公开(公告)号：US20170110388A1

公开(公告)日：2017-04-20

申请号：US15290899

申请日：2016-10-11

Applicant: Samsung Electronics Co., Ltd.

Inventor： Sang Cheon PARK ,  Won Il LEE ,  Chajea JO ,  Taeje CHO

IPC: H01L23/48 ,  H01L23/522 ,  H01L23/13 ,  H01L23/00 ,  H01L25/065 ,  H01L23/528 ,  H01L23/532

CPC classification number: H01L23/481 ,  H01L23/13 ,  H01L23/5226 ,  H01L23/528 ,  H01L23/53228 ,  H01L24/03 ,  H01L24/05 ,  H01L25/0657 ,  H01L2224/0346 ,  H01L2224/0401 ,  H01L2224/05025 ,  H01L2224/05147 ,  H01L2224/05556 ,  H01L2224/05559 ,  H01L2224/05568 ,  H01L2224/0557 ,  H01L2224/05571 ,  H01L2224/05647 ,  H01L2224/06181 ,  H01L2224/13023 ,  H01L2224/131 ,  H01L2224/13109 ,  H01L2224/13111 ,  H01L2224/13113 ,  H01L2224/13117 ,  H01L2224/1312 ,  H01L2224/13139 ,  H01L2224/13147 ,  H01L2224/13155 ,  H01L2224/16145 ,  H01L2224/16146 ,  H01L2224/16227 ,  H01L2224/16238 ,  H01L2225/06513 ,  H01L2225/06517 ,  H01L2225/06541 ,  H01L2225/06544 ,  H01L2225/06565 ,  H01L2924/01058 ,  H01L2924/15311 ,  H01L2924/00014 ,  H01L2924/00012 ,  H01L2924/014

Abstract: A semiconductor device includes a semiconductor chip having an active surface and a non-active surface opposite to the active surface, an upper insulating layer provided on the non-active surface of semiconductor chip, and a via and a connection pad penetrating the semiconductor chip and the upper insulating layer, respectively. The connection pad has a first surface exposed outside the upper insulating layer and a second surface opposite to the first surface and facing the semiconductor chip. The first surface of the connection pad is coplanar with an upper surface of the upper insulating layer.