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公开(公告)号：US12171065B2
公开(公告)日：2024-12-17
申请号：US18456153
申请日：2023-08-25
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangwon Ha , Subyung Kang , Sanghoon Park , Soohyun Seo , Yongjin Woo , Yeomoon Yoon
Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.
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Patent Agency Ranking
公开(公告)号：US11744017B2
公开(公告)日：2023-08-29
申请号：US16868941
申请日：2020-05-07
Applicant: Samsung Electronics Co., Ltd.
Inventor： Sangwon Ha , Subyung Kang , Sanghoon Park , Soohyun Seo , Yongjin Woo , Yeomoon Yoon
CPC classification number: H05K1/145 , H05K1/144 , H01L2023/4087 , H05K1/111 , H05K1/117
Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in an internal space of the housing and including first conductive terminals, and a second printed circuit board disposed parallel to the first printed circuit board in the internal space and including second conductive terminals electrically connected to the first conductive terminals. The second printed circuit board includes at least some conductive terminals of the second conductive terminals, or at least one connection failure prevention structure disposed around at least some conductive terminals of the second conductive terminals.
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公开(公告)号：US12150266B2
公开(公告)日：2024-11-19
申请号：US17893739
申请日：2022-08-23
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghoon Park , Seungbo Shim , Yongjin Woo , Junhee Han , Dongil Son
Abstract: An electronic device is provided. The electronic device includes a housing, a first printed circuit board disposed in the inner space of the housing, a second printed circuit board disposed so as to overlap at least a portion of the first printed circuit board, when the first printed circuit board is viewed from above, a first interposer disposed between the first printed circuit board and the second printed circuit board, and electrically connecting the first printed circuit board and the second printed circuit board, and at least one second interposer which is disposed between the first printed circuit board and the second printed circuit board so as to be spaced apart from the first interposer when the first printed circuit board is viewed from above, and which electrically connects the first printed circuit board and the second printed circuit board.
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公开(公告)号：US11516917B2
公开(公告)日：2022-11-29
申请号：US17172351
申请日：2021-02-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghoon Park , Younggirl Yun , Sunggeun Kang , Myungsub Ko , Jaeyeon Ra , Seungbo Shim , Yongjin Woo , Junhee Han
Abstract: An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.
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公开(公告)号：US20210251079A1
公开(公告)日：2021-08-12
申请号：US17172351
申请日：2021-02-10
Applicant: Samsung Electronics Co., Ltd.
Inventor： Junghoon PARK , Younggirl Yun , Sunggeun Kang , Myungsub Ko , Jaeyeon Ra , Seungbo Shim , Yongjin Woo , Junhee Han
Abstract: An electronic device includes a processor and a printed circuit board on which the processor is mounted. The printed circuit board includes a first circuit board, a first interposer formed on a first portion of the first circuit board, a second interposer formed on a second portion of the first circuit board that is adjacent to the first portion, a second circuit board coupled to the first interposer, and a third circuit board coupled to the second interposer.
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公开(公告)号：US11089681B2
公开(公告)日：2021-08-10
申请号：US16930589
申请日：2020-07-16
Applicant: Samsung Electronics Co., Ltd.
Inventor： Wooyoung Jeong , Yongjin Woo , Dongjun Kim , Sungchang Jang
Abstract: According to an embodiment, an interposer structure comprises a top surface, a bottom surface facing away from the top surface; an inner sidewall extending from the top surface to the bottom surface, and forming an inner space accommodating one or more electronic components mounted on a circuit board of an electronic device; and an outer sidewall extending from the top surface to the bottom surface, and facing away from the inner sidewall, wherein the outer sidewall includes: a first area having a conductive member formed from the top surface to the bottom surface; and a second area having a conductive member formed from the top surface to a first position and a non-conductive member formed from the first position to the bottom surface.
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