2224/16225 ,  H01L2224/16235 ,  H01L2224/16237 ,  H01L2224/32225 ,  H01L2224/48227 ,  H01L2224/50 ,  H01L2224/73204 ,  H01L2225/1023 ,  H01L2225/1052 ,  H01L2225/1058 ,  H01L2225/1082 ,  H01L2924/00014 ,  H01L2924/14 ,  H01L2924/15311 ,  H01L2924/15331 ,  H01L2924/181 ,  H01L2924/00 ,  H01L2224/45099 ,  H01L2224/45015 ,  H01L2924/207

Abstract: An example embodiment relates to a semiconductor package. The semiconductor package includes a first substrate including a first pad, a second substrate upwardly spaced apart from the first substrate and including a second pad opposite to the first pad. At least one electrode is coupled between the first pad and the second pad. The semiconductor package includes a guide ring formed at a periphery of the electrode between the first substrate and the second substrate.

Abstract translation: 示例性实施例涉及半导体封装。 半导体封装包括第一衬底，其包括第一焊盘，与第一衬底向上间隔开的第二衬底，并且包括与第一焊盘相对的第二焊盘。 至少一个电极耦合在第一焊盘和第二焊盘之间。 半导体封装包括形成在第一基板和第二基板之间的电极的周边处的引导环。

公开(公告)号：US20160322296A1

公开(公告)日：2016-11-03

申请号：US15210108

申请日：2016-07-14

Applicant: Samsung Electronics Co., Ltd.

Inventor： YoungHoon RO ,  Seung Hwan KIM ,  Jung-Ho PARK

IPC: H01L23/498 ,  H01L21/48 ,  H01L21/56 ,  H01L23/31

CPC classification number: H01L23/49855 ,  H01L21/4853 ,  H01L21/486 ,  H01L21/565 ,  H01L23/3114 ,  H01L23/481 ,  H01L23/49811 ,  H01L23/49827 ,  H01L23/49894 ,  H01L2224/131 ,  H01L2224/16238 ,  H01L2224/45144 ,  H01L2224/48228 ,  H01L2924/014 ,  H01L2924/00

Abstract: Package substrates, semiconductor packages including the package substrates, and methods for fabricating the semiconductor packages are provided. A package substrate may include a core including a first surface on which a semiconductor chip is disposed and a second surface opposite the first surface. The package substrate may also include a metal pad on the second surface of the core. The metal pad may include a saline water corrosion resistant surface.

Abstract translation: 提供包装衬底，包括封装衬底的半导体封装以及用于制造半导体封装的方法。 封装基板可以包括芯，芯包括设置有半导体芯片的第一表面和与第一表面相对的第二表面。 封装衬底还可以包括在芯的第二表面上的金属焊盘。 金属垫可以包括盐水耐腐蚀表面。