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公开(公告)号：US11715729B2
公开(公告)日：2023-08-01
申请号：US17244471
申请日：2021-04-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yoonsuk Lee , Eunhye Kim , Sangmoo Park , Dongyeob Lee
CPC classification number: H01L25/167 , H01L24/26 , H01L24/32 , H01L24/83 , H01L24/05 , H01L24/29 , H01L33/40 , H01L2224/05639 , H01L2224/05644 , H01L2224/05647 , H01L2224/05655 , H01L2224/08501 , H01L2224/26145 , H01L2224/29105 , H01L2224/29109 , H01L2224/29111 , H01L2224/29113 , H01L2224/29118 , H01L2224/29124 , H01L2224/29139 , H01L2224/29147 , H01L2224/29155 , H01L2224/29386 , H01L2224/29393 , H01L2224/32145 , H01L2224/32501 , H01L2224/83203
Abstract: A display module and a method for manufacturing thereof are provided. The display module includes a glass substrate; a thin film transistor (TFT) layer provided on a surface of the glass substrate, the TFT layer including a plurality of TFT electrode pads; a plurality of light emitting diodes (LEDs) provided on the TFT layer, each of the plurality of LEDs including LED electrode pads that are electrically connected to respective TFT electrode pads among the plurality of TFT electrode pads; and a light shielding member provided on the TFT layer and between the plurality of LEDs, wherein a height of the light shielding member with respect to the TFT layer is lower than a height of the plurality of LEDs with respect to the TFT layer.
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公开(公告)号：US11264531B2
公开(公告)日：2022-03-01
申请号：US16688577
申请日：2019-11-19
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sangmoo Park , Doyoung Kwag , Eunhye Kim , Minsub Oh , Yoonsuk Lee
IPC: H01L21/683 , H01L33/00 , H01L21/66 , H01L25/075 , B81C1/00
Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a plurality of LEDs arranged on a first substrate to a relay substrate; a memory configured to store characteristic information of each of the plurality of LEDs; and a processor configured to determine arrangement locations of each of the plurality of LEDs on the relay substrate based on the stored characteristic information, and control the transfer part to transfer the plurality of LEDs to the determined arrangement locations.
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公开(公告)号：US12009452B2
公开(公告)日：2024-06-11
申请号：US17258061
申请日：2019-07-23
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Doyoung Kwag , Byungchul Kim , Minsub Oh , Sangmoo Park , Eunhye Kim , Yoonsuk Lee
CPC classification number: H01L33/005 , H01L27/156
Abstract: An electronic device is disclosed. The electronic device comprises: a transfer device capable of moving, to a target substrate, a plurality of LEDs arranged in a transfer substrate, and arranging same; a storage unit in which feature information of each of the plurality of LEDs is stored; and a processor for controlling the transfer device such that each of a plurality of LEDs is arranged in an arrangement location on the target substrate of each of a plurality of LEDs on the basis of the stored feature information.
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公开(公告)号：US11587974B2
公开(公告)日：2023-02-21
申请号：US16861728
申请日：2020-04-29
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Byungchul Kim , Doyoung Kwag , Eunhye Kim , Sangmoo Park , Minsub Oh , Dongyeob Lee , Yoonsuk Lee
Abstract: A micro light emitting diode (LED) transferring method includes setting a micro LED transfer substrate and a target substrate to initial positions and transferring a plurality of micro LEDs arranged in a partial region of the micro LED transfer substrate to the target substrate. Once the micro LEDs in the partial region are transferred to the target substrate, the micro LED transfer substrate is rotated and a plurality of micro LEDs, arranged in a remaining region of the micro LED transfer substrate, are then transferred to the target substrate.
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公开(公告)号：US11004705B2
公开(公告)日：2021-05-11
申请号：US16282581
申请日：2019-02-22
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Doyoung Kwag , Sangmoo Park , Yoonsuk Lee
IPC: H01L25/075 , H01L21/67 , H01L21/687 , H01L33/62
Abstract: A chip transfer device is provided. The chip transfer device according to an embodiment includes a support, a plurality of pick-up modules disposed on the support in a horizontal direction, and movably connected to the support, and a controller configured to control the plurality of pick-up modules, wherein each of the plurality of pick-up modules is movable while collectively picking up a plurality of chips on a corresponding wafer among a plurality of wafers, and wherein the controller moves and adjusts the plurality of pick-up modules in a horizontal direction.
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Patent Agency Ranking
公开(公告)号：US20240088329A1
公开(公告)日：2024-03-14
申请号：US17941695
申请日：2022-09-09
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Eunhye KIM , Sangmoo Park , Dongyeob Lee , Yoonsuk Lee
IPC: H01L33/40 , H01L25/075 , H01L33/62
CPC classification number: H01L33/40 , H01L25/0753 , H01L33/62
Abstract: A display module includes a thin film transistor (TFT) substrate including a glass substrate, a TFT layer provided at a front surface of the glass substrate and comprising a TFT electrode pad, and a driving circuit provided at a rear surface of the glass substrate and configured to drive the TFT layer, at least one light-emitting diode (LED) comprising at least one LED electrode pad, and a junction structure provided between the at least one LED electrode pad and the TFT electrode pad. The junction structure is formed in a metallically bonded state.
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公开(公告)号：US11695092B2
公开(公告)日：2023-07-04
申请号：US17674520
申请日：2022-02-17
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Yoonsuk Lee , Sangmoo Park , Doyoung Kwag , Byungchul Kim , Eunhye Kim , Minsub Oh , Dongyeob Lee
CPC classification number: H01L33/0095 , H01L33/62
Abstract: A micro light emitting diode (LED) transfer device includes a transfer part configured to transfer a relay substrate having at least one micro LED; a mask having openings corresponding to a position of the at least one micro LED; a first laser configured to irradiate a first laser light having a first wavelength to the mask; a second laser configured to irradiate a second laser light having a second wavelength different from the first wavelength to the mask; and a processor configured to: control the at least one micro LED to contact a coupling layer of a target substrate, and based on the coupling layer contacting the at least one micro LED, control the first laser to irradiate the first laser light toward the at least one micro LED, and subsequently control the second laser to irradiate the second laser light toward the at least one micro LED.
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公开(公告)号：US11387384B2
公开(公告)日：2022-07-12
申请号：US16850645
申请日：2020-04-16
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Sangmoo Park , Minsub Oh , Doyoung Kwag , Byungchul Kim , Eunhye Kim , Dongyeob Lee , Yoonsuk Lee
IPC: H01L33/00 , H01L33/24 , H01L25/075
Abstract: A light-emitting diode (LED) transferring method is provided. The LED transferring method includes disposing a transfer substrate, on which a plurality of LEDs of different colors are sequentially arranged in at least one row or at least one column, between a target substrate and a laser oscillator, and simultaneously transferring the plurality of LEDs from the transfer substrate to predetermined points of the target substrate by radiating a laser beam toward the target substrate from the laser oscillator.
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公开(公告)号：US11251222B2
公开(公告)日：2022-02-15
申请号：US16426846
申请日：2019-05-30
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Doyoung Kwag , Eunhye Kim , Sangmoo Park , Minsub Oh , Yoonsuk Lee
Abstract: An electronic apparatus is provided. The electronic apparatus includes a substrate including a plurality of electrodes in contact with at least part of electrodes of a plurality of micro LEDs disposed on a transparent substrate at a first pitch to apply a current to micro LEDs of the plurality of micro LEDs disposed at a second pitch, a camera disposed opposite to the substrate based on the transparent substrate, and a processor configured to apply a current to the plurality of electrodes on the substrate, control the camera to capture an image of the plurality of LEDs including a light emitting micro LED according to current applying, obtain characteristic information of the light emitting micro LED based on the captured image, and determine a target substrate on which each of the plurality of micro LEDs is disposed based on the obtained characteristic information.
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公开(公告)号：US11063174B2
公开(公告)日：2021-07-13
申请号：US16653449
申请日：2019-10-15
Applicant: SAMSUNG ELECTRONICS CO., LTD.
Inventor： Doyoung Kwag , Masaru Wada , Jamyeong Koo , Eunhye Kim , Sangmoo Park , Seona Yang , Minsub Oh , Yoonsuk Lee , Youngkyong Jo
Abstract: A light emitting diode (LED) includes: a device substrate; a first semiconductor layer above the device substrate, and doped with an n-type dopant; a second semiconductor layer above the first semiconductor layer, and doped with a p-type dopant; an active layer between the first semiconductor layer and the second semiconductor layer and configured to provide light; a transparent electrode layer adjacent to an upper part of the second semiconductor layer; and a first electrode pad and a second electrode pad between the device substrate and the first semiconductor layer, the first electrode pad electronically connected with the first semiconductor layer and the second electrode pad electrically connected with the second semiconductor layer, wherein light provided by the active layer is irradiated to an outside in a direction from the active layer to the second semiconductor layer.
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